Patents by Inventor Shigeo Sasaki

Shigeo Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7222574
    Abstract: Treatment agents are provided for cell seedlings. Each treatment agent comprises water, a dispersant, and activated carbon finely dispersed with the dispersant in the water. Potted seedlings can be treated by dipping them in the treatment agent and/or by irrigating them with the treatment agent. In this manner, cell seedlings can be pre-treated before planting. The thus-planted seedlings may be irrigated with the treatment agent.
    Type: Grant
    Filed: March 14, 2002
    Date of Patent: May 29, 2007
    Assignee: Dainichiseika Color & Chemicals Mfg. Co., Ltd.
    Inventors: Toshio Hattori, Shigeo Sasaki
  • Patent number: 6555418
    Abstract: A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of the adhesive sheet and the adhesive kept constant when the pushing-up pressure for pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: April 29, 2003
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tetsuya Kurosawa, Shigeo Sasaki
  • Publication number: 20020189512
    Abstract: Treatment agents are provided for cell seedlings. Each treatment agent comprises water, a dispersant, and activated carbon finely dispersed with the dispersant in the water. Potted seedlings can be treated by dipping them in the treatment agent and/or by irrigating them with the treatment agent. In this manner, cell seedlings can be pre-treated before planting. The thus-planted seedlings may be irrigated with the treatment agent.
    Type: Application
    Filed: March 14, 2002
    Publication date: December 19, 2002
    Applicant: Dainichiseika Color & Chemicals Mfg. Co., Ltd.
    Inventors: Toshio Hattori, Shigeo Sasaki
  • Patent number: 6432877
    Abstract: A lawn colorant composition having rearing effects contains a pigment and an adhesive for the pigment. The pigment comprises a blue pigment composed as a primary component of a compound represented by the following formula: MFe[Fe(CN)6] wherein M represents an alkali metal atom or an ammonium group, one of the two Fe atoms is a divalent ion, and the other Fe atom is a trivalent ion. The adhesive comprises a water-dispersed polymer and a water-soluble polymer having compatibility with said water-dispersed polymer.
    Type: Grant
    Filed: January 23, 2001
    Date of Patent: August 13, 2002
    Assignee: Dainichiseika Color & Chemicals Mfg. Co., Ltd.
    Inventors: Ken Okura, Toshio Hattori, Masayoshi Sakakibara, Shigeo Sasaki
  • Patent number: 6329321
    Abstract: A lawn colorant composition having rearing effects contains a pigment and an adhesive for the pigment. The pigment comprises a blue pigment composed as a primary component of a compound represented by the following formula: MFe[Fe(CN)6] wherein M represents an alkali metal atom or an ammonium group, one of the two Fe atoms is a divalent ion, and the other Fe atom is a trivalent ion. The adhesive comprises a water-dispersed polymer and a water-soluble polymer having compatibility with said water-dispersed polymer.
    Type: Grant
    Filed: January 21, 2000
    Date of Patent: December 11, 2001
    Assignee: Dainichiseika Color & Chemicals Mfg. Co., Ltd
    Inventors: Ken Okura, Toshio Hattori, Masayoshi Sakakibara, Shigeo Sasaki
  • Patent number: 6294439
    Abstract: Grooves are formed in a surface of a wafer, on which semiconductor elements are formed, along dicing lines or chip parting lines on the wafer. The grooves are deeper than the thickness of a finished chip, and each of them has a curved bottom surface. A holding sheet is attached on the surface of the wafer on which the semiconductor elements are formed. Subsequently, the rear surface of the wafer is lapped and polished to the thickness of the finished chip, thereby dividing the wafer into chips. Even after the wafer is divided into the chips, the lapping and polishing is continued until the thickness of the wafer becomes equal to the thickness of the finished chip. The lapping and polishing amount required to attain the thickness of the finished chip after the lapped face of the wafer reaches the bottom surface of the groove, and a depth of a region of the curved bottom surface of the groove define a ratio of not less than 0.3.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: September 25, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shigeo Sasaki, Shinya Takyu, Keisuke Tokubuchi, Koichi Yazima, Hideo Nakayoshi
  • Patent number: 6284915
    Abstract: A process for preparing 2-amino malonic acid derivatives of formula (1): wherein A is linear or branched chain alkylene having from 1 to 10 carbon atoms, R1 is linear or branched chain alkyl having from 2 to 20 carbon atoms, R2 and R3 are the same or different, and are lower alkyl or aralkyl, and R4 is a protecting group, which process comprises the steps of reducing a compound of formula (6): wherein A is linear or branched chain alkylene having from 1 to 10 carbon atoms, R1 is linear or branched chain alkyl having from 2 to 20 carbon atoms, R2 and R3 are the same or different, and are lower alkyl or aralkyl, and R4 is a protecting group.
