Abstract: An electromagnetic valve includes a rod, an armature fixed to the rod, and a stopper that limits motion of the armature to one side in an axial direction of the rod. The armature has a rod hole through which a fixed portion of the rod extends to be fixed to the armature. The rod includes a flange portion that is located on the one side in the axial direction with reference to the fixed portion. The flange portion is larger than the fixed portion in a radial direction of the rod. The armature includes a contact portion adjacent to an opening of the rod hole that is open toward the one side in the axial direction, and the contact portion contacts the flange portion.

Abstract: A filter element is formed from a filter material configured to capture a foreign substance in fuel. A lower case is attachable to and detachable from a bottom portion of a housing in a movable direction. The housing and the lower case are configured to accommodate the filter element. The filter element defines a passage extending through the filter element in the movable direction. The passage is configured to accommodate the component. The component is configured to be attached to and detached from the housing together with the lower case when the lower case is attached to and detached from the housing.

Abstract: The present invention provides a semiconductor element mounting substrate 101 including: a base substrate 1 having a region 2 for mounting a semiconductor element 11, the region 2 being set on the major surface of the base substrate 1; a plurality of wiring patterns 3 formed on the base substrate 1 and connected to the semiconductor element 11; and a dummy pattern 8 formed like a frame in the region 2 for mounting the semiconductor element 11 and not connected to the wiring patterns 3.

Abstract: An object of the invention is to provide a depressurizing valve mounted to a common rail for a fuel injection device, in which a direction of a connector for the depressurizing valve can be adjusted, without affecting an air gap and a sealing performance. The depressurizing valve has a valve unit and a coil unit which is detachably assembled to the valve unit by a mounting member, such as a retaining nut. A valve housing has an inside space, which is fluid tightly separated into first and second spaces by a connecting member, which is fluid tightly connected to the valve housing and a stator core. A valve body and a spring are arranged in the first space for closing a flow control port. A cylindrical coil is accommodated in the second space, such that the coil is rotatable with respect to the valve housing.

Abstract: A solenoid valve includes a coil, a stator core, a valve member, a coil spring, and a stopper. The coil provides a magnetic field when the coil is energized. The stator core includes a receiving bore, wherein the stator core generates a magnetic attractive force when the coil is energized. The valve member is attracted toward the stator core due to the magnetic attractive force generated by the stator core. The coil spring is received in the receiving bore of the stator core, wherein the coil spring biases the valve member in an opposite direction opposite from the stator core. The stopper positions the coil spring such that an outer peripheral surface of the coil spring is separated from an inner peripheral surface of the receiving bore.

Abstract: A filter element is formed from a filter material configured to capture a foreign substance in fuel. A lower case is attachable to and detachable from a bottom portion of a housing in a movable direction. The housing and the lower case are configured to accommodate the filter element. The filter element defines a passage extending through the filter element in the movable direction. The passage is configured to accommodate the component. The component is configured to be attached to and detached from the housing together with the lower case when the lower case is attached to and detached from the housing.

Abstract: A semiconductor integrated circuit (1) having an integrated circuit region (1a), and a plurality of I/O cells (6) each having an element formation region for external electrical connection from the element formation region. An input/output signal electrode pad (3), a power supply electrode pad (4) and a GND electrode pad (5) are placed on an element formation region of each I/O cell (6).

Abstract: The present invention provides a semiconductor element mounting substrate 101 including: a base substrate 1 having a region 2 for mounting a semiconductor element 11, the region 2 being set on the major surface of the base substrate 1; a plurality of wiring patterns 3 formed on the base substrate 1 and connected to the semiconductor element 11; and a dummy pattern 8 formed like a frame in the region 2 for mounting the semiconductor element 11 and not connected to the wiring patterns 3.

Abstract: An electromagnetic actuator includes a cylindrical coil, a stator core disposed in the cylindrical coil, a plate attached to one axial end of the stator core and an armature positioned to face the other axial end of the stator core. Upon energizing the coil, the armature is attracted to the stator core against a biasing force of a spring disposed in an inner space of the stator core. A depressed portion is formed on the plate and/or the stator core to suppress a magnetic flux passing therethrough and to reduce an amount of leakage flux. The magnetic flux generated by the coil is effectively used to drive the armature, and thereby a response time of the actuator is shortened. In other words, the armature is quickly driven upon energizing the coil.

Abstract: A solenoid valve includes a coil, a stator core, a valve member, a coil spring, and a stopper. The coil provides a magnetic field when the coil is energized. The stator core includes a receiving bore, wherein the stator core generates a magnetic attractive force when the coil is energized. The valve member is attracted toward the stator core due to the magnetic attractive force generated by the stator core. The coil spring is received in the receiving bore of the stator core, wherein the coil spring biases the valve member in an opposite direction opposite from the stator core. The stopper positions the coil spring such that an outer peripheral surface of the coil spring is separated from an inner peripheral surface of the receiving bore.

Abstract: An object of the invention is to provide a depressurizing valve mounted to a common rail for a fuel injection device, in which a direction of a connector for the depressurizing valve can be adjusted, without affecting an air gap and a sealing performance. The depressurizing valve has a valve unit and a coil unit which is detachably assembled to the valve unit by a mounting member, such as a retaining nut. A valve housing has an inside space, which is fluid tightly separated into first and second spaces by a connecting member, which is fluid tightly connected to the valve housing and a stator core. A valve body and a spring are arranged in the first space for closing a flow control port. A cylindrical coil is accommodated in the second space, such that the coil is rotatable with respect to the valve housing.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A semiconductor integrated circuit (1) having an integrated circuit region (1a), and a plurality of I/O cells (6) each having an element formation region for external electrical connection from the element formation region. An input/output signal electrode pad (3), a power supply electrode pad (4) and a GND electrode pad (5) are placed on an element formation region of each I/O cell (6).

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A common rail for an accumulation type fuel injection system is formed of a plurality of pipe connectors in the form of a cross or a tee and a connecting pipe for connecting the pipe connectors with each other. Respective ends of the pipe connector provide pipe connecting portions, to which a pump pipe and injector pipes are connected, and another pipe connecting portion, to which the connecting pipe is connected. Insides of the pipe connectors and the connecting pipe provide a volume portion for accumulating high-pressure fuel. Thus, conventionally required welding technology is not required. Therefore, production cost of the common rail is reduced. Meanwhile, the size of the common rail is reduced and the common rail is mounted to a vehicle more easily.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A capacity(ies) of a variable capacitor(s) varies with a physical amount. A C-V conversion circuit converts variation in the capacity into a voltage signal. First and second charge holding circuits hold the voltage signal at different timings as first and second charges, respectively. An offset compensating charge holding circuit generates and holds an offset charge for compensation of an offset in the voltage signal. A charge combining and holding circuit combines and holds the first and second charges and the offset charge. An outputting circuit receives the combined charge from the charge combining and holding circuit and outputs an output voltage signal corresponding to the physical amount in accordance with the received charge. The outputting circuit, the offset compensating charge holding circuit, the C=V circuit may be omitted. The variable capacitance may include a capacitor or a differential type capacitors.

Abstract: The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.