Patents by Inventor Shigenori Yaguchi

Shigenori Yaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926931
    Abstract: A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 ?m, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: March 12, 2024
    Assignee: Ricoh Company, Ltd.
    Inventors: Akira Saito, Shigenori Yaguchi, Yasuyuki Yamashita, Kiichi Kamoda, Yasuo Suzuki, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida
  • Patent number: 11491713
    Abstract: A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 ?m and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1?Tmf2)?3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1?Cd2)?3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C×1>C×2 and (C×1?C×2)?3 percent.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: November 8, 2022
    Assignee: Ricoh Company, Ltd.
    Inventors: Akira Saito, Yasuyuki Yamashita, Kiichi Kamoda, Shigenori Yaguchi, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida, Yasuo Suzuki
  • Publication number: 20220048245
    Abstract: A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 ?m and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1?Tmf2)?3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1?Cd2)?3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): Cx1>Cx2 and (Cx1?Cx2)?3 percent.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Inventors: Akira Saito, Yasuyuki Yamashita, Kiichi Kamoda, Shigenori Yaguchi, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida, Yasuo Suzuki
  • Patent number: 11242436
    Abstract: Provided are resin particles including columnar resin particles each including filaments of a fibrous material, wherein the filaments of the fibrous material are aligned in an axial direction of each of the columnar resin particles.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: February 8, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Shigenori Yaguchi, Yasuyuki Yamashita, Akira Saito, Kiichi Kamoda
  • Patent number: 11241825
    Abstract: A resin powder contains a resin, wherein the proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: February 8, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Yunsheng Sun, Toshiyuki Mutoh, Hitoshi Iwatsuki, Shigenori Yaguchi, Mitsuru Naruse, Sohichiroh Iida
  • Publication number: 20210317601
    Abstract: A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 ?m, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
    Type: Application
    Filed: June 14, 2021
    Publication date: October 14, 2021
    Inventors: Akira Saito, Shigenori Yaguchi, Yasuyuki Yamashita, Kiichi Kamoda, Yasuo Suzuki, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida
  • Publication number: 20210283895
    Abstract: A resin powder for solid freeform fabrication, having a ratio (Mv/Mn) of 2.00 or less, where Mv represents a volume average particle diameter and Mn represents a number average particle diameter and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.
    Type: Application
    Filed: June 1, 2021
    Publication date: September 16, 2021
    Inventors: Akira SAITO, Shigenori YAGUCHI, Yasuo SUZUKI, Nozomu TAMOTO, Shinzo HIGUCHI, Hitoshi IWATSUKI
  • Patent number: 11066758
    Abstract: A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 ?m, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: July 20, 2021
    Assignee: Ricoh Company, Ltd.
    Inventors: Akira Saito, Shigenori Yaguchi, Yasuyuki Yamashita, Kiichi Kamoda, Yasuo Suzuki, Nozomu Tamoto, Hitoshi Iwatsuki, Shinzo Higuchi, Sohichiroh Iida
  • Patent number: 11052649
    Abstract: A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: July 6, 2021
    Assignee: Ricoh Company, Ltd.
    Inventors: Akira Saito, Shigenori Yaguchi, Yasuo Suzuki, Nozomu Tamoto, Shinzo Higuchi, Hitoshi Iwatsuki
  • Patent number: 10800096
    Abstract: A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: October 13, 2020
    Assignee: Ricoh Company, Ltd.
    Inventors: Sohichiroh Iida, Shigenori Yaguchi, Hitoshi Iwatsuki, Yasuo Suzuki, Nozomu Tamoto, Shinzo Higuchi, Akira Saito, Yasuyuki Yamashita, Kiichi Kamoda
  • Publication number: 20200070412
    Abstract: A resin powder contains a resin, wherein the proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Inventors: Yunsheng SUN, Toshiyuki Mutoh, Hitoshi Iwatsuki, Shigenori Yaguchi, Mitsuru Naruse, Sohichiroh IIDA
  • Publication number: 20200016827
    Abstract: Provided is a resin powder for producing a three-dimensional object, wherein the resin powder has a number-average equivalent circle diameter of 10 micrometers or greater but 150 micrometers or less, and wherein a median in an equivalent circle diameter-based particle size distribution of the resin powder is higher than the average equivalent circle diameter.
