Patents by Inventor Shigeru Kadota
Shigeru Kadota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110056384Abstract: A humidity control and ventilation system for a building with an absorption-type humidity controller includes an air supply passage, air discharge passage and a processing unit. The air supply passage is configured to conduct intake air from an exterior inlet port, which is located at an outside of the building, to an interior outlet port, which is located at an inside of the building. The processing unit is inserted in the air supply passage. The air supply passage includes an intake duct that is located between the processing unit and the interior outlet port, and the intake duct includes a vertically extending section, which extends in a vertical direction to create an upflow of the intake air conducted from the processing unit toward the interior outlet port.Type: ApplicationFiled: September 8, 2010Publication date: March 10, 2011Applicant: DENSO CORPORATIONInventor: Shigeru Kadota
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Patent number: 7562695Abstract: A cooling device has a case defining a first space through which a first fluid flows and a second space through which a second fluid having the temperature lower than that of the first fluid flows. A first heat exchanger is disposed in the first space for performing heat exchange between the first fluid and a refrigerant, thereby to evaporate the refrigerant. A second heat exchanger is disposed in the second space for performing heat exchange between the second fluid and the refrigerant evaporated in the first heat exchanger, thereby to transfer heat of the refrigerant to the second fluid. The case defines a first dimension in a first direction and a second dimension in a second direction perpendicular to the first direction in a transverse cross-section. The second dimension is larger than the first dimension. The first space and the second space are arranged in the second direction.Type: GrantFiled: November 2, 2006Date of Patent: July 21, 2009Assignee: Denso CorporationInventors: Shigeru Kadota, Kazutoshi Nishizawa, Tetsuya Takeuchi, Akira Ito, Satoru Nakamura
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Publication number: 20070102138Abstract: A cooling device has a case defining a first space through which a first fluid flows and a second space through which a second fluid having the temperature lower than that of the first fluid flows. A first heat exchanger is disposed in the first space for performing heat exchange between the first fluid and a refrigerant, thereby to evaporate the refrigerant. A second heat exchanger is disposed in the second space for performing heat exchange between the second fluid and the refrigerant evaporated in the first heat exchanger, thereby to transfer heat of the refrigerant to the second fluid. The case defines a first dimension in a first direction and a second dimension in a second direction perpendicular to the first direction in a transverse cross-section. The second dimension is larger than the first dimension. The first space and the second space are arranged in the second direction.Type: ApplicationFiled: November 2, 2006Publication date: May 10, 2007Applicant: DENSO CorporationInventors: Shigeru Kadota, Kazutoshi Nishizawa, Tetsuya Takeuchi, Akira Ito, Satoru Nakamura
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Patent number: 7054548Abstract: The central position of each heating body 1 in the fluid flow direction is referred to as a heating body central position, the central position of a heat radiating section 33a located between the neighboring heating bodies 1 in the fluid flow direction is referred to as a heat radiating section central position, the end of a heat radiating section 33b connected to a pump 6 on the opposite side of a heat absorbing section is referred to as a heat radiating section front, the distances along the fluid flow from the heating body central position to the heat radiating section central position are referred to as heat transport distances and the distances from the heating body central position to the heat radiating section front are referred to as heat transport distances. S>=the maximum heat transport distance Lmax holds. Lmax is the longest of the heat transport distances.Type: GrantFiled: July 12, 2005Date of Patent: May 30, 2006Assignee: DENSO CorporationInventors: Seiji Inoue, Kenichi Nara, Kimio Kohara, Shigeru Kadota, Nobunao Suzuki, Yukinori Hatano, Fumiaki Nakamura, Nobuyoshi Okada
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Publication number: 20060011332Abstract: The central position of each heating body 1 in the fluid flow direction is referred to as a heating body central position, the central position of a heat radiating section 33a located between the neighboring heating bodies 1 in the fluid flow direction is referred to as a heat radiating section central position, the end of a heat radiating section 33b connected to a pump 6 on the opposite side of a heat absorbing section is referred to as a heat radiating section front, the distances along the fluid flow from the heating body central position to the heat radiating section central position are referred to as heat transport distances and the distances from the heating body central position to the heat radiating section front are referred to as heat transport distances. S>=the maximum heat transport distance Lmax holds. Lmax is the longest of the heat transport distances.Type: ApplicationFiled: July 12, 2005Publication date: January 19, 2006Applicant: DENSO CorporationInventors: Seiji Inoue, Kenichi Nara, Kimio Kohara, Shigeru Kadota, Nobunao Suzuki, Yukinori Hatano, Fumiaki Nakamura, Nobuyoshi Okada
