Abstract: A method performed by a processor of a plasma processing system including a transfer device and a plasma processing apparatus that includes a process chamber. The process chamber includes a mount table on a surface of which a first focus ring is placed. The method includes controlling the transfer device to transfer the first focus ring out of the process chamber without opening the process chamber to the atmosphere; after the first focus ring is transferred out of the process chamber, controlling the plasma processing apparatus to clean the surface of the mount table; and after the surface of the mount table is cleaned, controlling the transfer device to transfer a second focus ring into the process chamber and place the second focus ring on the surface of the mount table without opening the process chamber to the atmosphere.

Abstract: A method performed by a processor of a plasma processing system including a transfer device and a plasma processing apparatus that includes a process chamber. The process chamber includes a mount table on a surface of which a first focus ring is placed. The method includes controlling the transfer device to transfer the first focus ring out of the process chamber without opening the process chamber to the atmosphere; after the first focus ring is transferred out of the process chamber, controlling the plasma processing apparatus to clean the surface of the mount table; and after the surface of the mount table is cleaned, controlling the transfer device to transfer a second focus ring into the process chamber and place the second focus ring on the surface of the mount table without opening the process chamber to the atmosphere.

Abstract: A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; by referring to a storage unit that stores a parameter data set related to a transport condition for each substrate type, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined type of the substrate to process the substrate, and, after automatically determining the type of the substrate, and before transporting the substrate stored in the substrate storage container, performing mapping based on conditions set in the parameter data set to detect an abnormality of the substrate stored in the substrate storage container.

Abstract: A method performed by a processor of a plasma processing system including a transfer device and a plasma processing apparatus that includes a process chamber. The process chamber includes a mount table on a surface of which a first focus ring is placed. The method includes controlling the transfer device to transfer the first focus ring out of the process chamber without opening the process chamber to the atmosphere; after the first focus ring is transferred out of the process chamber, controlling the plasma processing apparatus to clean the surface of the mount table; and after the surface of the mount table is cleaned, controlling the transfer device to transfer a second focus ring into the process chamber and place the second focus ring on the surface of the mount table without opening the process chamber to the atmosphere.

Abstract: A method performed by a processor of a plasma processing system including a transfer device and a plasma processing apparatus that includes a process chamber. The process chamber includes a mount table on a surface of which a first focus ring is placed. The method includes controlling the transfer device to transfer the first focus ring out of the process chamber without opening the process chamber to the atmosphere; after the first focus ring is transferred out of the process chamber, controlling the plasma processing apparatus to clean the surface of the mount table; and after the surface of the mount table is cleaned, controlling the transfer device to transfer a second focus ring into the process chamber and place the second focus ring on the surface of the mount table without opening the process chamber to the atmosphere.

Abstract: A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; by referring to a storage unit that stores a parameter data set related to a transport condition for each substrate type, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined type of the substrate to process the substrate, and, after automatically determining the type of the substrate, and before transporting the substrate stored in the substrate storage container, performing mapping based on conditions set in the parameter data set to detect an abnormality of the substrate stored in the substrate storage container.

Abstract: A method performed by a processor of a plasma processing system including a transfer device and a plasma processing apparatus that includes a process chamber. The process chamber includes a mount table on a surface of which a first focus ring is placed. The method includes controlling the transfer device to transfer the first focus ring out of the process chamber without opening the process chamber to the atmosphere; after the first focus ring is transferred out of the process chamber, controlling the plasma processing apparatus to clean the surface of the mount table; and after the surface of the mount table is cleaned, controlling the transfer device to transfer a second focus ring into the process chamber and place the second focus ring on the surface of the mount table without opening the process chamber to the atmosphere.

Abstract: A substrate transfer method of a substrate processing apparatus that includes a load lock chamber including a drive unit that is capable of forming, between a first opening at an atmospheric side and a second opening connected to a transfer chamber of a housing of the load lock chamber, each of a first space in which a single substrate is capable of being transferred, and a second space in which a plurality of substrates are capable of being transferred, the substrate transfer method including selecting either of the first space or the second space of the load lock chamber in accordance with process statuses of substrates at a plurality of processing chambers, and controlling the drive unit based on the selected result to form either of the first space or the second space.

Abstract: A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; and, by referring to a storage unit that stores parameter data set related to a transport condition for each type of substrate, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined substrate type to process the substrate.

Abstract: A plasma processing system includes a plasma processing apparatus, a transfer device, and a processor configured to perform a process that includes removing deposits on a wall of a process chamber of the plasma processing apparatus, on a substrate mounting surface of a mount table of the process chamber, and on a first focus ring on a focus-ring mounting surface of the mount table; after removing the deposits, transferring the first focus ring out of the process chamber without opening the process chamber to atmosphere; cleaning the focus-ring mounting surface after the first focus ring is transferred out of the process chamber and before a second focus ring is transferred into the process chamber; and transferring the second focus ring into the process chamber and placing the second focus ring on the focus-ring mounting surface without opening the process chamber to the atmosphere.

Abstract: A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; and, by referring to a storage unit that stores parameter data set related to a transport condition for each type of substrate, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined substrate type to process the substrate.

