Abstract: A radiation detecting apparatus comprises: a first detector that detects incidence of radiation; a plate-shaped detection substrate including a second detector that detects an incident position of the radiation to at least the first detector, and a first terminal that is electrically connected to the second detector; a wiring substrate including a second terminal and an external terminal that is electrically connected to the second terminal; and a connecting member that electrically connects the first terminal and the second terminal. The first terminal is arranged at one end of a main surface of the plate-shaped detection substrate. The detection substrate is mounted on the wiring substrate such that the main surface is substantially perpendicular to the wiring substrate in a state that the one end faces the wiring substrate. The first detector is arranged opposite to the main surface of the detection substrate.

Abstract: A radiation detecting apparatus comprises: a first detector that detects incidence of radiation; a plate-shaped detection substrate including a second detector that detects an incident position of the radiation to at least the first detector, and a first terminal that is electrically connected to the second detector; a wiring substrate including a second terminal and an external terminal that is electrically connected to the second terminal; and a connecting member that electrically connects the first terminal and the second terminal. The first terminal is arranged at one end of a main surface of the plate-shaped detection substrate. The detection substrate is mounted on the wiring substrate such that the main surface is substantially perpendicular to the wiring substrate in a state that the one end faces the wiring substrate. The first detector is arranged opposite to the main surface of the detection substrate.

Abstract: It is an object to provide a photo detector that can be arranged in a matrix pattern (in a three-dimensional pattern) and a photo detection apparatus in which the photo detectors are arranged in a matrix pattern (in a three-dimensional pattern). In a photo detector for generating an electrical signal based on the intensity of a light received by a photo detection element, the photo detector comprises a flexible wiring substrate for mounting the photo detection element and the photo detection element electrically connected to the flexible wiring substrate for mounting the photo detection element.

Abstract: A group of scintillator elements that convert an incident radiation into a light is one-dimensionally arranged. A photodiode array includes a group of photodiode elements that are arranged corresponding to arrangement positions of the respective scintillator elements, with detection surfaces formed substantially parallel to the incidence direction of the radiation. A reflection thin film is formed on a rear surface of the photodiode array in such a manner that the reflection thin film covers surfaces of the scintillator elements of the scintillator array that is fixed adjacent to the photodiode array.

Abstract: In the component of a radiation detector, an upper end face of a pad formation protrusion provided on an upper surface of an MID substrate is equal in height to an upper surface of a photodiode array, first pads are provided on upper surfaces of photodiodes arranged in the photodiode array, respectively, second pads are provided on the upper end face of the pad formation protrusion, a bonding wire is provided between one of the first pads and corresponding one of the second pads, a wiring pattern is provided on the upper surface of the MID substrate, first terminals as many as the second pads and one second terminal are provided on a lower surface of the MID substrate, the second pads and the first terminals are electrically connected to one another in a one-to-one correspondence, and the wiring pattern is electrically connected to the second terminal.

Abstract: In the component of a radiation detector, an upper end face of a pad formation protrusion provided on an upper surface of an MID substrate is equal in height to an upper surface of a photodiode array, first pads are provided on upper surfaces of photodiodes arranged in the photodiode array, respectively, second pads are provided on the upper end face of the pad formation protrusion, a bonding wire is provided between one of the first pads and corresponding one of the second pads, a wiring pattern is provided on the upper surface of the MID substrate, first terminals as many as the second pads and one second terminal are provided on a lower surface of the MID substrate, the second pads and the first terminals are electrically connected to one another in a one-to-one correspondence, and the wiring pattern is electrically connected to the second terminal.

Abstract: A group of scintillator elements that convert an incident radiation into a light is one-dimensionally arranged. A photodiode array includes a group of photodiode elements that are arranged corresponding to arrangement positions of the respective scintillator elements, with detection surfaces formed substantially parallel to the incidence direction of the radiation. A reflection thin film is formed on a rear surface of the photodiode array in such a manner that the reflection thin film covers surfaces of the scintillator elements of the scintillator array that is fixed adjacent to the photodiode array.