    Type: Grant
    Filed: March 3, 1999
    Date of Patent: September 4, 2001
    Assignees: Taito Co., LTD, Welfide Corporation
    Inventors: Susumu Hirase, Shigeo Sasaki, Masahiko Yoneta, Ryoji Hirose, Tetsuro Fujita
  • Publication number: 20010017403
    Abstract: A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of the adhesive sheet and the adhesive kept constant when the pushing-up pressure for pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion.
    Type: Application
    Filed: December 14, 2000
    Publication date: August 30, 2001
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tetsuya Kurosawa, Shigeo Sasaki
  • Publication number: 20010009886
    Abstract: A lawn colorant composition having rearing effects contains a pigment and an adhesive for the pigment. The pigment comprises a blue pigment composed as a primary component of a compound represented by the following formula: MFe[Fe(CN)6] wherein M represents an alkali metal atom or an ammonium group, one of the two Fe atoms is a divalent ion, and the other Fe atom is a trivalent ion. The adhesive comprises a water-dispersed polymer and a water-soluble polymer having compatibility with said water-dispersed polymer.
    Type: Application
    Filed: January 23, 2001
    Publication date: July 26, 2001
    Applicant: Dainichieseika Color & Chemicals Mfg. Co., Ltd.
    Inventors: Ken Okura, Toshio Hattori, Masayoshi Sakakibara, Shigeo Sasaki
  • Publication number: 20010008945
    Abstract: A process for preparing 2-amino malonic acid derivatives of formula (1): 1
    Type: Application
    Filed: March 3, 1999
    Publication date: July 19, 2001
    Inventors: SUSUMU HIRASE, SHIGEO SASAKI, MASAHIKO YONETA, RYOJI HIROSE, TETSURO FUJITA
  • Patent number: 6201306
    Abstract: A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of the adhesive sheet and the adhesive kept constant when the pushing-up pressure for pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion.
    Type: Grant
    Filed: December 3, 1996
    Date of Patent: March 13, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tetsuya Kurosawa, Shigeo Sasaki
  • Patent number: 6184109
    Abstract: Grooves are formed in a surface of a wafer, on which surface semiconductor elements are formed, along dicing lines on the wafer by means of a dicing blade. The grooves are deeper than a thickness of a finished chip. Alternatively, grooves are formed in a surface of a wafer, on which surface semiconductor elements are formed, along chip parting lines on the wafer by etching. Like the grooves described above, the grooves are deeper than a thickness of a finished chip. A holding member is attached on the surface of the wafer on which the semiconductor elements are formed. The bottom surface of the wafer is lapped and polished to the thickness of the finished chip, thereby dividing the wafer into chips. When the wafer is divided into the chips, the lapping and polishing is continued until the thickness of the wafer becomes equal to the thickness of the finished chip, even after the wafer has been divided into the chips by the lapping and polishing.
    Type: Grant
    Filed: January 21, 1999
    Date of Patent: February 6, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shigeo Sasaki, Shinya Takyu, Keisuke Tokubuchi, Koichi Yazima, Hideo Nakayoshi
  • Patent number: 5976260
    Abstract: It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer (1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.
    Type: Grant
    Filed: March 7, 1996
    Date of Patent: November 2, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshimi Kinoshita, Tomoyuki Kanda, Katsuhisa Kitano, Kazuo Yoshida, Hiroshi Ohnishi, Kenichiro Yamanishi, Shigeo Sasaki, Hideki Komori, Taizo Eshima, Kouichirou Tsutahara, Toshihiko Noguchi, Toru Takahama, Yoshihiko Kusakabe, Takeshi Iwamoto, Nobuyuki Kosaka
  • Patent number: 5952316
    Abstract: 2-Amino-1,3-propanediol compounds of the formula (I) ##STR1## wherein R is an optionally substituted straight- or branched carbon chain, an optionally substituted aryl, an optionally substituted cycloalkyl or the like, and R.sup.2, R.sup.3, R.sup.4 and R.sup.5 are the same or different and each is a hydrogen, an alkyl, an aralkyl, an acyl or an alkoxycarbonyl, pharmaceutically acceptable salts thereof and immunosuppressants comprising these compounds as active ingredients.The 2-amino-1,3-propanediol compounds of the present invention show immunosuppressive action and are useful for suppressing rejection in organ or bone marrow tranplantation, prevention and treatment of autoimmune diseases or as reagents for use in medicinal and pharmaceutical fields.
    Type: Grant
    Filed: August 14, 1997
    Date of Patent: September 14, 1999
    Assignees: Yoshitomi Pharmaceutical Industries, Ltd., Taito Co., Ltd.
    Inventors: Tetsuro Fujita, Shigeo Sasaki, Masahiko Yoneta, Tadashi Mishina, Kunitomo Adachi, Kenji Chiba
  • Patent number: 5888883
    Abstract: Grooves are formed in a surface of a wafer, on which surface semiconductor elements are formed, along dicing lines. The grooves are deeper than a thickness of a finished chip. A holding member is attached on the surface of the wafer on which the semiconductor elements are formed. A bottom surface of the wafer is lapped and polished to the thickness of the finished chip, thereby dividing the wafer into chips. When the wafer is divided into the chips, the lapping and polishing is continued until the thickness of the wafer becomes equal to the thickness of the finished chip, even after the wafer has been divided into the chips by the lapping and polishing.
