Patents by Inventor Shigeru Nonoyama

Shigeru Nonoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10534289
    Abstract: A toner container attachable to and detachable from a main body of an image forming device and including: a first chamber containing toner; a second chamber adjacent to the first chamber through a partition wall and downstream of the first chamber in a toner supply direction; and a switching member in the second chamber that is movable or rotatable and has a shell structure. The partition wall has a first aperture. A bottom wall of the second chamber opposing the partition wall has a second aperture and sits on the main body. The shell has third and fourth apertures. The fourth aperture coincides with the second aperture when the third aperture coincides with the first aperture, and the first aperture is closed by the shell when the third aperture faces an inner wall surface of the second chamber.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: January 14, 2020
    Assignee: KONICA MINOLTA, INC.
    Inventors: Shuan Yang, Naoki Nonoyama, Shigeru Sawano
  • Patent number: 9046186
    Abstract: An electromagnetic valve includes a rod, an armature fixed to the rod, and a stopper that limits motion of the armature to one side in an axial direction of the rod. The armature has a rod hole through which a fixed portion of the rod extends to be fixed to the armature. The rod includes a flange portion that is located on the one side in the axial direction with reference to the fixed portion. The flange portion is larger than the fixed portion in a radial direction of the rod. The armature includes a contact portion adjacent to an opening of the rod hole that is open toward the one side in the axial direction, and the contact portion contacts the flange portion.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: June 2, 2015
    Assignee: DENSO CORPORATION
    Inventors: Naoki Mitsumata, Shigeru Nonoyama
  • Patent number: 8070940
    Abstract: A filter element is formed from a filter material configured to capture a foreign substance in fuel. A lower case is attachable to and detachable from a bottom portion of a housing in a movable direction. The housing and the lower case are configured to accommodate the filter element. The filter element defines a passage extending through the filter element in the movable direction. The passage is configured to accommodate the component. The component is configured to be attached to and detached from the housing together with the lower case when the lower case is attached to and detached from the housing.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: December 6, 2011
    Assignees: Denso Corporation, Kyosan Denki Co., Ltd.
    Inventors: Toshiyuki Yonemoto, Yoshihiko Ooya, Shigeru Nonoyama, Osamu Takamisawa
  • Patent number: 7714417
    Abstract: The present invention provides a semiconductor element mounting substrate 101 including: a base substrate 1 having a region 2 for mounting a semiconductor element 11, the region 2 being set on the major surface of the base substrate 1; a plurality of wiring patterns 3 formed on the base substrate 1 and connected to the semiconductor element 11; and a dummy pattern 8 formed like a frame in the region 2 for mounting the semiconductor element 11 and not connected to the wiring patterns 3.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: May 11, 2010
    Assignee: Panasonic Corporation
    Inventor: Shigeru Nonoyama
  • Patent number: 7712453
    Abstract: An object of the invention is to provide a depressurizing valve mounted to a common rail for a fuel injection device, in which a direction of a connector for the depressurizing valve can be adjusted, without affecting an air gap and a sealing performance. The depressurizing valve has a valve unit and a coil unit which is detachably assembled to the valve unit by a mounting member, such as a retaining nut. A valve housing has an inside space, which is fluid tightly separated into first and second spaces by a connecting member, which is fluid tightly connected to the valve housing and a stator core. A valve body and a spring are arranged in the first space for closing a flow control port. A cylindrical coil is accommodated in the second space, such that the coil is rotatable with respect to the valve housing.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: May 11, 2010
    Assignee: DENSO CORPORATION
    Inventors: Shigeru Nonoyama, Naoki Mitsumata, Fumiaki Murakami
  • Patent number: 7578494
    Abstract: A solenoid valve includes a coil, a stator core, a valve member, a coil spring, and a stopper. The coil provides a magnetic field when the coil is energized. The stator core includes a receiving bore, wherein the stator core generates a magnetic attractive force when the coil is energized. The valve member is attracted toward the stator core due to the magnetic attractive force generated by the stator core. The coil spring is received in the receiving bore of the stator core, wherein the coil spring biases the valve member in an opposite direction opposite from the stator core. The stopper positions the coil spring such that an outer peripheral surface of the coil spring is separated from an inner peripheral surface of the receiving bore.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: August 25, 2009
    Assignee: Denso Corporation
    Inventors: Naoki Mitsumata, Fumiaki Murakami, Shigeru Nonoyama
  • Publication number: 20090090678
    Abstract: A filter element is formed from a filter material configured to capture a foreign substance in fuel. A lower case is attachable to and detachable from a bottom portion of a housing in a movable direction. The housing and the lower case are configured to accommodate the filter element. The filter element defines a passage extending through the filter element in the movable direction. The passage is configured to accommodate the component. The component is configured to be attached to and detached from the housing together with the lower case when the lower case is attached to and detached from the housing.
