Abstract: An organic EL device manufacturing method includes a step of supplying a substrate, and while moving the substrate with a non-electrode-layer side thereof in contact with a surface of a can roller, the non-electrode-layer provided with no electrode layer, discharging a material from a nozzle of a vapor deposition source to form an organic layer on an electrode-layer side of the substrate, the electrode-layer side provided with an electrode layer. The vapor deposition step includes supplying a shadow mask including an opening portion to interpose the shadow mask between the substrate contacting the can roller, and the nozzle; and forming the organic layer corresponding to the opening portion on the electrode-layer side of the substrate while moving the substrate and the shadow mask with through holes included at each of the substrate and the shadow mask engaged with projections included in the can roller.

Abstract: A method is provided for producing an organic EL element having excellent electric properties in a relatively low cost. The method includes the steps of using a vapor deposition apparatus 7 including a first vapor deposition source 721 including a first organic layer forming material and a second vapor deposition source 722 including a second organic layer forming material; forming a first organic layer on a surface to be processed of a substrate 73 by colliding the first organic layer forming material vaporized from the first vapor deposition source 721 with the surface to be processed of the substrate 73; and thereafter, forming a mixed layer by colliding the vaporized second organic layer forming material from the second vapor deposition source 722 with the first organic layer in a migration state of the first organic layer forming material.

Abstract: A CIGS film production method is provided which ensures that a CIGS film having a higher conversion efficiency can be produced at lower costs at higher reproducibility even for production of a large-area device. A CIGS solar cell production method is also provided for producing a CIGS solar cell including the CIGS film. The CIGS film production method includes: a stacking step of stacking a layer (A) containing indium, gallium and selenium and a layer (B) containing copper and selenium in a solid phase in this order over a substrate; and a heating step of heating a stacked structure including the layer (A) and the layer (B) to melt a compound of copper and selenium of the layer (B) into a liquid phase to thereby diffuse copper from the layer (B) into the layer (A) to permit crystal growth to provide a CIGS film.

Abstract: A method for producing a solar battery cell which hardly causes an electric short circuit at the cut end surface of a solar battery element is provided. A method for producing a solar battery cell in which a solar battery cell is obtained from an elongated solar battery element including an elongated flexible base material, a first electrode layer, a light absorbing layer, and a second electrode layer in this order, and the method includes a partial removal step of forming one or more partial removal portion each extending like a belt at a plurality of parts in the surface of the solar battery element by partially removing layers of the second electrode layer through to the light absorbing layer or the second electrode layer through to the first electrode layer, and a cutting step of cutting the solar battery element at the partial removal portion.

Abstract: An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.

Abstract: Provided is a method for manufacturing an organic EL device, including: a vapor deposition step of forming an organic layer over a substrate moving relative to a nozzle by discharging a vaporized organic layer-forming material through the nozzle. The vapor deposition step is performed so that a light emitting region formed of the organic layer and having a width A (mm) in a direction perpendicular to a direction in which the substrate is moving is formed, and so that W?A+2×h (where h?5 mm) is satisfied, where a length of an opening of the nozzle in the direction perpendicular to the direction in which the substrate is moving is denoted by W (mm), and a distance between the opening and the substrate is denoted by h (mm).

Abstract: An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.

Abstract: A surface light emitter according to an embodiment of the present invention, includes: a base material; a plurality of ribbon-shaped organic electroluminescent elements provided side by side on the base material; and a lenticular sheet that is attached to the base material and the ribbon-shaped organic electroluminescent elements through an adhesion layer, and that has a plurality of convex cylindrical lenses provided side by side. A direction in which the convex cylindrical lenses extend and a direction in which the ribbon-shaped organic electroluminescent elements extend are substantially parallel to each other.

Abstract: An organic EL device manufacturing method includes a vapor deposition step of supplying a substrate, and while moving the substrate with a side thereof, on which an electrode layer is not provided, in contact with a surface of a can roller that rotates, discharging an evaporated organic layer forming material from a nozzle of a vapor deposition source to form an organic layer over a side of the substrate on which the electrode layer is provided, wherein the vapor deposition step is performed while, using a distance measuring section capable of measuring a first distance to the substrate supported by the can roller, and a position adjusting section capable of adjusting a second distance between the nozzle of the vapor deposition source and a surface of the substrate, control is performed by the position adjusting section so that the second distance is constant.

Abstract: In order to provide an organic electroluminescent light-emitting device with less uneven brightness, which can be manufactured at low cost, a plurality of ribbon-like organic electroluminescent elements are connected to wires, which are connected to electrode terminals for energization at specific locations in a terminal region and mounted on a base material which has a substantially plate-like shape.

Abstract: A method for manufacturing an organic EL device, including: while supplying a strip-shaped substrate, forming an organic EL film on the substrate by successively vapor depositing at least an organic layer including a light-emitting layer and an electrode layer on one side of the substrate; and successively winding up the substrate on which the organic EL film is formed by the vapor deposition, wherein the substrate is wound up along with a strip-shaped protective film that is softer than the substrate while supplying the protective film and adhering the protective film to a non-vapor deposition side of the substrate.

