Abstract: Reduction in impedance in a lead connected to a semiconductor element is achieved while achieving anchor effect. The semiconductor device includes a heatsink, a semiconductor element, a lead disposed on an upper side of the heatsink, and a molding material formed to cover the lead, the heatsink, and the semiconductor element. Formed on an edge portion of a lower surface in a position, in the heatsink, overlapping with the lead in a plan view is a first convex portion protruding more than an edge portion of an upper surface in the position, and formed on an edge portion of an upper surface in a position, in the heatsink, which does not overlap with the lead in a plan view is a second convex portion protruding more than an edge portion of a lower surface in the position.

Abstract: Reduction in impedance in a lead connected to a semiconductor element is achieved while achieving anchor effect. The semiconductor device includes a heatsink, a semiconductor element, a lead disposed on an upper side of the heatsink, and a molding material formed to cover the lead, the heatsink, and the semiconductor element. Formed on an edge portion of a lower surface in a position, in the heatsink, overlapping with the lead in a plan view is a first convex portion protruding more than an edge portion of an upper surface in the position, and formed on an edge portion of an upper surface in a position, in the heatsink, which does not overlap with the lead in a plan view is a second convex portion protruding more than an edge portion of a lower surface in the position.

Abstract: A power amplifier includes: first and second bias terminals to which bias voltages are respectively supplied; a first transistor having a first control terminal connected to the first bias terminal, a first terminal that is grounded, and a second terminal; a second transistor having a second control terminal connected to the second bias terminal, a third terminal connected to the second terminal, and a fourth terminal; a capacitor connected between the second control terminal and a grounding point; and a variable resistor connected in series with the capacitor, between the second control terminal and the grounding point.

Abstract: A power amplifier includes: first and second bias terminals to which bias voltages are respectively supplied; a first transistor having a first control terminal connected to the first bias terminal, a first terminal that is grounded, and a second terminal; a second transistor having a second control terminal connected to the second bias terminal, a third terminal connected to the second terminal, and a fourth terminal; a capacitor connected between the second control terminal and a grounding point; and a variable resistor connected in series with the capacitor, between the second control terminal and the grounding point.