Patents by Inventor Shigeru Haeno

Shigeru Haeno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
    Patent number: 10251265
    Abstract: The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm?1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm?1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: April 2, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Akiko Kawaguchi, Nozomu Takano, Yasuyuki Mizuno, Kazumasa Takeuchi, Shigeru Haeno, Yoshinori Nagai, Masato Fukui
  • PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
    Publication number: 20180098425
    Abstract: The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm?1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm?1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Inventors: Akiko Kawaguchi, Nozomu Takano, Yasuyuki Mizuno, Kazumasa Takeuchi, Shigeru Haeno, Yoshinori Nagai, Masato Fukui
  • PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
    Publication number: 20110272185
    Abstract: The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm?1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm?1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
    Type: Application
    Filed: January 28, 2010
    Publication date: November 10, 2011
    Inventors: Akiko Kawaguchi, Nozomu Takano, Yasuyuki Mizuno, Kazumasa Takeuchi, Shigeru Haeno, Yoshinori Nagai, Masato Fukui