Abstract: A method performed by a processor of a plasma processing system including a transfer device and a plasma processing apparatus that includes a process chamber. The process chamber includes a mount table on a surface of which a first focus ring is placed. The method includes controlling the transfer device to transfer the first focus ring out of the process chamber without opening the process chamber to the atmosphere; after the first focus ring is transferred out of the process chamber, controlling the plasma processing apparatus to clean the surface of the mount table; and after the surface of the mount table is cleaned, controlling the transfer device to transfer a second focus ring into the process chamber and place the second focus ring on the surface of the mount table without opening the process chamber to the atmosphere.

Abstract: A substrate transfer method of a substrate processing apparatus that includes a load lock chamber including a drive unit that is capable of forming, between a first opening at an atmospheric side and a second opening connected to a transfer chamber of a housing of the load lock chamber, each of a first space in which a single substrate is capable of being transferred, and a second space in which a plurality of substrates are capable of being transferred, the substrate transfer method including selecting either of the first space or the second space of the load lock chamber in accordance with process statuses of substrates at a plurality of processing chambers, and controlling the drive unit based on the selected result to form either of the first space or the second space.

Abstract: A method for replacing plural substrates to be processed by a substrate processing apparatus which includes a substrate processing chamber, a load lock chamber, and a conveying apparatus including first and second conveying members for conveying the plural substrates into and out from the substrate processing chamber and the load lock chamber. The method includes the steps of a) conveying a first substrate out from the substrate processing chamber with the first conveying member, b) conveying a second substrate into the substrate processing chamber with the second conveying member, c) conveying the second substrate out from the load lock chamber with the second conveying member, and d) conveying the first substrate into the load lock chamber with the first conveying member. The steps c) and d) are performed between step a) and step b).

Abstract: A substrate processing apparatus includes a conveying arm configured to convey a substrate and including an electrostatic chuck for attracting the substrate placed on the conveying arm; and a control unit configured to not apply a voltage for causing the electrostatic chuck to attract the substrate between electrodes of the electrostatic chuck when the substrate is placed on the conveying arm but the conveying arm is not moving, and to apply the voltage between the electrodes of the electrostatic chuck when the substrate is placed on the conveying arm and the conveying arm is moving.

Abstract: There is provided a substrate processing apparatus cleaning method for removing contaminants adhered on a transfer arm. The cleaning method for the transfer arm that transfers a substrate and has an electrostatic chuck includes a voltage applying process for applying, when electrically charged contaminants are adhered on the transfer arm and the substrate is not mounted on the transfer arm, a voltage of the same polarity as that of the electrically charged contaminants to each electrode of the electrostatic chuck, to thereby remove the contaminants adhered on the transfer arm.

Abstract: A transfer apparatus (20) for a target substrate (W) includes a rotatable rotary base (24). First and second arm mechanisms (26, 28) are attached to the rotary base and configured to bend and stretch. Each of the first and second arm mechanisms has a proximal end arm (26A, 28A), an intermediate arm (26B, 28B), and a pick (26C, 28C) which are pivotally coupled to each other sequentially from the rotary base. The picks are disposed to support the target substrate. A link mechanism (30) is coupled to the proximal end arms of the first and second arm mechanisms to drive the first and second arm mechanisms. A first driving source (32) is disposed to rotatably drive the rotary base. A second driving source (34) is disposed to drive the link mechanism so as to bend or stretch the first and second arm mechanisms.

Abstract: A method for replacing plural substrates to be processed by a substrate processing apparatus which includes a substrate processing chamber, a load lock chamber, and a conveying apparatus including first and second conveying members for conveying the plural substrates into and out from the substrate processing chamber and the load lock chamber. The method includes the steps of a) conveying a first substrate out from the substrate processing chamber with the first conveying member, b) conveying a second substrate into the substrate processing chamber with the second conveying member, c) conveying the second substrate out from the load lock chamber with the second conveying member, and d) conveying the first substrate into the load lock chamber with the first conveying member. The steps c) and d) are performed between step a) and step b).

Abstract: Processing chambers (3A-3F) for applying a process to a substrate W housed therein are provided at a periphery of a conveying chamber 2. A conveying case (4) houses the substrate (W) in a state isolated from an outside atmosphere. The conveyance case (4) has a gate valve (30) and a transfer mechanism (22). A conveying mechanism (5) supports the conveyance case 4, and carries the conveyance case (4) to a position for conveying in/conveying out a substrate. The number of processing chambers connectable to a conveying chamber is not limited, and conveyance to the processing chamber can be executed while maintaining a predetermined ambience for an atmosphere of a substrate that is to be processed.

Abstract: A main carrying device forming a part of a processing system, comprising a casing (40) forming a main carrying chamber (44) having vacuum atmosphere, the casing (40) further comprising a plurality of transfer ports (52A, 52B) for transferring the processed body (W) between the carrying chamber 44 and the outside, a mobile body (58) is slidably installed on a guide rail (48) horizontally installed in the carrying chamber (44), a linear motor mechanism (54, 62) for moving the mobile body (58) along the guide rail (48) is installed, a holding body (64) for holding the processed body (W) is liftably connected to the mobile body (58) through a support member (66), and a lifting mechanism (74) for lifting the support member (66) relative to the mobile body (58) is installed in the casing (40) at a position corresponding to the transfer ports (52A, 52B).