    Type: Application
    Filed: October 3, 2008
    Publication date: April 9, 2009
    Applicants: DENSO CORPORATION, KYOSAN DENKI CO., LTD.
    Inventors: Toshiyuki Yonemoto, Yoshihiko Ooya, Shigeru Nonoyama, Osamu Takamisawa
  • Patent number: 7501710
    Abstract: A semiconductor integrated circuit (1) having an integrated circuit region (1a), and a plurality of I/O cells (6) each having an element formation region for external electrical connection from the element formation region. An input/output signal electrode pad (3), a power supply electrode pad (4) and a GND electrode pad (5) are placed on an element formation region of each I/O cell (6).
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: March 10, 2009
    Assignee: Panasonic Corporation
    Inventors: Shigeru Nonoyama, Naoto Ueda
  • Publication number: 20080217751
    Abstract: The present invention provides a semiconductor element mounting substrate 101 including: a base substrate 1 having a region 2 for mounting a semiconductor element 11, the region 2 being set on the major surface of the base substrate 1; a plurality of wiring patterns 3 formed on the base substrate 1 and connected to the semiconductor element 11; and a dummy pattern 8 formed like a frame in the region 2 for mounting the semiconductor element 11 and not connected to the wiring patterns 3.
    Type: Application
    Filed: March 5, 2008
    Publication date: September 11, 2008
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventor: Shigeru Nonoyama
  • Publication number: 20070200655
    Abstract: An electromagnetic actuator includes a cylindrical coil, a stator core disposed in the cylindrical coil, a plate attached to one axial end of the stator core and an armature positioned to face the other axial end of the stator core. Upon energizing the coil, the armature is attracted to the stator core against a biasing force of a spring disposed in an inner space of the stator core. A depressed portion is formed on the plate and/or the stator core to suppress a magnetic flux passing therethrough and to reduce an amount of leakage flux. The magnetic flux generated by the coil is effectively used to drive the armature, and thereby a response time of the actuator is shortened. In other words, the armature is quickly driven upon energizing the coil.
    Type: Application
    Filed: December 5, 2006
    Publication date: August 30, 2007
    Applicant: DENSO CORPORATION
    Inventors: Fumiaki Murakami, Shigeru Nonoyama, Naoki Mitsumata
  • Publication number: 20070181840
    Abstract: A solenoid valve includes a coil, a stator core, a valve member, a coil spring, and a stopper. The coil provides a magnetic field when the coil is energized. The stator core includes a receiving bore, wherein the stator core generates a magnetic attractive force when the coil is energized. The valve member is attracted toward the stator core due to the magnetic attractive force generated by the stator core. The coil spring is received in the receiving bore of the stator core, wherein the coil spring biases the valve member in an opposite direction opposite from the stator core. The stopper positions the coil spring such that an outer peripheral surface of the coil spring is separated from an inner peripheral surface of the receiving bore.
    Type: Application
    Filed: February 7, 2007
    Publication date: August 9, 2007
    Applicant: DENSO CORPORATION
    Inventors: Naoki Mitsumata, Fumiaki Murakami, Shigeru Nonoyama
  • Publication number: 20070084443
    Abstract: An object of the invention is to provide a depressurizing valve mounted to a common rail for a fuel injection device, in which a direction of a connector for the depressurizing valve can be adjusted, without affecting an air gap and a sealing performance. The depressurizing valve has a valve unit and a coil unit which is detachably assembled to the valve unit by a mounting member, such as a retaining nut. A valve housing has an inside space, which is fluid tightly separated into first and second spaces by a connecting member, which is fluid tightly connected to the valve housing and a stator core. A valve body and a spring are arranged in the first space for closing a flow control port. A cylindrical coil is accommodated in the second space, such that the coil is rotatable with respect to the valve housing.
