Abstract: A bonding method and apparatus that uses a position detection camera which takes images of a workpiece and a light path conversion device which directs the image of an area near the lower end of a capillary to the position detection camera. The image acquired by the position detection camera is processed, and an execution is made so as, for instance, to measure the diameter of a ball formed on a wire extending from the lower end of the capillary, to measure the tail length extending from the lower end of the capillary, to measure the ball position from the undersurface of the capillary, to observe the bending of the tail of the wire, to inspect the external appearance of the capillary, and to measure the amplitude of vibration of the capillary when an ultrasonic vibration is applied to the capillary.

Abstract: In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference pattern by a laser diode, and the deviation between the reference member and tool in one horizontal direction is measured based upon the image of the reference pattern projected on the tool. A position detection camera images the tool in another horizontal direction, thus measuring the deviation of the tool and reference member. The position detection camera is moved to approach the reference member, and the deviation between the position detection camera and the reference member is measured by the position detection camera. The accurate offset amounts between the position detection camera and the tool are determined based upon these measured values and amounts of movement of the position detection camera and the tool.

Abstract: In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference pattern by a laser diode, and the deviation between the reference member and tool in one horizontal direction is measured based upon the image of the reference pattern projected on the tool. A position detection camera images the tool in another horizontal direction, thus measuring the deviation of the tool and reference member. The position detection camera is moved to approach the reference member, and the deviation between the position detection camera and the reference member is measured by the position detection camera. The accurate offset amounts between the position detection camera and the tool are determined based upon these measured values and amounts of movement of the position detection camera and the tool.

Abstract: A bonding apparatus that includes a bonding tool through which a wire passes and which performs bonding on a workpiece, a position detection camera which takes images of the workpiece, a reference member which is disposed in a specified position, and an optical assembly which conducts the image of the tool and reference member to the position detection camera. A lens used in the position detection camera and a lens installed in the optical assembly are arranged so that such lenses construct an afocal optical system.

Abstract: A wire bonding apparatus including a bonding tool that performs bonding on a bonding part, a position detection camera which has a lens barrel and images the bonding part, a light source which emits illuminating light downward through the lens barrel, and a light path conversion device that directs an image of an area near the lower end of the tool to the position detection camera. The light path conversion device includes a wavelength-selective filter that is provided so as to be within a light path of the image of the area near the lower end of the tool. The wavelength-selective filter allows illuminating light of the light path conversion device to pass therethrough but prevents the illuminating light from the lens barrel side from passing therethrough.

Abstract: A bonding apparatus that includes a bonding tool through which a wire passes and which performs bonding on a workpiece, a position detection camera which takes images of the workpiece, a reference member which is disposed in a specified position, and an optical assembly which conducts the image of the tool and reference member to the position detection camera. A lens used in the position detection camera and a lens installed in the optical assembly are arranged so that such lenses construct an afocal optical system.

Abstract: A bonding method and apparatus that uses a position detection camera which takes images of a workpiece and a light path conversion device which directs the image of an area near the lower end of a capillary to the position detection camera. The image acquired by the position detection camera is processed, and an execution is made so as, for instance, to measure the diameter of a ball formed on a wire extending from the lower end of the capillary, to measure the tail length extending from the lower end of the capillary, to measure the ball position from the undersurface of the capillary, to observe the bending of the tail of the wire, to inspect the external appearance of the capillary, and to measure the amplitude of vibration of the capillary when an ultrasonic vibration is applied to the capillary.

Abstract: A wire bonding apparatus including a bonding tool that performs bonding on a bonding part, a position detection camera which has a lens barrel and images the bonding part, a light source which emits illuminating light downward through the lens barrel, and a light path conversion device that directs an image of an area near the lower end of the tool to the position detection camera. The light path conversion device includes a wavelength-selective filter that is provided so as to be within a light path of the image of the area near the lower end of the tool. The wavelength-selective filter allows illuminating light of the light path conversion device to pass therethrough but prevents the illuminating light from the lens barrel side from passing therethrough.

Abstract: In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference pattern by a laser diode, and the deviation between the reference member and tool in one horizontal direction is measured based upon the image of the reference pattern projected on the tool. A position detection camera images the tool in another horizontal direction, thus measuring the deviation of the tool and reference member. The position detection camera is moved to approach the reference member, and the deviation between the position detection camera and the reference member is measured by the position detection camera. The accurate offset amounts between the position detection camera and the tool are determined based upon these measured values and amounts of movement of the position detection camera and the tool.

