Patents by Inventor Shigeomi ABE

Shigeomi ABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10577141
    Abstract: To provide a method for readily forming an easily separable portion having an adhesive strength that is required as a package bag on packaging film, a package bag having an easily separable portion formed by this method, and a filling-packing machine utilizing this method. A method forming an easily separable portion in packaging film by interposing at least two packaging films between a horn emitting ultrasonic waves and an anvil oppositely disposed to the horn, and vibrating the packaging films by the ultrasonic waves, in which a vibratable layer is provided on the packaging film in at least one of the horn side and the anvil side.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: March 3, 2020
    Assignee: TAISEI LAMICK CO., LTD.
    Inventors: Hidenori Kogure, Shigeomi Abe
  • Publication number: 20170253358
    Abstract: [PROBLEM TO BE SOLVED] To provide a method for readily forming an easily separable portion having an adhesive strength that is required as a package bag on packaging film, a package bag having an easily separable portion formed by this method, and a filling-packing machine utilizing this method. [SOLUTION] A method forming an easily separable portion in packaging film by interposing at least two packaging films between a horn emitting ultrasonic waves and an anvil oppositely disposed to the horn, and vibrating the packaging films by the ultrasonic waves, in which a vibratable layer is provided on the packaging film in at least one of the horn side and the anvil side.
    Type: Application
    Filed: August 31, 2015
    Publication date: September 7, 2017
    Applicant: TAISEI LAMICK CO., LTD.
    Inventors: Hidenori KOGURE, Shigeomi ABE