    Type: Application
    Filed: October 13, 2006
    Publication date: April 19, 2007
    Applicant: DENSO CORPORATION
    Inventors: Shigeru Nonoyama, Naoki Mitsumata, Fumiaki Murakami
  • Patent number: 7154189
    Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: December 26, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Maeda, Takashi Takata, Takao Ochi, Hiroki Naraoka, Takeshi Kawabata, Yoshiyuki Arai, Shigeru Nonoyama, Hajime Homma
  • Publication number: 20060157740
    Abstract: A semiconductor integrated circuit (1) having an integrated circuit region (1a), and a plurality of I/O cells (6) each having an element formation region for external electrical connection from the element formation region. An input/output signal electrode pad (3), a power supply electrode pad (4) and a GND electrode pad (5) are placed on an element formation region of each I/O cell (6).
    Type: Application
    Filed: January 18, 2006
    Publication date: July 20, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shigeru Nonoyama, Naoto Ueda
  • Patent number: 6905912
    Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: June 14, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Maeda, Takashi Takata, Takao Ochi, Hiroki Naraoka, Takeshi Kawabata, Yoshiyuki Arai, Shigeru Nonoyama, Hajime Homma
  • Publication number: 20050121761
    Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
    Type: Application
    Filed: January 18, 2005
    Publication date: June 9, 2005
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Maeda, Takashi Takata, Takao Ochi, Hiroki Naraoka, Takeshi Kawabata, Yoshiyuki Arai, Shigeru Nonoyama, Hajime Homma
  • Publication number: 20040089732
    Abstract: A common rail for an accumulation type fuel injection system is formed of a plurality of pipe connectors in the form of a cross or a tee and a connecting pipe for connecting the pipe connectors with each other. Respective ends of the pipe connector provide pipe connecting portions, to which a pump pipe and injector pipes are connected, and another pipe connecting portion, to which the connecting pipe is connected. Insides of the pipe connectors and the connecting pipe provide a volume portion for accumulating high-pressure fuel. Thus, conventionally required welding technology is not required. Therefore, production cost of the common rail is reduced. Meanwhile, the size of the common rail is reduced and the common rail is mounted to a vehicle more easily.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 13, 2004
    Applicant: DENSO CORPORATION
    Inventor: Shigeru Nonoyama
  • Publication number: 20030207492
    Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
    Type: Application
    Filed: April 7, 2003
    Publication date: November 6, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Maeda, Takashi Takata, Takao Ochi, Hiroki Naraoka, Takeshi Kawabata, Yoshiyuki Arai, Shigeru Nonoyama, Hajime Homma
  • Patent number: 6582991
    Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: June 24, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Maeda, Takashi Takata, Takao Ochi, Hiroki Naraoka, Takeshi Kawabata, Yoshiyuki Arai, Shigeru Nonoyama, Hajime Homma
  • Patent number: 6529015
    Abstract: A capacity(ies) of a variable capacitor(s) varies with a physical amount. A C-V conversion circuit converts variation in the capacity into a voltage signal. First and second charge holding circuits hold the voltage signal at different timings as first and second charges, respectively. An offset compensating charge holding circuit generates and holds an offset charge for compensation of an offset in the voltage signal. A charge combining and holding circuit combines and holds the first and second charges and the offset charge. An outputting circuit receives the combined charge from the charge combining and holding circuit and outputs an output voltage signal corresponding to the physical amount in accordance with the received charge. The outputting circuit, the offset compensating charge holding circuit, the C=V circuit may be omitted. The variable capacitance may include a capacitor or a differential type capacitors.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: March 4, 2003
    Assignee: Denso Corporation
    Inventors: Shigeru Nonoyama, Hiroaki Itou