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Patent number: 6575230Abstract: According to the present invention, a cooling apparatus using boiling and condensing refrigerant, includes a fluid separating plate for separating a high-temperature fluid from a low-temperature fluid, a refrigerant tank disposed on the side of the high-temperature fluid from the fluid separating plate, a refrigerant sealed into the refrigerant tank, a pair of communication pipes, one end of which is communicated with the refrigerant tank hermetically, a condensing portion communicated with the other end of the communication pipes and disposed on the side of the low-temperature fluid from the fluid separating plate, and a heat insulating material as a high-temperature portion-side heat insulating material coated on the outer periphery of the high-temperature-side communication pipe. In this way, it is possible to suppress a heat conduction from a high-temperature portion (high-temperature air) to the high-temperature-side communication pipe.Type: GrantFiled: December 20, 1999Date of Patent: June 10, 2003Assignee: Denso CorporationInventors: Shigeru Kadota, Kiyoshi Kawaguchi, Tetsuya Takeuti, Kazuo Kobayashi, Takahide Ohara, Masahiko Suzuki, Hajime Sugito, Junichi Semura
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Patent number: 6357517Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating the heat of the boiled and vaporized refrigerant. The radiator has an inflow return chamber provided with a small-diameter opening having a diameter smaller than that of the inflow return chamber. The liquid refrigerant of the gas-liquid mixed refrigerant is dammed by the small-diameter opening of the inflow return chamber and the dammed liquid refrigerant is returned through a return passage to the refrigerant tank. Since the liquid refrigerant contained in the gas-liquid mixed refrigerant is suppressed from flowing by means of the small-diameter opening, the gaseous refrigerant can transfer heat directly to the walls of the radiating passages, so that the deterioration of the radiating performance can be prevented.Type: GrantFiled: October 25, 1999Date of Patent: March 19, 2002Assignee: Denso CorporationInventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki, Shigeru Kadota
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Patent number: 6125926Abstract: A heat exchanger is constructed by laminating rectangular shaped partition walls and corrugated fins alternately. A first fluid passage through which a high temperature internal air and a second fluid passage through which the low temperature external air flows are formed into rectangular parallelopipe-shape the longitudinal direction of which is upper and lower direction. The corrugated fin is disposed inside the fluid passage to incline frontwardly. A first fluid inlet is provided at an upper position and a first fluid outlet is provided at a lower position of the first fluid passage. While, a second fluid inlet is provided at a lower position and a second fluid outlet is provided at an upper position of the second fluid passage. That is, the first fluid and the second fluid flow in an opposite direction to each other.Type: GrantFiled: July 24, 1998Date of Patent: October 3, 2000Assignee: DENSO CorporationInventors: Yoshiyuki Okamoto, Kiyoshi Kawaguchi, Shigeru Kadota, Hajime Sugito
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Patent number: 6119767Abstract: According to the present invention, a cooling apparatus using boiling and condensing refrigerant, includes a fluid separating plate for separating a high-temperature fluid from a low-temperature fluid, a refrigerant tank disposed on the side of the high-temperature fluid from the fluid separating plate, a refrigerant sealed into the refrigerant tank, a pair of communication pipes, one end of which is communicated with the refrigerant tank hermetically, a condensing portion communicated with the other end of the communication pipes and disposed on the side of the low-temperature fluid from the fluid separating plate, and a heat insulating material as a high-temperature portion-side heat insulating material coated on the outer periphery of the high-temperature-side communication pipe. In this way, it is possible to suppress a heat conduction from a high-temperature portion (high-temperature air) to the high-temperature-side communication pipe.Type: GrantFiled: January 28, 1997Date of Patent: September 19, 2000Assignee: Denso CorporationInventors: Shigeru Kadota, Kiyoshi Kawaguchi, Tetsuya Takeuti, Kazuo Kobayashi, Takahide Ohara, Masahiko Suzuki, Hajime Sugito, Junichi Semura
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Patent number: 6073683Abstract: A cooling apparatus using boiling and condensing refrigerant for cooling a heat generating unit, includes a refrigerant tank having a wall surface, for containing the refrigerant therein, a heat generating unit boiling the refrigerant in the refrigerant tank by heating, and a radiator disposed in communication with the refrigerant tank for condensing and liquefying the boiling refrigerant in the tank. An interior of the refrigerant tank is partitioned into a vapor passage for leading the boiling refrigerant to the radiator, a condensed liquid passage in which the condensed and liquefied refrigerant flows downwardly, and a communication path formed at a lower side thereof for communicating between the vapor passage and the condensed liquid passage. The condensed liquid passage is defined by a part of the wall surface.Type: GrantFiled: July 3, 1996Date of Patent: June 13, 2000Assignee: Nippondenso Co., Ltd.Inventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Takahide Ohara, Shigeru Kadota, Masahiko Suzuki
