Abstract: A semiconductor device includes a first nonlinear element, an differential amplifier that generates a differential signal from a signal output by the first nonlinear element; a first and second insulating elements that are connected to a non-inverting signal output terminal and an inverting signal output terminal of the differential amplifier, respectively; first to third nonlinear elements each outputting a first logic level if the received signal is equal to or larger than a given threshold value, and outputting a second logic level if the received signal is smaller than the given threshold value; and a logic circuit that outputs the logic level output by the second nonlinear element if the logic levels output by the second and third nonlinear elements are different from each other, and makes the logic level of the output signal unchangeable when the second and third nonlinear elements output the same logic level.

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract: A semiconductor device includes a first nonlinear element, an differential amplifier that generates a differential signal from a signal output by the first nonlinear element; a first and second insulating elements that are connected to a non-inverting signal output terminal and an inverting signal output terminal of the differential amplifier, respectively; first to third nonlinear elements each outputting a first logic level if the received signal is equal to or larger than a given threshold value, and outputting a second logic level if the received signal is smaller than the given threshold value; and a logic circuit that outputs the logic level output by the second nonlinear element if the logic levels output by the second and third nonlinear elements are different from each other, and makes the logic level of the output signal unchangeable when the second and third nonlinear elements output the same logic level.

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract: An optical module includes a receptacle for receiving an optical connector attached to a distal end of an optical fiber, and a lens body having a contact surface coming into contact with the distal end of the optical fiber when the receptacle receives the optical connector. The lens body has the contact surface and an opposing surface opposing the contact surface, and further has a columnar base held by the receptacle, a lens portion formed on the opposing surface integrally with the base, and a flat portion. The lens portion is surrounded by the flat portion and is off-centered with respect to the base.

Abstract: The core adjusting process includes a procedure of searching for the position in which the photocurrent of the light-receiving element reaches its peak in each of the X-, Y-, and Z-directions. In the searching procedure, the light emitted from a multimode fiber of a MCP is gathered by a lens and is transmitted to the light-receiving element. A check is then made to determine whether, at in both directions of the search direction, there exist a first and second attenuation positions in which the photocurrent shows a predetermined attenuation relative to a peak value in a search range. If there exist the attenuation positions, a peak position is determined to be a position located within a second predetermined range from the middle point between the attenuation positions, and the relative positions of the receptacle and the CAN package are adjusted to the peak position.

Abstract: An optical module includes a receptacle for receiving an optical connector attached to a distal end of an optical fiber, and a lens body having a contact surface coming into contact with the distal end of the optical fiber when the receptacle receives the optical connector. The lens body has the contact surface and an opposing surface opposing the contact surface, and further has a columnar base held by the receptacle, a lens portion formed on the opposing surface integrally with the base, and a flat portion. The lens portion is surrounded by the flat portion and is off-centered with respect to the base.

Abstract: In an optical unit including a photoelectric conversion chip adapted to be optically connected to an optical fiber, and a semiconductor chip for driving the photoelectric conversion chip, both the photoelectric conversion chip and the semiconductor chip are wrapped with a flexible sheet, to thereby produce an enveloper enveloping the photoelectric conversion chip and the semiconductor chip therein. At least a part of the enveloper is formed as a transparent area for allowing an optical connection between the optical fiber and the photoelectric conversion chip.

Abstract: An optical transceiver module and a method for manufacturing thereof, which are adopted for providing a reduced manufacturing cost and an improved signal quality, are achieved. The optical transceiver module 1 includes a VCSEL 13 that is capable of emitting light; a thermoplastic resin layer 22 provided on the VCSEL 13 and transparent to the above-described light; a copper foil 21, provided in the thermoplastic resin layer 22 and the resin layer, and having an opening 21a that is transparent to light; a dimple 22a, provided in a surface of the thermoplastic resin layer 22 in a side opposite to the VCSEL 13; and a lens provided in the dimple. The dimple 22a is located above the opening 21a.

Abstract: In an optical unit including a photoelectric conversion chip adapted to be optically connected to an optical fiber, and a semiconductor chip for driving the photoelectric conversion chip, both the photoelectric conversion chip and the semiconductor chip are wrapped with a flexible sheet, to thereby produce an enveloper enveloping the photoelectric conversion chip and the semiconductor chip therein. At least a part of the enveloper is formed as a transparent area for allowing an optical connection between the optical fiber and the photoelectric conversion chip.