Patents by Inventor Shigeru Namiki

Shigeru Namiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6286452
    Abstract: The chamber 1 of the spattering apparatus has a gas introduction port 2 provided at one side in a direction orthogonal to the opening/closing direction of a door 11 of chamber 1, and a vacuum evacuation port 3 provided on the other side of chamber. A substrate holder 4 is fixed on door 11, and a cathode 31 is arranged on a wall face facing door 11 of chamber 1. A shield 41 is arranged in close proximity to and so as to cover the peripheral part of substrate holder 4. A hole 42 is formed in shield 41 in a location facing vacuum evacuation port 3, whereby rapid vacuum evacuation can be achieved even though shield 41 is arranged in a condition close to sealing with respect to the peripheral part of substrate holder 4.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: September 11, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shigeru Namiki, Hidetoshi Kawa
  • Patent number: 6258433
    Abstract: A half-transmissive film of an optical disk is formed using a Cu oxide instead of Au, while achieving similar reflectivity characteristics to those of Au. Alternatively, the half-transmissive film may comprise a compound of Cu with a corrosion-resistant material, or a stack of layers comprising a lower layer film of Cu, Ag, or Al and an upper layer film of a corrosion-resistant material. Further, the half-transmissive film may comprise ZnS.SiO2, a nitride of Ti, indium-tin-oxide, or an alloy of Au and Cu or a compound including Au and Cu.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: July 10, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akira Okuda, Tetsuo Imada, Shigeru Namiki, Masahiro Yamamoto, Mikio Takebayashi
  • Patent number: 5951835
    Abstract: More than two pressure reducing chambers 6 to 9 are located on both the upstream and the downstream of vacuum processing housings 11 and 12. Each of the pressure reducing chambers 6 to 9 includes a film conveying means 30, a vacuum exhausting means, and a gate valve 20 provided with a resilient member for closely holding down the running film 1 to seal off the vacuum state of a belt-like passage of the gate valve 20. As the pressure reducing chambers 6 to 9 are protected with their specific gate valve belt-like passage arrangement from reduction of the vacuum state and located respectively on the upstream and downstream sides of the vacuum processing units 11 and 12, the vacuum state in the continuous vacuum processing apparatus will be maintained to a desired level. While the running film 1 is being conveyed, the gate valves 20 at the first and second stages are actuated alternately for opening and closing after vacuum evacuation.
    Type: Grant
    Filed: March 13, 1997
    Date of Patent: September 14, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shigeru Namiki, Hatsuhiko Shibasaki, Tadaomi Amano, Katsuyuki Kita, Akira Okuda
  • Patent number: 4087034
    Abstract: An automatic component mounting apparatus for automatically inserting and clinching terminal wires extending from each body of electric and/or electronic components to be mounted on a printed circuit board, which has a supply unit from which the components are successively delivered one at a time, an inserting head assembly for mounting each component on the printed circuit board with the terminal wires inserted through holes of one pair of holes in the circuit board, a pair of opposed transfer units positioned on respective sides of the inserting head assembly, a shaper assembly operatively carried by the inserting head for selectively receiving the component from either one of the transfer units and also for bending the terminal wires to give the component a substantially square-cornered U-shape in readiness for mounting thereof on the circuit board. A clinching unit for cutting off excessive portions of the component terminal wires and also for bending them is also included.
    Type: Grant
    Filed: December 14, 1976
    Date of Patent: May 2, 1978
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshio Kikkawa, Shigeru Namiki