Abstract: A laminated core that enables reducing an eddy-current loss while reducing a decrease in space factor is provided. The laminated core includes a plurality of laminated soft magnetic strips and at least one insulating layer arranged in part of each interface between the soft magnetic strips adjacent to one another. Each of the interfaces between the soft magnetic strips adjacent to one another includes at least one direct contact region and at least one indirect contact region. The soft magnetic strips adjacent to one another are in direct contact with one another in the at least one direct contact region. The soft magnetic strips adjacent to one another are in indirect contact with one another via the insulating layer in the at least one indirect contact region.

Abstract: A laminated core that enables reducing an eddy-current loss while reducing a decrease in space factor. The laminated core includes laminated soft magnetic strips with at least one patterned soft magnetic strip having a first surface. The first surface includes at least one protruding portion having a top surface. The top surface of the at least one protruding portion contacts a surface opposed to the first surface. The surface opposed to the first surface is included in a surface of one of the soft magnetic strips, which is adjacent to the at least one patterned soft magnetic strip.

Abstract: In a plated member (3) that has a pure Sn plating layer (2) of a lead-free material on a surface of a base material 1, the orientation indices of a (101) plane and a (112) plane of the pure Sn plating layer are increased to values higher than the orientation indices of the other crystal orientation planes.

Abstract: According to the present invention, in order to suppress whisker formation on a plated member having a plated layer comprising a lead-free material, the orientation index of the plane (321) in a plated layer for a plated member 3 having a plated layer 2 comprising a lead-free material on the surface of a base material 1 is 2.5 to 4.0. In another embodiment, the value (220)/(321) derived from the ratio of the orientation index of the plane (220) to that of the plane (321) for the plated layer is 0.5 to 1.5. An undercoat layer 4 having the orientation plane (220) may be formed between the base material 1 and the plated layer 2.