Abstract: According to one embodiment, a composite substrate includes a soft layer, a hard layer, a rigid portion and a flexible portion. The soft layer includes a first conductor layer with a conductor pattern and a first flexible insulating layer. The hard layer includes a second conductor layer with a conductor pattern and a second rigid insulating layer. The rigid portion is formed by laminating the soft layer and the hard layer. The flexible portion includes a transition portion which is in proximity to the rigid portion by extending the soft layer and is wider than an interconnect portion.

Abstract: According to one embodiment, an electronic device includes a component, a connector, a flexible printed circuit board and a tab. The component includes a first face, a second face, and an edge. The connector is configured to face the first face. The flexible printed circuit board includes a first portion configured to face the second face, a second portion configured to face the first face, a bent third portion between the first portion and the second portion and configured to face the edge, and a terminal provided to the second portion and configured to be connected to the connector. The tab includes an attachment portion and an extension portion. The extension portion is configured to be attached to the flexible printed circuit board. The extension portion extends from the attachment portion toward the terminal along the flexible printed circuit board.

Abstract: According to one embodiment, there is provided a printed circuit board including a plurality of electrode pads provided on a component mounting face on which a semiconductor component is to be mounted, a plurality of hole terminals provided on the component mounting face so as to correspond to the electrode pads, and a plurality of wiring pattern layers connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring pattern layers being wired across directions of elastic deformation of the component mounting face.

Abstract: According to one embodiment, there is provided a printed circuit board including a plurality of electrode pads provided on a component mounting face on which a semiconductor component is to be mounted, a plurality of hole terminals provided on the component mounting face so as to correspond to the electrode pads, and a plurality of wiring pattern layers connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring pattern layers being wired across directions of elastic deformation of the component mounting face.

Abstract: A printed wiring board mounted with a BGA package including pads, through holes and leads. The leads are linearly formed with almost the same width as the diameter of each of the pads and through holes and thus have high bonding strength against their peeling against an external force. The pads are provided at an angle of approximately 45 degrees outwardly relative to the through holes and along almost in the direction of application of thermal stress, and thus have high durability against their peeling due to an external force.

Abstract: According to one embodiment, a circuit board unit includes: a circuit board; and an electronic component that is surface-mounted on the circuit board. The electronic component includes a first electrode at one end and a second electrode at another end of the electronic component. The circuit board includes a plurality of penetrating holes penetrating through the circuit board at a position close to the first electrode and at a position close to the second electrode. The penetrating holes are arranged substantially symmetrically with respect to the electronic component.

Abstract: A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad portions which are provided in positions opposite to a plurality of signal terminals of a connector component arranged in a predetermined form and perform electrical connection, reinforcing portions which are provided to extend from the pad portions respectively in a lengthwise direction, and land portions to perform the electrical connection to another layer of the conducting layers, and a solder resist provided on the outermost layer of the conducting layers to cover the reinforcing portion and having an opening portion to expose the pad portion.

Abstract: A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad portions which are provided in positions opposite to a plurality of signal terminals of a connector component arranged in a predetermined form and perform electrical connection, reinforcing portions which are provided to extend from the pad portions respectively in a lengthwise direction, and land portions to perform the electrical connection to another layer of the conducting layers, and a solder resist provided on the outermost layer of the conducting layers to cover the reinforcing portion and having an opening portion to expose the pad portion.

Abstract: A printed wiring board mounted with a BGA package including pads, through holes and leads. The leads are linearly formed with almost the same width as the diameter of each of the pads and through holes and thus have high bonding strength against their peeling against an external force. The pads are provided at an angle of approximately 45 degrees outwardly relative to the through holes and along almost in the direction of application of thermal stress, and thus have high durability against their peeling due to an external force.

Abstract: A main body case encasing a keyboard and an upper case encasing an integrated display/input device are coupled by first and second hinge units and a junction base (with a cylindrical element defining a linear groove there through) to be arbitrarily pivotal from a state wherein the keyboard faces the integrated display/input device to a state wherein the back surface of the integrated display/input device faces the keyboard. Depending on the position of the integrated display/input device, a mode designation means designates one of first and second modes, the first mode being a mode in which the integrated display/input device performs an operation in an ordinary manner, the second mode being a mode in which the integrated display/input device performs an operation in a manner reversed 180.degree. with reference to the coordinate system in the first mode.

Abstract: A main body case for storing a keyboard and an upper case for storing an integrated display/input device are coupled by first and second hinge units, disposed through a groove in the main body case, to be arbitrarily pivotal from a state wherein the keyboard faces the integrated display/input device to a state wherein the back surfaces of the keyboard and the integrated display/input device face each other.

Abstract: A main body case for storing a keyboard and an upper case for storing an integrated display/input device are coupled by two hinge units arranged perpendicularly to one another to be arbitrarily pivotal from a state wherein the keyboard faces the integrated display/input device to a state wherein the back surfaces of the keyboard and the integrated display/input device face each other.

Abstract: A main body case for storing a keyboard and an upper case for storing an integrated display/input device are coupled by hinge units to be arbitrarily pivotal from a state wherein the keyboard faces the integrated display/input device to a state wherein the back surfaces of the keyboard and the integrated display/input device face each other.