Abstract: A plurality of optical transducers converts the first radiation to a first light having a first wavelength, and converts the second radiation to a second light having a second wavelength. A shielding unit is arranged between the optical transducers to shield the first radiation, the second radiation, the first light, and the second light. A plurality of first photoelectric converters that corresponds to each of the optical transducers outputs a first electrical signal based on intensity of the first light. A plurality of second photoelectric converters that corresponds to each of the optical transducers outputs a second electrical signal based on intensity of the second light.

Abstract: A plurality of optical transducers converts the first radiation to a first light having a first wavelength, and converts the second radiation to a second light having a second wavelength. A shielding unit is arranged between the optical transducers to shield the first radiation, the second radiation, the first light, and the second light. A plurality of first photoelectric converters that corresponds to each of the optical transducers outputs a first electrical signal based on intensity of the first light. A plurality of second photoelectric converters that corresponds to each of the optical transducers outputs a second electrical signal based on intensity of the second light.

Abstract: In the component of a radiation detector, an upper end face of a pad formation protrusion provided on an upper surface of an MID substrate is equal in height to an upper surface of a photodiode array, first pads are provided on upper surfaces of photodiodes arranged in the photodiode array, respectively, second pads are provided on the upper end face of the pad formation protrusion, a bonding wire is provided between one of the first pads and corresponding one of the second pads, a wiring pattern is provided on the upper surface of the MID substrate, first terminals as many as the second pads and one second terminal are provided on a lower surface of the MID substrate, the second pads and the first terminals are electrically connected to one another in a one-to-one correspondence, and the wiring pattern is electrically connected to the second terminal.

Abstract: In the component of a radiation detector, an upper end face of a pad formation protrusion provided on an upper surface of an MID substrate is equal in height to an upper surface of a photodiode array, first pads are provided on upper surfaces of photodiodes arranged in the photodiode array, respectively, second pads are provided on the upper end face of the pad formation protrusion, a bonding wire is provided between one of the first pads and corresponding one of the second pads, a wiring pattern is provided on the upper surface of the MID substrate, first terminals as many as the second pads and one second terminal are provided on a lower surface of the MID substrate, the second pads and the first terminals are electrically connected to one another in a one-to-one correspondence, and the wiring pattern is electrically connected to the second terminal.

Abstract: In the component of a radiation detector, an upper end face of a pad formation protrusion provided on an upper surface of an MID substrate is equal in height to an upper surface of a photodiode array, first pads are provided on upper surfaces of photodiodes arranged in the photodiode array, respectively, second pads are provided on the upper end face of the pad formation protrusion, a bonding wire is provided between one of the first pads and corresponding one of the second pads, a wiring pattern is provided on the upper surface of the MID substrate, first terminals as many as the second pads and one second terminal are provided on a lower surface of the MID substrate, the second pads and the first terminals are electrically connected to one another in a one-to-one correspondence, and the wiring pattern is electrically connected to the second terminal.

Abstract: In the component of a radiation detector, an upper end face of a pad formation protrusion provided on an upper surface of an MID substrate is equal in height to an upper surface of a photodiode array, first pads are provided on upper surfaces of photodiodes arranged in the photodiode array, respectively, second pads are provided on the upper end face of the pad formation protrusion, a bonding wire is provided between one of the first pads and corresponding one of the second pads, a wiring pattern is provided on the upper surface of the MID substrate, first terminals as many as the second pads and one second terminal are provided on a lower surface of the MID substrate, the second pads and the first terminals are electrically connected to one another in a one-to-one correspondence, and the wiring pattern is electrically connected to the second terminal.

Abstract: In the component of a radiation detector, an upper end face of a pad formation protrusion provided on an upper surface of an MID substrate is equal in height to an upper surface of a photodiode array, first pads are provided on upper surfaces of photodiodes arranged in the photodiode array, respectively, second pads are provided on the upper end face of the pad formation protrusion, a bonding wire is provided between one of the first pads and corresponding one of the second pads, a wiring pattern is provided on the upper surface of the MID substrate, first terminals as many as the second pads and one second terminal are provided on a lower surface of the MID substrate, the second pads and the first terminals are electrically connected to one another in a one-to-one correspondence, and the wiring pattern is electrically connected to the second terminal.