Patents by Inventor Shigenori Shiratori

Shigenori Shiratori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of printed circuit board
    Publication number: 20020001699
    Abstract: In a manufacturing method of a printed circuit board comprising a process of coating insulative resin on a surface of a printed circuit board having a blind hole and a process of filling up the insulative resin in the blind hole, the printed circuit board coated with the insulative resin is kept in a low pressure atmosphere of 1.3 to 666 hPa, and then the insulative resin is hardened, so that the insulative resin is filled up in the blind hole appropriately.
    Type: Application
    Filed: July 20, 2001
    Publication date: January 3, 2002
    Applicant: Victor Company of Japan, Ltd.
    Inventors: Yasuaki Seki, Shigenori Shiratori, Kenji Suzuki
  • Manufacturing method of printed circuit board
    Patent number: 6284308
    Abstract: In a manufacturing method of a printed circuit board comprising a process of coating insulative thermosetting resin on a surface of a printed circuit board having a blind hole and a process of filling up the insulative thermosetting resin in the blind hole, the printed circuit board coated with the insulative thermosetting resin is kept in a low pressure atmosphere of 1.3 to 666 hPa, and then the insulative thermosetting resin is hardened, so that the insulative thermosetting resin is filled up in the blind hole appropriately.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: September 4, 2001
    Assignee: Victor Company of Japan, Ltd.
    Inventors: Yasuaki Seki, Shigenori Shiratori, Kenji Suzuki
  • MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
    Publication number: 20010008650
    Abstract: In a manufacturing method of a printed circuit board comprising a process of coating insulative resin on a surface of a printed circuit board having a blind hole and a process of filling up the insulative resin in the blind hole, the printed circuit board coated with the insulative resin is kept in a low pressure atmosphere of 1.3 to 666 hPa, and then the insulative resin is hardened, so that the insulative resin is filled up in the blind hole appropriately.
    Type: Application
    Filed: December 15, 1999
    Publication date: July 19, 2001
    Inventors: YASUAKI SEKI, SHIGENORI SHIRATORI, KENJI SUZUKI