Patents by Inventor Shigeo Iwasawa

Shigeo Iwasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210363313
    Abstract: A sized reinforcing filler, comprising a filler and a sizing agent disposed on at least a portion of the filler, to be used for reinforcement for plastics is disclosed. The sizing agent is based upon at least one of a polyvinyl alcohol, an ethylene/vinyl alcohol copolymer, a silane-grafted polyvinyl alcohol and a silane-grafted ethylene/vinyl alcohol copolymer, a silane-grafted polyvinyl alcohol and a silane-grafted ethylene/vinyl alcohol copolymer. The polyvinyl alcohol is useful as a size for all types of fibers and particles to reinforce all types of commodity and engineering plastics, particularly polyolefin resins, to form polymer composites. As such, polymer composites reinforced with such sized reinforcing fillers, as well as articles, components, and products including such polymers composites, are also disclosed.
    Type: Application
    Filed: July 18, 2018
    Publication date: November 25, 2021
    Applicant: Zoltek Corporation
    Inventors: Philip F. CHU, Philip L. SCHELL, David M. CORBIN, Shigeo IWASAWA
  • Publication number: 20160114641
    Abstract: The present invention comprises: a vehicle link component which is characterized in that a collar member is provided to a rotation fulcrum member-mounting hole section of a link body formed from carbon-fiber reinforced plastic (CFRP), said collar member having a cylindrical section that extends inside the hole section in the direction of penetration of the hole section, and having an engagement section that extends in the direction along the surface of the link body from the cylindrical section; and a manufacturing method therefor. By employing the CFRP link body, a significant reduction in the weight of the vehicle link component can be achieved, and assembly can easily be performed as desired without causing damage by press-fitting a bush, or the like, even in the CFRP link body.
    Type: Application
    Filed: May 28, 2013
    Publication date: April 28, 2016
    Applicants: TORAY INDUSTRIES, INC., YOROZU CORPORATION
    Inventors: Shigeo IWASAWA, Yoshito KURODA, Shuichiro KAWAGUCHI, Yoshihiro MORIWAKI, Shota TABATA
  • Patent number: 8246776
    Abstract: Disclosed are a method for manufacturing a crank for a bicycle by bonding structural members to each other with an adhesive comprising; a step for applying the adhesive in a line-like or dot-like form in correspondence with an intervention region of the adhesive; a step for disposing a fabric in correspondence with the intervention region of the adhesive; a step for expanding the adhesive applied in a line-like or dot-like form in the fabric; and a step for bonding the structural members to each other with the adhesive expanded in the fabric, and a crank for a bicycle manufactured by the method. When the crank for a bicycle is manufactured by bonding the structural members to each other with the adhesive, the adhesive can be applied easily at a high accuracy and a good repeatability, variations of application condition and amount of used adhesive can be suppressed, and variation in quality can be suppressed.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: August 21, 2012
    Assignees: Toray Industries, Inc., Shimano, Inc.
    Inventors: Shigeo Iwasawa, Yukitane Kimoto, Shin Tanabe
  • Publication number: 20110192531
    Abstract: An RTM molding method and device includes disposing a reinforcing fiber substrate in a cavity of a mold consisting of a plurality of dies, clamping the mold, and injecting resin to complete molding, wherein divided areas with respect to the surface direction of the reinforcing fiber substrate are assumed, each divided area is one in which injected resin expands over the entire surface in the area and can be substantially uniformly impregnated in the thickness direction of the substrate, and resin introducing paths are formed for respective assumed divided areas to introduce injected resin into the respective divided areas. When a relatively large molded product is molded, a molding step from resin injection to impregnating/curing can be implemented at high speed without generating a non-resin-flowing area, thereby producing a high-quality molded product with a shortened molding time and increased production speed and volume.
    Type: Application
    Filed: April 1, 2011
    Publication date: August 11, 2011
    Applicant: Toray Industries, Inc.
    Inventors: Toshihide SEKIDO, Shigeo IWASAWA, Tatsuya SENBA
  • Patent number: 7943078
    Abstract: An RTM molding method includes disposing a reinforcing fiber substrate in a cavity of a mold consisting of a plurality of dies, clamping the mold, and thereafter injecting resin to complete molding, characterized in that divided areas with respect to the surface direction of the reinforcing fiber substrate are assumed, each divided area is one in which injected resin expands over the entire surface in the area and can be substantially uniformly impregnated in the thickness direction of the substrate, and resin introducing paths are formed for respective assumed divided areas for introducing the injected resin into the respective divided areas; and an RTM molding device. When a relatively large molded product is to be molded, a molding step from resin injection to impregnating/curing can be implemented at high speed without generating a non-resin-flowing area, thereby enabling a high-quality molded product to be produced free from voids, etc.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: May 17, 2011
    Assignee: Toray Industries, Inc.