    Type: Application
    Filed: March 7, 2018
    Publication date: January 16, 2020
    Inventors: Yasuyuki YAMASHITA, Akira SAITO, Sohichiroh IIDA, Hitoshi IWATSUKI, Yasuo SUZUKI, Nozomu TAMOTO, Kiichi KAMODA, Shigenori YAGUCHI, Shinzo HIGUCHI, Toshiyuki ISEKI, Yasutomo AMAN, Toshiyuki MUTOH, Mitsuru NARUSE
  • Publication number: 20190284351
    Abstract: Provided are resin particles including columnar resin particles each including filaments of a fibrous material, wherein the filaments of the fibrous material are aligned in an axial direction of each of the columnar resin particles.
    Type: Application
    Filed: March 12, 2019
    Publication date: September 19, 2019
    Inventors: Shigenori YAGUCHI, Yasuyuki Yamashita, Akira Saito, Kiichi Kamoda
  • Publication number: 20180355144
    Abstract: A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 13, 2018
    Inventors: Akira SAITO, Shigenori YAGUCHI, Yasuo SUZUKI, Nozomu TAMOTO, Shinzo HIGUCHI, Hitoshi IWATSUKI
  • Publication number: 20180264721
    Abstract: A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.
    Type: Application
    Filed: March 13, 2018
    Publication date: September 20, 2018
    Inventors: Sohichiroh IIDA, Shigenori Yaguchi, Hitoshi Iwatsuki, Yasuo Suzuki, Nozomu Tamoto, Shinzo Higuchi, Akira Saito, Yasuyuki Yamashita, Kiichi Kamoda
  • Publication number: 20180023219
    Abstract: A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 ?m, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
    Type: Application
    Filed: July 21, 2017
    Publication date: January 25, 2018
    Inventors: Akira SAITO, Shigenori YAGUCHI, Yasuyuki YAMASHITA, Kiichi KAMODA, Yasuo SUZUKI, Nozomu TAMOTO, Hitoshi IWATSUKI, Shinzo HIGUCHI, Sohichiroh IIDA
  • Publication number: 20180022024
    Abstract: A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 ?m and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1?Tmf2)?3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1?Cd2)?3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C×1>C×2 and (C1?C2)?3 percent.
    Type: Application
    Filed: July 21, 2017
    Publication date: January 25, 2018
    Inventors: Akira SAITO, Yasuyuki YAMASHITA, Kiichi KAMODA, Shigenori YAGUCHI, Nozomu TAMOTO, Hitoshi IWATSUKI, Shinzo HIGUCHI, Sohichiroh llDA, Yasuo SUZUKI
  • Patent number: 9782935
    Abstract: A powder material for three-dimensional modeling includes a base particle and a coverage film including an organic material. The coverage film covers the base particle. The powder material is used for three dimensional modeling and when the coverage film is dissolved in a solvent to prepare a solution and the solution is formed into a coated film on a smooth surface, the coated film has a wetting tension of from 22 mN/m to 28 mN/m.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: October 10, 2017
    Assignee: Ricoh Company, Ltd.
    Inventors: Yasuyuki Yamashita, Yasuo Suzuki, Mitsuru Naruse, Nozomu Tamoto, Shigenori Yaguchi, Hitoshi Iwatsuki, Kazumi Ohtaki
  • Patent number: 9519234
    Abstract: There is provided a carrier including magnetic core particles; and a coating layer on a surface of each of the magnetic core particles, wherein the coating layer contains electroconductive particles; wherein the electroconductive particles are electroconductive particles in which white inorganic pigments are coated with phosphorus-doped tin or tungsten-doped tin; and wherein a dope ratio of phosphorus or tungsten to tin in the phosphorus-doped tin or tungsten-doped tin is 0.010 to 0.100.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: December 13, 2016
    Assignee: Ricoh Company, Ltd.
    Inventors: Hiroyuki Kishida, Shigenori Yaguchi, Hiroshi Tohmatsu, Koichi Sakata, Hitoshi Iwatsuki, Toyoaki Tano
  • Publication number: 20160271879
    Abstract: A powder material for three-dimensional modeling includes a base particle and a coverage film including an organic material. The coverage film covers the base particle. The powder material is used for three dimensional modeling and when the coverage film is dissolved in a solvent to prepare a solution and the solution is formed into a coated film on a smooth surface, the coated film has a wetting tension of from 22 mN/m to 28 mN/m.
    Type: Application
    Filed: March 9, 2016
    Publication date: September 22, 2016
    Inventors: Yasuyuki YAMASHITA, Yasuo SUZUKI, Mitsuru NARUSE, Nozomu TAMOTO, Shigenori YAGUCHI, Hitoshi IWATSUKI, Kazumi OHTAKI