Abstract: A conductor layer 2 is formed as a circuit pattern on a base insulating layer 1, a terminal 3 is formed thereon, and a supporting column 4 is formed in the vicinity of the terminal on the upper face of the base insulating layer 1. Here, supposing the protrusion height B of the bump from the element to be connected is B, the height of the supporting column is H, the height of the terminal is h, and the layer thickness of the terminal is t, as measured from the upper face of the base insulating layer as the reference surface, the height H of the supporting column is determined to satisfy B<H<h+B wherein t<B, or h<H<h+B wherein t?B. As a result, the supporting column functions as a spacer to suppress compression that causes the solder of the terminal to reach the electrode of the element.

Abstract: An organic EL device manufacturing method includes a step of supplying a substrate, and while moving the substrate with a non-electrode-layer side thereof in contact with a surface of a can roller, the non-electrode-layer provided with no electrode layer, discharging a material from a nozzle of a vapor deposition source to form an organic layer on an electrode-layer side of the substrate, the electrode-layer side provided with an electrode layer. The vapor deposition step includes supplying a shadow mask including an opening portion to interpose the shadow mask between the substrate contacting the can roller, and the nozzle; and forming the organic layer corresponding to the opening portion on the electrode-layer side of the substrate while moving the substrate and the shadow mask with through holes included at each of the substrate and the shadow mask engaged with projections included in the can roller.

Abstract: A wiring circuit layer 2 having at least a wiring part and an insulating part, whose top and bottom surfaces (20A, 20B) is adhesive surfaces, is formed on a metal support substrate 1 in a way such that the layer 2 can be peeled from the substrate 1. Exposed in the first adhesive surface 20A of the wiring circuit layer 2 is a first connecting conductor part 21, which is connectable with an electrode 31 of a first semiconductor element 3 in a wafer state. After the wiring circuit layer 2 is laminated on and connected to the element 3, the metal support substrate 1 is peeled from the wiring circuit layer 2 to yield a semiconductor device 4. Another element may be connected to the other adhesive surface 20B exposed upon the peeling.

Abstract: A wiring circuit layer 2 having a connecting conductor part 21 that can be connected to an electrode 31 of a semiconductor element 3 is formed on a metal support substrate 1 in a way such that the wiring circuit layer can be separated from the substrate 1, and that the connecting conductor part 21 is exposed on the upper face of the wiring circuit layer. The wiring circuit layer 2 is laminated on the element 3 while in a wafer state, and the connecting conductor part 21 and the electrode 31 are connected. Subsequently, the support substrate 1 is peeled from the wiring circuit layer 2, and the wafer is diced, whereby individual semiconductor devices are obtained.

Abstract: A conductor layer 2 is formed as a circuit pattern on a base insulating layer 1, a terminal 3 is formed thereon, and a supporting column 4 is formed in the vicinity of the terminal on the upper face of the base insulating layer 1. Here, supposing the protrusion height B of the bump from the element to be connected is B, the height of the supporting column is H, the height of the terminal is h, and the layer thickness of the to terminal is t, as measured from the upper face of the base insulating layer as the reference surface, the height H of the supporting column is determined to satisfy B<H<h+B wherein t<B, or h<H<h+B wherein t?B. As a result, the supporting column functions as a spacer to suppress compression that causes the solder of the terminal to reach the electrode of the element.

Abstract: A wiring circuit layer 2 having at least a wiring part and an insulating part, whose top and bottom surfaces (20A, 20B) is adhesive surfaces, is formed on a metal support substrate 1 in a way such that the layer 2 can be peeled from the substrate 1. Exposed in the first adhesive surface 20A of the wiring circuit layer 2 is a first connecting conductor part 21, which is connectable with an electrode 31 of a first semiconductor element 3 in a wafer state. After the wiring circuit layer 2 is laminated on and connected to the element 3, the metal support substrate 1 is peeled from the wiring circuit layer 2 to yield a semiconductor device 4. Another element may be connected to the other adhesive surface 20B exposed upon the peeling.

Abstract: A wiring circuit layer 2 having a connecting conductor part 21 that can be connected to an electrode 31 of a semiconductor element 3 is formed on a metal support substrate 1 in a way such that the wiring circuit layer can be separated from the substrate 1, and that the connecting conductor part 21 is exposed on the upper face of the wiring circuit layer. The wiring circuit layer 2 is laminated on the element 3 while in a wafer state, and the connecting conductor part 21 and the electrode 31 are connected. Subsequently, the support substrate 1 is peeled from the wiring circuit layer 2, and the wafer is diced, whereby individual semiconductor devices are obtained.

Abstract: First, a catalyst for performing electroless plating in a subsequent step is caused to adhere to surfaces of uneven portions of a matrix. Next, an insulating layer made of a resin material is prepared. Then, the insulating layer is heated to be softened while the uneven portions of the matrix are pressed against one surface of the insulating layer. Thus, grooves corresponding to shapes of the uneven portions of the matrix are formed in the insulating layer while the catalyst is transferred to bottom surfaces and side surfaces of the grooves. The insulating layer is then subjected to electroless plating. In this case, metal is deposited by reduction reaction on portions of the insulating layer where the catalyst exists. Accordingly, conductor traces are formed in the grooves of the insulating layer.

Abstract: An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.