    Inventors: Toshihide Sekido, Shigeo Iwasawa, Tatsuya Senba
  • Publication number: 20090165947
    Abstract: Disclosed are a method for manufacturing a crank for a bicycle by bonding structural members to each other with an adhesive comprising; a step for applying the adhesive in a line-like or dot-like form in correspondence with an intervention region of the adhesive; a step for disposing a fabric in correspondence with the intervention region of the adhesive; a step for expanding the adhesive applied in a line-like or dot-like form in the fabric; and a step for bonding the structural members to each other with the adhesive expanded in the fabric, and a crank for a bicycle manufactured by the method. When the crank for a bicycle is manufactured by bonding the structural members to each other with the adhesive, the adhesive can be applied easily at a high accuracy and a good repeatability, variations of application condition and amount of used adhesive can be suppressed, and variation in quality can be suppressed.
    Type: Application
    Filed: December 17, 2008
    Publication date: July 2, 2009
    Inventors: Shigeo Iwasawa, Yukitane Kimoto, Shin Tanabe
  • Patent number: 7501087
    Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: March 10, 2009
    Assignee: Toray Industries, Inc.
    Inventors: Toshiya Kamae, Hiroki Oosedo, Go Tanaka, Shigeo Iwasawa
  • Publication number: 20070182071
    Abstract: An RTM molding method comprising disposing a reinforcing fiber substrate in a cavity of a mold consisting of a plurality of dies, clamping the mold, and thereafter injecting resin to complete molding, characterized in that divided areas with respect to the surface direction of the reinforcing fiber substrate are assumed, each divided area is one in which injected resin expands over the entire surface in the area and can be substantially uniformly impregnated in the thickness direction of the substrate, and resin introducing paths are formed for respective assumed divided areas for introducing the injected resin into the respective divided areas; and an RTM molding device. When a relatively large molded product is to be molded, a molding step from resin injection to impregnating/curing can be implemented at high speed without generating a non-resin-flowing area, thereby enabling a high-quality molded product to be produced free from voids, etc.
    Type: Application
    Filed: February 16, 2005
    Publication date: August 9, 2007
    Inventors: Toshihide Sekido, Shigeo Iwasawa, Tatsuya Senba
  • Publication number: 20070104937
    Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 10, 2007
    Applicant: Toray Industries, Inc.
    Inventors: Toshiya Kamae, Hiroki Oosedo, Go Tanaka, Shigeo Iwasawa
  • Patent number: 7148294
    Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: December 12, 2006
    Assignee: Toray Industries, Inc.
    Inventors: Toshiya Kamae, Hiroki Oosedo, Go Tanaka, Shigeo Iwasawa
  • Publication number: 20040044147
    Abstract: The present invention relates to an epoxy resin composition consisting of components (a), (b) and (c) defined below, wherein the amount of component (c) based on 100 parts by weight of component (a) is 1 to 30 parts by weight; component (a) is liquid; and components (b) and (c) are homogeneously dissolved in component (a):
    Type: Application
    Filed: March 21, 2003
    Publication date: March 4, 2004
    Inventors: Toshiya Kamae, Hiroki Oosedo, Go Tanaka, Shigeo Iwasawa
  • Patent number: 4157561
    Abstract: This invention relates to a high power bipolar transistor comprising a collector region, a base region formed in the collector region and emitter regions formed in the base region, with each of the emitter regions being a closed loop at the surface of the base region. The emitter electrode contact region is arranged at the surface of base region and surrounded by the emitter region, and the emitter electrode contact region and emitter region are connected by a conductive area, with the conductive area being shallower than the emitter region. In addition, the conductive area is connected to the internal surface of the emitter region at one or more points but is not connected to the entire part of the internal surface of the emitter region.
    Type: Grant
    Filed: September 27, 1977
    Date of Patent: June 5, 1979
    Assignee: Fujitsu Limited
    Inventors: Yoshiaki Nawata, Masaaki Kobayashi, Kazuo Yajima, Shigeo Iwasawa, Koji Takahashi
  • Patent number: 4151542
    Abstract: A transistor which has a plurality of ring emitter transistor units formed on a common semiconductor substrate having one conductivity type, each ring emitter transistor unit being provided with a base region of the opposite conductivity type from the semiconductor substrate and formed on its surface, an emitter region of the same conductivity type as the semiconductor substrate and formed in the base region to a depth smaller than the latter to have a ring-shaped plane configuration, a base electrode formed in the vicinity of the outer or inner periphery of the ring-shaped emitter region, an emitter electrode formed in the vicinity of the inner or outer periphery of the emitter region, and a ballasting resistor formed to interconnect the emitter region and the emitter electrode. The product of the area of the emitter region and the resistance value of the ballasting resistor is selected to be in the range of from 6.0 .times. 10.sup.-4 to 1.3 .times. 10.sup.-3 [.OMEGA..multidot.cm.sup.
    Type: Grant
    Filed: February 7, 1978
    Date of Patent: April 24, 1979
    Assignee: Fujitsu Limited
    Inventors: Kazuo Yajima, Masaaki Kobayashi, Yoshiaki Nawata, Shigeo Iwasawa, Koji Takahashi