Patents by Inventor Shigeru Katakura

Shigeru Katakura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate for a probe card having conductive layers for supplying power to IC devices
    Patent number: 6734691
    Abstract: A substrate for a probe card for use in testing semiconductor IC devices in a lump includes tester power supply terminals which receive a power supply voltage output from a tester. Power supply terminals are connected to a semiconductor IC device to be tested. At least two power supply layers each connect one of the tester power supply terminals to the power supply terminals.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: May 11, 2004
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Masakatu Saijyo, Yoshimi Nakamura, Junichi Matsumoto, Toshiaki Kato, Shigeru Katakura
  • Substrate for a probe card having conductive layers for supplying power to IC devices
    Publication number: 20030057978
    Abstract: A substrate for a probe card for use in testing semiconductor IC devices in a lump includes tester power supply terminals which receive a power supply voltage output from a tester. Power supply terminals are connected to a semiconductor IC device to be tested. At least two power supply layers each connect one of the tester power supply terminals to the power supply terminals.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 27, 2003
    Inventors: Masakatu Saijyo, Yoshimi Nakamura, Junichi Matsumoto, Toshiaki Kato, Shigeru Katakura