Abstract: Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and bonding tool in the X and Y directions are acquired by an offset correction camera. In this way, the amount of deviation between the bonding tool and the reference member is measured. Then, a position detection camera is caused to approach the reference member, and the amount of deviation between the optical axis of the position detection camera and the reference member is measured by the position detection camera. The accurate offset amount are determined on the basis of these measured values and the amounts of movement.

Abstract: A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Abstract: A bonding apparatus with an optical detecting device that detects any positional discrepancy between first and second parts which are to be bonded together, the optical detecting device including an optical probe that comprises: first and second image acquisition prisms which respectively reflect, in different directions, first and second images of the first and second parts respectively; a first optical system introduction prism (or mirrors) which causes the first image of the first part that passes through the first image acquisition prism to be reflected an even number of times and then sends this first image to a first image pick-up device through a first focusing device; and a second optical system introduction prism which causes the second image of the second part that passes through the second image acquisition prism to be reflected an odd number of times and then sends this second image to a second image pick-up device through a second focusing device.

Abstract: In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference pattern by a laser diode, and the deviation between the reference member and tool in one horizontal direction is measured based upon the image of the reference pattern projected on the tool. A position detection camera images the tool in another horizontal direction, thus measuring the deviation of the tool and reference member. The position detection camera is moved to approach the reference member, and the deviation between the position detection camera and the reference member is measured by the position detection camera. The accurate offset amounts between the position detection camera and the tool are determined based upon these measured values and amounts of movement of the position detection camera and the tool.

Abstract: In a flip-chip bonding apparatus, a die inverting device is installed on an optical recognition device so that a vacuum suction chucking nozzle that is provided on the die inverting device can rotate in the direction of a pick-up position and in the direction of a die transfer position in an outside area of an open window of the optical recognition device, so that the bonding apparatus can be compact and has an improved precision of recognition of the amount of positional deviation of the die.

Abstract: Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and bonding tool in the X and Y directions are acquired by an offset correction camera. In this way, the amount of deviation between the bonding tool and the reference member is measured. Then, a position detection camera is caused to approach the reference member, and the amount of deviation between the optical axis of the position detection camera and the reference member is measured by the position detection camera. The accurate offset amount are determined on the basis of these measured values and the amounts of movement.

Abstract: A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Abstract: An illumination system includes a fly's eye lens including lens elements each having an approximately oblong shape in section perpendicular to an optical axis of the illumination system, and an optical system for separating light from a light source into plural lights and for directing the plural lights toward the fly's eye lens along different directions. The optical system is arranged so that paths of the plural lights are juxtaposed along a lengthwise direction of the oblong shapes. A device manufacturing method includes transferring a device pattern of a mask onto a workpiece using such an illumination system.

Abstract: A projection exposure apparatus includes a secondary light source forming device having a light entrance surface and a light exit surface, for receiving light from a light source with the light entrance surface and for forming a secondary light source at the light exit surface side, a light projecting system for projecting light from the secondary light source to an object plane, a pattern projecting system for projecting, onto an image plane, a pattern on the object plane irradiated with the light, a secondary light source adjusting device for changing a light intensity distribution of the secondary light source, and an illuminance correcting device for substantially correcting illuminance non-uniformness, asymmetric with respect to an optical axis, formed or to be formed on the image plane with the change of the light intensity distribution.

Abstract: An illumination device, includes a secondary light source forming system having a deflecting member with a conical light deflecting surface for transforming received light into substantially ring-like light, the secondary light source forming system forming a ring-like secondary light source by using the ring-like light; and an optical system for projecting divergent lights from portions of the secondary light source obliquely onto a surface to be illuminated so that the projected lights are superposed one upon another on the surface.

Abstract: An image projection apparatus and method is disclosed wherein a stop having a rectangular opening is disposed in an illumination optical system and, through the function of this stop, a rectangular effective light source is defined on a pupil of a projection optical system. With light from this effective light source, longitudinal and transverse patterns of a reticle extending substantially along the configuration of the effective light source are illuminated. Zeroth order and first order diffraction light caused by these patterns is incident and distributed on the pupil so as to define thereon a rectangular configuration about the center of the pupil, and the longitudinal and transverse patterns are imaged with the diffraction light.