Abstract: The aim is to regulate thickness on the optical axis in the production of wafer lenses. Disclosed is a wafer lens production method that is equipped with a dispensing process for dropping resin onto a molding die (64), an imprinting process for pressing either the molding die (64) or a glass substrate (2) toward the other, and a releasing process for releasing the glass substrate (2) from the molding die (64), and that repeats the processing from the dispensing process to the releasing process as a single cycle and successively forms resin lenses (4) on the glass substrate 2); wherein the height (A) of the non-lens area (6) surrounding the lenses (4) and the heights (B and C) of the glass substrate (2) are measured between the releasing process of a first cycle and the dispensing process of a second cycle, and the position of the molding die (64) is corrected for imprinting processes of the second cycle, on the basis of the heights (A-C).

Abstract: Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.

Abstract: Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens (1) includes a first intermediate die production step using a die (7), a second intermediate die production step using the first intermediate die (8), and a wafer lens production step using the second intermediate die (9). A first intermediate-die substrate (80) is provided with a depressed section (85) on the surface facing the die (7). When photo-curable resin (84A) is pressed, at least a portion closer to the first intermediate-die substrate (80) among the top (71a) and the peripheral section (77) of the die (7) is arranged in the depressed section (85), and a gap is provided so that the die (7) does not contact with a depressed plane (85a) of the depressed section (85).

Abstract: Provided are a method and an apparatus for continuously forming a laminated optical function element sheet which has optical function elements formed on three or more faces by laminating a first optical function element sheet which has an optical function element formed on both of the front and back faces with a second optical function element sheet which has an optical function element formed on at least one of the two faces.

Abstract: The present invention aims to improve shape precision of a molded body when a plurality of molded bodies, which are projections or recesses made of a curable resin, are formed on both sides of a glass substrate. Disclosed is a method for producing a molded body, which comprises a step of preparing a first mold having a plurality of negative molding surfaces having shapes corresponding to a plurality of molding parts; a step of applying a curable resin onto a surface of the first mold on which the molding surfaces are formed; and a curing step of curing the applied curable resin. The curing step includes a photocuring step wherein curing of the curable resin is carried out by irradiating the resin with light, and a heat curing step wherein the curable resin partly cured by the photocuring step is further cured by being subjected to a heat treatment.

Abstract: A machining method of machining a transfer optical surface on a optical element producing die having the transfer optical surface made of a material having Vickers hardness of Hv1500 or more, comprising: machining the transfer optical surface on the optical element producing die by cutting with a cutting tool, wherein a rake face of a tip of a blade of the cutting tool is set with an angle of minus values at an incising point on a surface to be machined.

Abstract: There is provided a method for producing a wafer lens assembly capable of adhering a wafer lens and a spacer surely. The wafer lens assembly includes a first substrate including plural optical members formed of a curable resin on at least one surface, a second substrate joined to the first substrate, and a stop member arranged between the first and second substrates. The first and second substrates are adhered with an adhesive made of a photo-curable resin. The method includes an adhesive applying step of applying the adhesive made of a photo-curable resin on a joining area, a stop-member forming step, and a photo-curing step of irradiating and hardening the adhesive applied in the adhesive applying step with light after the stop-member forming step. The stop member is formed so as not to prevent the light irradiated in the photo-curing step from reaching the adhesive.

Abstract: Provided are a method and an apparatus for continuously forming a laminated optical function element sheet which has optical function elements formed on three or more faces by laminating a first optical function element sheet which has an optical function element formed on both of the front and back faces with a second optical function element sheet which has an optical function element formed on at least one of the two faces.

Abstract: It is possible to provide a camera module manufacturing method and a camera model which can improve performance of a camera module without complicating the manufacturing method. A light shield is formed on the side surface of each lens body (11) and a lens support member (12). Thus it is possible to obtain the diaphragm function for regulating the incident light flux transmission area and the function for suppressing the intrusion of stray light without using a separate diaphragm or a light shielding member.

Abstract: It is found that alloys including amorphous phase comprising at least a first element selected from the group consisting of Pt and Ru, at least a second element selected from the group consisting of Zr, Hf, Si, Ir, Ru, Pd and Ni, and at least a third element selected from the group consisting of Si, Cu, Cr, Fe, Mo, Co, Al, Zr, Hf, Ni and Ru have excellent machining characteristics, heat-resistant characteristics, corrosion resistance and adhesion resistance. Using the alloys as the molding surface of a die, a heat resistant molding die for forming glass optical device having fine structure for performing high definite functions became possible to manufacture with excellent machining characteristics.

Abstract: Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.

Abstract: There is provided a method for producing a wafer lens assembly capable of adhering a wafer lens and a spacer surely. The wafer lens assembly includes a first substrate including plural optical members formed of a curable resin on at least one surface, a second substrate joined to the first substrate, and a stop member arranged between the first and second substrates. The first and second substrates are adhered with an adhesive made of a photo-curable resin. The method includes an adhesive applying step of applying the adhesive made of a photo-curable resin on a joining area, a stop-member forming step, and a photo-curing step of irradiating and hardening the adhesive applied in the adhesive applying step with light after the stop-member forming step. The stop member is formed so as not to prevent the light irradiated in the photo-curing step from reaching the adhesive.

