Patents by Inventor Shigeo Aikawa

Shigeo Aikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150233334
    Abstract: An object of the present, invention is to suppress the decrease in seal performance by avoiding wide-area contact between a valve face and a valve seat face which contact results from the non-circularity of the valve face and the valve seat face.
    Type: Application
    Filed: July 22, 2013
    Publication date: August 20, 2015
    Inventors: Akiyasu Miyamoto, Motoyuki Abe, Shuichi Shimizu, Shigeo Aikawa
  • Publication number: 20040179963
    Abstract: The problems can be solved by ensuring that Ga≦Gb<Gc or Ga<Gb≦Gc, wherein Ga denotes a clearing between the bore on the portion from the compression chamber of the high pressure pump to the cylindrical groove and the plunger, where a transverse aperture is connected with the bore through a cylindrical groove provided halfway through the bore of a cylinder; Gb a clearance closer to the cylindrical groove, out of the clearances between the bore from the cylindrical groove to the drive source side and the plunger; and Gc a clearance closer to the drive source side, out of the clearances between the bore from the cylindrical groove to the drive source side and the plunger.
    Type: Application
    Filed: February 20, 2004
    Publication date: September 16, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Eiichi Kubota, Shigeo Aikawa, Michio Yoshida, Yasuhiro Kajiyama, Hiroyuki Yamada
  • Patent number: 5472371
    Abstract: By grinding the grinding surface of a diamond grinding tool which is formed in a predetermined shape by securing diamond abrasive grains by bond circularly or flat with high accuracy by the processing type truing method, uniformly dressing the above bond surface so as to project diamond abrasive grains, lapping the tips of the diamond abrasive grains projected from the above bond by the lapping type truing method so as to make the cutting edge height constant, the run,out of the grinding surface can be controlled to the order of submicrons and the cutting edges which are tips of the diamond abrasive grains can be aligned precisely.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: December 5, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Yamakura, Toshio Tamura, Yuji Ochiai, Shigeo Aikawa
  • Patent number: 5456736
    Abstract: This invention provides a lap capable of reducing the pole recession produced between the substrate and the magnetic film when the air-bearing surface of a thin-film magnetic head is lapped, a lapping liquor used for such lapping, and a thin-film magnetic head having its air-bearing surface lapped by using them. Lapping is carried out by using a lap made of a material having both a phase of tin and a phase of brass with a greater rigidity in supporting the abrasive grains than tin, and a lapping liquor prepared by mixing an anionic surfactant (15) and an ampholytic surfactant (16). According to the present invention, it is possible to reduce the pole recession in the thin-film magnetic heads and to accordingly shorten the recording bit length of the magnetic discs.
    Type: Grant
    Filed: March 5, 1993
    Date of Patent: October 10, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Yoshiharu Waki, Masayasu Fujisawa, Shigeo Aikawa, Kenya Ohashi, Yukihiro Isono