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Patent number: 6039111Abstract: A cooling device includes: a partition plate for partitioning an interior of a case into a first fluid passage through which first fluid having a high temperature flows and a second fluid passage through which second fluid having a low temperature flows; a heat receiving portion disposed in the first fluid passage; a heat radiating portion disposed in the second fluid passage; and a connection pipe for communicating the heat receiving portion and the heat radiating portion. The heat radiating portion is disposed at an upper side of the heat receiving portion in such a manner that the second fluid from a front side of the heat radiating portion flows into a rear side of the heat radiating portion through a pipe space between the heat radiating portion and the heat receiving portion, and further passes through the heat radiating portion from the rear side toward the front side of the heat radiating portion. Thus, the cooling device has a small size while improving the cooling capacity of the cooling device.Type: GrantFiled: February 16, 1998Date of Patent: March 21, 2000Assignee: Denso CorporationInventors: Kiyoshi Kawaguchi, Shigeru Kadota, Kouji Kishita
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Patent number: 6026891Abstract: The cooling device of the present invention includes a casing divided into a first fluid passage and a second fluid passage by a fluid separation plate; a heat exchanger disposed to pass through the fluid separation plate, for receiving heat from high-temperature air flowing in the first fluid passage and for radiating the heat to the outside air flowing in the second fluid passage; an inside fan for blowing the high temperature air in the first fluid passage; an outside fan for blowing the outside air to the second fluid passage; and a thermistor for sensing a temperature of the high temperature air flowing in the first fluid passage. A rotational speed of each of the fans of the inside fan and the outside fan is variably controlled in response to a temperature detected by the thermistor with the controller. In this way, it is possible to cooling an interior of a closed box and to reduce the consumed electric power.Type: GrantFiled: June 10, 1997Date of Patent: February 22, 2000Assignee: Denso CorporationInventors: Koji Fujiyoshi, Shigeru Kadota, Kiyoshi Kawaguchi, Yukinori Suzuki, Shigeru Maehara, Koji Kishita
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Patent number: 5823248Abstract: According to the present invention, a cooling apparatus using boiling and condensing refrigerant, includes a refrigerant tank placed in a sealed space formed in a casing, and a radiator placed in a non-sealed space in the casing. Refrigerant is sealed in the refrigerant tank. The refrigerant tank has a metal base plate joined to one wall surface of an extrusion member constituting the refrigerant tank. A base plate has a first heating element having a high heating density fastened thereto with bolts. To another wall surface of the extrusion member is joined a heat-receiving fin which transmits the heat received from the air in the sealed space to the refrigerant in the refrigerant tank and is covered with a cover which also serves as a passage for the air from a fan. In the sealed space where the refrigerant tank is placed, plural second heating elements having low heating densities are placed without being directly attached thereto.Type: GrantFiled: September 30, 1996Date of Patent: October 20, 1998Assignee: Nippondenso Co., Ltd.Inventors: Shigeru Kadota, Takashi Furukawa, Kiyoshi Kawaguchi, Masahiko Suzuki, Kenji Yamada
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Patent number: 5806583Abstract: Cooling pipes having refrigerant sealed therein are made of flat-shaped pipes having a thin rectangular cross-section, and are disposed to pass through a through hole of a fluid separator. One side of the pipes disposed at a high temperature fluid side of the fluid separator of the cooling pipes serves as a refrigerant portion while the other side of the pipes, disposed at a low temperature fluid side of the fluid separator, serves as a condensing portion. The top and bottom of the cooling pipe communicate with each other via communicating members. In the cooling pipes, a heat receiving fin is connected to the outer wall of the refrigerant portion and a heat radiating fin is connect to the outer wall of the condensing portion. The heat receiving fin and the heat radiating fin are connected integrally with the cooling pipe by brazing.Type: GrantFiled: April 12, 1996Date of Patent: September 15, 1998Assignee: Nippondenso Co. Ltd.Inventors: Masahiko Suzuki, Kiyoshi Kawaguchi, Shigeru Kadota
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Patent number: 5713413Abstract: According to the present invention, a cooling apparatus includes a refrigerant tank composed of at least a couple of thin plate materials facing each other and bonded together at bonding parts thereof, a heating body mounted on an outer surface of the thin plates, refrigerant sealed in the refrigerant tank for absorbing heat generated by the heating body, the refrigerant vaporizing in the refrigerant tank, a heat radiator mounted on the refrigerant tank in fluid communication therewith for condensing and liquefying boiling vapor ascending from the refrigerant tank, and a refrigerant flow control plate composed of a plate material and disposed in an upper part of the refrigerant tank in contact with the thin plate materials facing each other. The refrigerant flow control plate partitions an inside of the refrigerant tank into a vapor outlet and a liquid inlet.Type: GrantFiled: December 27, 1995Date of Patent: February 3, 1998Assignee: Nippondenso Co., Ltd.Inventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki, Hajime Sugito, Kazuo Kobayashi, Shigeru Kadota