Abstract: A cutting tool including a cutting blade, a shank section, and a supporting member for supporting and fixing the cutting blade, the cutting blade being fixed on one end of the supporting member, and the other end of the supporting member being fixed to the shank section, wherein a void formed among the shank section, the cutting blade, and the supporting member is filled with a filling agent.

Abstract: An invention for producing a wafer lens is disclosed in which a cured resin is prevented from having projection portions or unfilled sections. The method comprises a dispense step in which resin is dropped onto a die having plural cavities arranged to leave spaces therebetween, an alignment step in which the positions of the die and a glass substrate are adjusted, an imprint step in which one of the die and the glass substrate is pressed against the other, a curing step in which the resin is cured, and a release step in which the glass substrate is released from the die, the steps from the dispense step to the separation step being repeated as one cycle to successively form plastic lens portions on the glass substrate, wherein in the alignment step in each cycle, the cavities of the die are placed between the formed lens parts.

Abstract: The aim is to regulate thickness on the optical axis in the production of wafer lenses. Disclosed is a wafer lens production method that is equipped with a dispensing process for dropping resin onto a molding die (64), an imprinting process for pressing either the molding die (64) or a glass substrate (2) toward the other, and a releasing process for releasing the glass substrate (2) from the molding die (64), and that repeats the processing from the dispensing process to the releasing process as a single cycle and successively forms resin lenses (4) on the glass substrate 2); wherein the height (A) of the non-lens area (6) surrounding the lenses (4) and the heights (B and C) of the glass substrate (2) are measured between the releasing process of a first cycle and the dispensing process of a second cycle, and the position of the molding die (64) is corrected for imprinting processes of the second cycle, on the basis of the heights (A-C).

Abstract: There is provided a method for producing a wafer lens assembly capable of adhering a wafer lens and a spacer surely. The wafer lens assembly includes a first substrate including plural optical members formed of a curable resin on at least one surface, a second substrate joined to the first substrate, and a stop member arranged between the first and second substrates. The first and second substrates are adhered with an adhesive made of a photo-curable resin. The method includes an adhesive applying step of applying the adhesive made of a photo-curable resin on a joining area, a stop-member forming step, and a photo-curing step of irradiating and hardening the adhesive applied in the adhesive applying step with light after the stop-member forming step. The stop member is formed so as not to prevent the light irradiated in the photo-curing step from reaching the adhesive.

Abstract: Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens (1) includes a first intermediate die production step using a die (7), a second intermediate die production step using the first intermediate die (8), and a wafer lens production step using the second intermediate die (9). A first intermediate-die substrate (80) is provided with a depressed section (85) on the surface facing the die (7). When photo-curable resin (84A) is pressed, at least a portion closer to the first intermediate-die substrate (80) among the top (71a) and the peripheral section (77) of the die (7) is arranged in the depressed section (85), and a gap is provided so that the die (7) does not contact with a depressed plane (85a) of the depressed section (85).

Abstract: Provided is an injection nozzle and a molding apparatus which ensure injection pressure by suppressing resin leakage even when a resin material having a low viscosity is used. In injection molding, it is especially important that the injection nozzle and a fixed die are excellently kept in contact with each other and that the resin is not leaked. Resin leakage from between the injection nozzle and the fixed die lowers molding pressure, increases molding shrinkage of the resin, and directly affects the qualities of a molded product resulting in generation of a sink, transfer failure and the like. Since an O-ring in a circumferential groove of the nozzle closely comes in contact with a concave spherical surface while elastically transforming on the entire circumference, leakage is effectively suppressed even the resin is a heat-curable resin having a low viscosity.

Abstract: In a vibration cutting unit, a root portion of a holding member for supporting a vibration body is fixed on a fixed portion of a node portion which is common to axial vibration and bending vibration, on a jointless basis. Therefore, the node portion, namely, a vibration body main part is firmly fixed, thereby, the vibration body main part is supported stably, and vibrations of the vibration body main part is stabilized. In other words, vibrations under the mode where the vibration body main part cannot be controlled can be restrained, and works representing objects to be processed can be processed accurately.

Abstract: Provided are a structure of molding tools and an injection molding device that can easily perform molding of an optical element even from a resin of low velocity or the like and can suppress any negative effects by air. The structure of the molding tools includes between the molding tools (61, 62) a fixed molding tool (61) and a movable molding tool (62) and an O-ring (63a) for keeping air tightness and a resin seal (63b) for preventing any resin leakage. The O-ring (63a) performs decreasing of the pressure in a cavity (CV) formed by joining the molding tools (61, 62), whereby the vacuum molding in which resin supply and resin curing is carried out under a decreased pressure can be performed. Accordingly, the effects such as prevention of air bubbling due to air trapping by injected resin within the cavity (CV) can be attained. Furthermore, the resin seal (63b) can prevent any resin leakage from the molding tools (61, 62) even when the resin having a low viscosity is used.