Abstract: The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (?Y/?X) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.

Abstract: This wire shape inspecting apparatus comprises a camera which captures an image of a wire from above, a light which illuminates the wire from above, and a control unit, wherein the control unit performs: an inspection image acquiring process of acquiring a plurality of inspection images by causing the camera to capture images of the wire a plurality of times while changing a focal distance; and a first shape detecting process of identifying, in each inspection image, a light emitting portion, which is an image part including reflected light comprising light from the light that has been reflected by the wire, and identifying an actual light emitting portion position, which is the actual position of the light emitting portion, on the basis of the position of the light emitting portion in the inspection image and the focal distance when the inspection image was acquired.

Abstract: The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (?Y/?X) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.

Abstract: This wire shape inspecting apparatus comprises a camera which captures an image of a wire from above, a light which illuminates the wire from above, and a control unit, wherein the control unit performs: an inspection image acquiring process of acquiring a plurality of inspection images by causing the camera to capture images of the wire a plurality of times while changing a focal distance; and a first shape detecting process of identifying, in each inspection image, a light emitting portion, which is an image part including reflected light comprising light from the light that has been reflected by the wire, and identifying an actual light emitting portion position, which is the actual position of the light emitting portion, on the basis of the position of the light emitting portion in the inspection image and the focal distance when the inspection image was acquired.

Abstract: A pattern position detecting method capable of reducing time for detecting a component position includes: acquiring a model image of a target; dividing the acquired model image into reference images each including a specific pattern; acquiring a detected image of the target; matching origins of the reference images respectively with predetermined positions on the detected image; comparing a region within the detected image with corresponding one of the reference images while moving the origin of the reference image in X and Y directions from the corresponding predetermined position and sequentially acquiring correlation values; integrating the correlation values at respective comparison positions within an integrated XY plane to generate integrated correlation values; and recognizing a value of integrated XY coordinates at a peak of the integrated correlation values as deviation of the specific patterns in the reference images from the predetermined positions of the target within the XY plane.

Abstract: A pattern position detecting method capable of reducing time for detecting a component position includes: acquiring a model image of a target; dividing the acquired model image into reference images each including a specific pattern; acquiring a detected image of the target; matching origins of the reference images respectively with predetermined positions on the detected image; comparing a region within the detected image with corresponding one of the reference images while moving the origin of the reference image in X and Y directions from the corresponding predetermined position and sequentially acquiring correlation values; integrating the correlation values at respective comparison positions within an integrated XY plane to generate integrated correlation values; and recognizing a value of integrated XY coordinates at a peak of the integrated correlation values as deviation of the specific patterns in the reference images from the predetermined positions of the target within the XY plane.

Abstract: A sensor, includes a working electrode including a first layer formed of a polymeric material. The first layer includes a first surface across which an analyte in a sample can be transported and a second surface generally opposite of the first surface. The first layer satisfies the formula l?(?DmRT/|zi|FV)1/2, where l is effective thickness of the first layer, Dm is a diffusion coefficient of an analyte in the membrane phase, R is molar gas constant, T is temperature, zi is a charge of an analyte or ion-analyte complex, F is faraday constant, v is a rate of a potential sweep during a stripping process and ? is no greater than 10. The working electrode also includes a second layer in contact with the second surface of first layer. The second layer is adapted to undergo at least one of a reduction reaction or an oxidization reaction. The working electrode further includes a support including a solid electrically conductive material in electrical connection with the second layer.