Abstract: An integrated circuit device has a device main body 1 having a predetermined circuit function of providing an output corresponding to an input thereto, and is provided with a power supply section 4 for receiving through a coil 3 electromagnetic wave energy applied from outside to generate predetermined internal electric power required to operate the integrated circuit device. The integrated circuit device further includes a calibration data acquisition circuit (operation control section 5) for detecting the output of the device main body 1 operated in a predetermined operating environment to obtain calibration data on the device main body, and a nonvolatile memory 6 for storing the calibration data.

Abstract: An identification process according to the present invention performs identification with a swallowable identification chip 1. In this process, first, identification information for identifying a person to be identified is input to the identification chip 1. Then, the identification chip 1 where the identification information is input is provided to the person to be identified such as a passenger. The person swallows the identification chip 1 when facing a danger. For identification, the identification chip 1 is taken from the person's body. This process enables reliable identification in a short time.

Abstract: A spherical semiconductor device 1a comprises three spherical semiconductors 10, 20 and 30, which are connected together. An electronic circuit is formed on the surface of the central spherical semiconductor 10, among the three spherical semiconductors, while a coil 21 and a capacitor 31 are formed on the respective surfaces of the other spherical semiconductors 20 and 30, respectively. Since the spherical semiconductors 20 and 30 at the opposite ends are independent of the central spherical semiconductor 10, an insulating film on the coil 21 never influences the properties of the electronic circuit of the central spherical semiconductor 10, and the capacitor 31 can secure a capacity large enough to maintain satisfactory operating power for the spherical semiconductor device 1a. Since the three spherical semiconductors 10, 20 and 30 are manufactured in different processes, moreover, the productivity of the spherical semiconductors cannot be lowered by differences between manufacturing processes.