Abstract: An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Abstract: An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Abstract: An electronic component built-in module includes an electronic component, a substrate on which the electronic component is mounted, a first resin covering the electronic component and the substrate, and a second resin covering the surface of the first resin. The first resin is formed of a resin including pores. The first resin is formed so that the thickness of the first resin on an area where the electronic component is not mounted is larger than that on an area where the electronic component is mounted on the surface of the substrate. A porosity of the second resin is smaller than that of the first resin.

Abstract: A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.

Abstract: The present invention provides an electronic module and fabrication method thereof in which the mounting area of an electronic component can be increased and connection failure between a ground electrode and metal shield can be suppressed to sufficiently ensure the connection strength between the ground electrode and conductive shield. In an electronic module 100, an electronic component 60 is mounted on a multi-layer substrate 1 incorporating a semiconductor device 30 and the like, and these are sealed by a sealing layer 110 of epoxy resin or the like, and further the sealing layer 110 and multi-layer substrate 1 are covered with a metal shield 120. The multi-layer substrate 1 and metal shield 120 are electrically connected via a ground electrode GN exposed as a result of cutting away a part of the multi-layer substrate 1.

Abstract: A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.

Abstract: An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate 11 that is formed with a first transmission line 11a and a high-frequency device 13 that is mounted on the first dielectric substrate 11 and is connected to the first transmission line 11a. The antenna-side module B is equipped with a second dielectric substrate 12 that is laid on the first dielectric substrate 11 in such a manner that they are arranged in a lamination direction and that is formed with a second transmission line 12a that is electrically connected to the first transmission line 11, and an antenna element 14 that is provided on the second dielectric substrate 12 and electrically connected to the high-frequency device 13 via the second transmission line 12a and the first transmission line 11a.

Abstract: An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components 16; wherein the electronic components 16 are mounted on the mounting substrate 11 via a substrate component 19 having a higher heat resistance than the mounting substrate 11 and that the mounting substrate 11 is composed of a member having a lower dielectric constant that the substrate component 19.

Abstract: An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.

Abstract: An electronic component module includes a mounting substrate including a shield layer and on which a first cavity and a second cavity are formed. A first electronic component positioned in the first cavity is used in a first frequency band. A second electronic component positioned in the second cavity is used in a second frequency band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface. And, connection terminals formed on the mounting substrate are electrically connected to the electronic components through transmission lines.

Abstract: An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate 11 that is formed with a first transmission line 11a and a high-frequency device 13 that is mounted on the first dielectric substrate 11 and is connected to the first transmission line 11a. The antenna-side module B is equipped with a second dielectric substrate 12 that is laid on the first dielectric substrate 11 in such a manner that they are arranged in a lamination direction and that is formed with a second transmission line 12a that is electrically connected to the first transmission line 11, and an antenna element 14 that is provided on the second dielectric substrate 12 and electrically connected to the high-frequency device 13 via the second transmission line 12a and the first transmission line 11a.

Abstract: An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.

Abstract: An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface, and connection terminals 18 formed on the mounting substrate 11 and electrically connected to the electronic components 16 through transmission lines 12.

Abstract: An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components 16; wherein the electronic components 16 are mounted on the mounting substrate 11 via a substrate component 19 having a higher heat resistance than the mounting substrate 11 and that the mounting substrate 11 is composed of a member having a lower dielectric constant that the substrate component 19.

Abstract: Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.

Abstract: The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar &agr;-olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.

Abstract: Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.

Abstract: An optical recording medium comprising a pair of substrates each having an electrode, the space between the substrate is filled with a high-dielectric liquid crystal to form a rewritable recording layer. The recording medium comprises radiation absorbing means to provide a change of directional orientation of the liquid crystal upon exposure to a laser beam.

Abstract: An optical recording disk wherein information is written and reproduced through the application of recording and reading laser beams is assembled by preparing a pair of circular substrates which each are provided with a plurality of studs or spikes on outer and/or inner circumferential band, forming a recording layer of dye on each substrate, and joining the substrates together through the studs by ultrasonic sealing or adhesive bonding such that the recording layers face one another via an interior space.

Abstract: This invention relates to an optical recording medium comprising a recording layer of a dye or dye composition on a substrate and adapted to be written and read using light such as laser or the like. The optical recording medium of the invention is characterized by further comprising a surface layer formed of a coating of a colloidal particle dispersion of a silicon base condensate on the recording layer, with improved S/N ratio as well as improved writing sensitivity and reading output of the optical recording medium.