Abstract: A liquid container capable of containing a liquid has a flow passage that is formed in the liquid container and through which the liquid flows, and a filter 166 provided in the middle of the flow passage. The filter 166 inclines in a direction with respect to the horizontal direction.

Abstract: A liquid container capable of containing a liquid has a flow passage that is formed in the liquid container and through which the liquid flows, and a filter 166 provided in the middle of the flow passage. The filter 166 inclines in a direction with respect to the horizontal direction.

Abstract: A liquid ejecting apparatus includes: a liquid ejecting head which has a nozzle formation surface that ejects a liquid containing a solvent in a vaporized state with a specific gravity greater than that of air onto a recording medium, and is in a standby state in which the nozzle formation surface faces a lower side in the vertical direction at a standby position deviating from a region where the recording medium is disposed during non-ejection of the liquid; and a head accommodation portion which has a concave portion that accommodates at least a part including the nozzle formation surface of the liquid ejecting head in the standby state and is provided so that a bottom portion of the concave portion opposes the nozzle formation surface in a state where the part is accommodated.

Abstract: A liquid holding container includes a liquid accommodating chamber, a flow path, and a filter. The liquid accommodating chamber is configured and arranged to hold liquid. The flow path is communicated with the liquid accommodating chamber via a first through hole and a second through hole. The filter is disposed in the flow path. The first through hole and the second through hole are each communicated with the flow path.

Abstract: A film member includes an inside film layer which is disposed on a surface in contact with liquid; an outside film layer which is disposed on the opposite side to the surface of the inside film layer in contact with the liquid; and a junction layer which is disposed between the inside film layer and the outside film layer to join the inside film layer and the outside film layer, in which an SP value (here, the SP value represents a solubility parameter value) of a resin material which forms the junction layer is equal to or larger than an SP value of a resin material that forms the inside film layer, and an SP value of a resin material that forms the outside film layer is equal to or larger than the SP value of the resin material that forms the inside film layer.

Abstract: A liquid ejecting apparatus includes: a liquid ejecting head which has a nozzle formation surface that ejects a liquid containing a solvent in a vaporized state with a specific gravity greater than that of air onto a recording medium, and is in a standby state in which the nozzle formation surface faces a lower side in the vertical direction at a standby position deviating from a region where the recording medium is disposed during non-ejection of the liquid; and a head accommodation portion which has a concave portion that accommodates at least a part including the nozzle formation surface of the liquid ejecting head in the standby state and is provided so that a bottom portion of the concave portion opposes the nozzle formation surface in a state where the part is accommodated.

Abstract: A method for coating only the element of an electronic device such as resor, diode or the like having an attached lead or leads with a powder coating. In this method, the electronic device travels on conveying apparatus from one end to the other end thereof, the lead holding the electronic device stably thereon. The electronic device is preliminarily heated during said travel by a preheating furnace thereby partially melting the powder coating which is applied to said device in the following part of the travel, the partially stuck powder coating on said electronic device being cured by passing the device through a secondary heating furnace thereby making it possible to complete the coating of the powder coating on the electronic device.