Patents by Inventor Shigeru Michiwaki
Shigeru Michiwaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10537021Abstract: A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film (1) having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film (3) on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film (21) on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.Type: GrantFiled: December 21, 2018Date of Patent: January 14, 2020Assignee: MEIKO ELECTRONICS CO., LTD.Inventor: Shigeru Michiwaki
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Patent number: 10385076Abstract: A surface treatment agent including a compound (?) is provided. The compound (?) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.Type: GrantFiled: August 8, 2017Date of Patent: August 20, 2019Assignees: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
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Publication number: 20190124763Abstract: A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film (1) having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film (3) on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film (21) on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.Type: ApplicationFiled: December 21, 2018Publication date: April 25, 2019Applicant: MEIKO ELECTRONICS CO., LTD.Inventor: Shigeru MICHIWAKI
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Patent number: 10244624Abstract: A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.Type: GrantFiled: October 30, 2015Date of Patent: March 26, 2019Assignee: MEIKO ELECTRONICS CO., LTD.Inventor: Shigeru Michiwaki
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Publication number: 20180160528Abstract: A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.Type: ApplicationFiled: October 30, 2015Publication date: June 7, 2018Applicant: MEIKO ELECTRONICS CO., LTD.Inventor: Shigeru MICHIWAKI
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Publication number: 20170334933Abstract: A surface treatment agent including a compound (?) is provided. The compound (?) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.Type: ApplicationFiled: August 8, 2017Publication date: November 23, 2017Applicants: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO, Shuukichi TAKII, Shigeru MICHIWAKI, Manabu MIYAWAKI, Masanori YANAI, Kouichi KAMIYAMA, Hitomi CHIBA, Yasuyuki MASUDA
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Patent number: 9790242Abstract: A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: the compound (?) is at least one of Formula [IV] and Formula [V]: wherein A is —N(Ra)Rb—Si(Rc)n(ORd)3?n, or —N{Rb—Si(Rc)n(ORd)3?n}2, B is ——N(Re)Rf(NH2)m, or —N{Rf(NH2(m}2, C is A, B, or —N(Rg)Rh, D is Ri and wherein each of Ra, Re, and Rg is independently H or a hydrocarbon group, Rb, Rc, Rd, Rf, Rh, and Ri are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.Type: GrantFiled: August 31, 2012Date of Patent: October 17, 2017Assignees: Sulfur Chemical Laboratory, Inc.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
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Patent number: 9593423Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.Type: GrantFiled: March 18, 2014Date of Patent: March 14, 2017Assignees: Sulfur Chemical Laboratory Incorporated, Meiko Electronics Co., Ltd.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
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Patent number: 9380711Abstract: A substrate manufacturing method includes an inner layer circuit forming step for partially removing metal films from an insulating base material (2), on both surfaces of which the metal films are stuck, and forming an inner layer circuit (3); and an insulating layer forming step for applying first insulating resin (4) to each of both the surfaces of the insulating base material (2) with an inkjet system and forming an insulating layer (5). In the insulating layer forming step, a via hole (6) from which the inner layer circuit (3) is partially exposed is formed simultaneously with the application of the first insulating resin (4). Consequently, a step of separately forming a via hole with a laser or the like is unnecessary, expenses are relatively low, and it is possible to simplify a manufacturing process.Type: GrantFiled: September 30, 2011Date of Patent: June 28, 2016Assignee: MEIKO ELECTRONICS CO., LTD.Inventors: Shukichi Takii, Noriaki Taneko, Shigeru Michiwaki, Mitsuho Kurosu, Yuichiro Naya
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Patent number: 9185811Abstract: A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.Type: GrantFiled: March 2, 2011Date of Patent: November 10, 2015Assignee: MEIKO ELECTRONICS CO., LTD.Inventors: Yoichi Saito, Shigeru Michiwaki, Noriaki Taneko, Shukichi Takii
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Publication number: 20150152124Abstract: Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: said compound (?) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.Type: ApplicationFiled: August 31, 2012Publication date: June 4, 2015Applicants: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
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Publication number: 20140227539Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.Type: ApplicationFiled: March 18, 2014Publication date: August 14, 2014Applicants: Kunio Mori, Sulfur Chemical Institute Incorporated, MEIKO ELECTRONICS CO., LTD.Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO, Shigeru MICHIWAKI, Manabu MIYAWAKI