    Type: Grant
    Filed: April 24, 1998
    Date of Patent: March 30, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shigeo Sasaki, Shinya Takyu, Keisuke Tokubuchi, Koichi Yazima
  • Patent number: 5719176
    Abstract: A 2-amino-1,3-propanediol compound represented by general formula (I) or a pharmaceutically acceptable salt thereof, and an immunosuppressant containing the same as the active ingredient. In said formula R represents optionally substituted linear or branched carbon chain, optionally substituted aryl or optionally substituted cycloalkyl; and R.sup.2, R.sup.3, R.sup.4 and R.sup.5, which may be the same or different from one another, represent each hydrogen, alkyl, aralkyl, acyl or alkoxycarbonyl. The compound is immunodepressant and useful as an inhibitor against rejection in organ or bone marrow transplantation, as a preventive or remedy for autoimmune diseases and so forth, or a reagent in the medical and pharmaceutical fields.
    Type: Grant
    Filed: October 2, 1996
    Date of Patent: February 17, 1998
    Assignees: Yoshitomi Pharmaceutical Industries, Ltd., Taito Co., Ltd.
    Inventors: Tetsuro Fujita, Shigeo Sasaki, Masahiko Yoneta, Tadashi Mishina, Kunitomo Adachi, Kenji Chiba
  • Patent number: 5604229
    Abstract: 2-Amino-1,3-propanediol compounds of the formula (I) ##STR1## wherein R is an optionally substituted straight- or branched carbon chain, an optionally substituted aryl, an optionally substituted cycloalkyl or the like, and R.sup.2, R.sup.3, R.sup.4 and R.sup.5 are the same or different and each is a hydrogen, an alkyl, an aralkyl, an acyl or an alkoxycarbonyl, pharmaceutically acceptable salts thereof and immunosuppressants comprising these compounds as active ingredients.The 2-amino-1,3-propanediol compounds of the present invention show immunosuppressive action and are useful for suppressing rejection in organ or bone marrow tranplantation, prevention and treatment of autoimmune diseases or as reagents for use in medicinal and pharmaceutical fields.
    Type: Grant
    Filed: June 17, 1994
    Date of Patent: February 18, 1997
    Assignees: Yoshitomi Pharmaceutical Industries, Ltd., Taito Co., Ltd.
    Inventors: Tetsuro Fujita, Shigeo Sasaki, Masahiko Yoneta, Tadashi Mishina, Kunitomo Adachi, Kenji Chiba
  • Patent number: 5560964
    Abstract: A minute-particle iron oxide red pigment slurry is formed by adding sodium silicate to a minute-particle iron oxide red pigment slurry, and used to form a red filter formed between a phosphor layer of a color cathode ray tube and a panel thereof. Therefore, even if the red filter is brought in contact with a black matrix under the condition of a process of manufacturing the color cathode ray tube at high temperature, the red filter does not discolor the black matrix.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: October 1, 1996
    Assignees: Sony Corporation, Dainichiseika Color & Chemicals Mfg. Co., Ltd.
    Inventors: Katsutoshi Ohno, Tsuneo Kusunoki, Kenichi Ozawa, Kenji Takayanagi, Shigeo Sasaki, Akira Nishio
  • Patent number: 5534073
    Abstract: It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.
    Type: Grant
    Filed: September 7, 1993
    Date of Patent: July 9, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshimi Kinoshita, Tomoyuki Kanda, Katsuhisa Kitano, Kazuo Yoshida, Hiroshi Ohnishi, Kenichiro Yamanishi, Shigeo Sasaki, Hideki Komori, Taizo Eshima, Kouichirou Tsutahara, Toshihiko Noguchi, Toru Takahama, Yoshihiko Kusakabe, Takeshi Iwamoto, Nobuyuki Kosaka
  • Patent number: 5403989
    Abstract: In a color cathode-ray tube, only a foreign matter adhering to a shadow mask is removed effectively without thermal deformation of the shadow mask or thermal denaturation of phosphors.An electron beam produced by an electron gun incorporated in a cathode-ray tube itself is scanned or irradiated to all over a shadow mask of the color cathode-ray tube. The radiant state of a fluorescent screen at this stage is checked to detect a foreign matter adhering to the shadow mask. The electron beam is deflected to align with the position at which the foreign matter is detected, and then irradiated to the foreign matter in the form of pulses. Thus, the foreign matter is heated and removed.
    Type: Grant
    Filed: March 24, 1993
    Date of Patent: April 4, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroaki Tobuse, Tomoyuki Kanda, Yasusi Hisaoka, Shigeo Sasaki, Minoru Kobayashi, Takuji Oda, Ryuji Ueda, Akio Yoshida, Tadayoshi Owaki, Akihiko Yamasaki, Masaaki Kinoshita, Toshiaki Fukunishi