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Publication number: 20140224762Abstract: A substrate manufacturing method includes an inner layer circuit forming step for partially removing metal films from an insulating base material (2), on both surfaces of which the metal films are stuck, and forming an inner layer circuit (3); and an insulating layer forming step for applying first insulating resin (4) to each of both the surfaces of the insulating base material (2) with an inkjet system and forming an insulating layer (5). In the insulating layer forming step, a via hole (6) from which the inner layer circuit (3) is partially exposed is formed simultaneously with the application of the first insulating resin (4). Consequently, a step of separately forming a via hole with a laser or the like is unnecessary, expenses are relatively low, and it is possible to simplify a manufacturing process.Type: ApplicationFiled: September 30, 2011Publication date: August 14, 2014Applicant: Meiko Electronics Co., Ltd.Inventors: Shukichi Takii, Noriaki Taneko, Shigeru Michiwaki, Mitsuho Kurosu, Yuichiro Naya
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Patent number: 8753748Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.Type: GrantFiled: September 30, 2011Date of Patent: June 17, 2014Assignees: Sulfur Chemical Laboratory Incorporated, Meiko Electronics Co., Ltd.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
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Publication number: 20130183534Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.Type: ApplicationFiled: September 30, 2011Publication date: July 18, 2013Applicants: Kunio Mori, Meiko Electronics Co., Ltd., Sulfur Chemical Institute IncorporatedInventors: Kunio Mori, Yusuke Matsuno, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
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Publication number: 20130043063Abstract: A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.Type: ApplicationFiled: March 2, 2011Publication date: February 21, 2013Inventors: Yoichi Saito, Shigeru Michiwaki, Noriaki Taneko, Shukichi Takii
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Patent number: 7800917Abstract: A printed wiring board has a first wiring layer formed at least on one surface of an insulative substrate, an insulating layer formed as covering the first wiring layer, and a second wiring layer formed on the insulating layer. The insulating layer is formed of a cured insulative sheet made of a high-stiff sheet-type reinforcing material containing resin. The first and second wiring layers are electrically connected to each other through at least one hole having a bottom. The second wiring layer is united with the insulating layer at an interface thereof with a conductive material of the second wiring layer injected into concave sections provided on the interface. Another printed wiring board has an insulative substrate having a first surface and a second surface, a first insulating layer and a second insulating layer formed on the first surface and the second surface, respectively, and a first wiring layer formed on the first insulating layer and a second wiring layer formed on the second insulating layer.Type: GrantFiled: July 24, 2006Date of Patent: September 21, 2010Assignee: Meiko Electronics Co., Ltd.Inventors: Hiroshi Shimada, Shigeru Michiwaki, Kazuo Shishime
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Publication number: 20070025091Abstract: A printed wiring board has a first wiring layer formed at least on one surface of an insulative substrate, an insulating layer formed as covering the first wiring layer, and a second wiring layer formed on the insulating layer. The insulating layer is formed of a cured insulative sheet made of a high-stiff sheet-type reinforcing material containing resin. The first and second wiring layers are electrically connected to each other through at least one hole having a bottom. The second wiring layer is united with the insulating layer at an interface thereof with a conductive material of the second wiring layer injected into concave sections provided on the interface. Another printed wiring board has an insulative substrate having a first surface and a second surface, a first insulating layer and a second insulating layer formed on the first surface and the second surface, respectively, and a first wiring layer formed on the first insulating layer and a second wiring layer formed on the second insulating layer.Type: ApplicationFiled: July 24, 2006Publication date: February 1, 2007Applicant: Victor Company of Japan, Ltd. a corporation of JapanInventors: Hiroshi Shimada, Shigeru Michiwaki, Kazuo Shishime
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Patent number: 6841738Abstract: A flexible rigid printed wiring board includes a plurality of rigid wiring boards having wiring patterns. The rigid wiring boards are spatially separate from each other. The flexible rigid printed wiring board also includes a flexible portion. The flexible portion connects the rigid wiring boards, and includes an insulating and flexible resin sheet. The insulating and flexible resin sheet includes first portions of first and second sub resin sheets. The first portions of the first and second sub resin sheets are bonded together. The first and second sub resin sheets have second portions covering and adhering to surfaces of the rigid wiring boards.Type: GrantFiled: May 20, 2003Date of Patent: January 11, 2005Assignee: Victor Company of Japan, Ltd.Inventors: Shigeru Michiwaki, Shinji Suga, Mitsuru Otsuki
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Publication number: 20040112632Abstract: A flexible rigid printed wiring board includes a plurality of rigid wiring boards having wiring patterns. The rigid wiring boards are spatially separate from each other. The flexible rigid printed wiring board also includes a flexible portion. The flexible portion connects the rigid wiring boards, and includes an insulating and flexible resin sheet. The insulating and flexible resin sheet includes first portions of first and second sub resin sheets. The first portions of the first and second sub resin sheets are bonded together. The first and second sub resin sheets have second portions covering and adhering to surfaces of the rigid wiring boards.Type: ApplicationFiled: May 20, 2003Publication date: June 17, 2004Inventors: Shigeru Michiwaki, Shinji Suga, Mitsuru Otsuki