Patents by Inventor Shigeru Odagiri

Shigeru Odagiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5498196
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: May 18, 1994
    Date of Patent: March 12, 1996
    Assignee: Speedfam Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi
  • Patent number: 5498199
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: July 15, 1994
    Date of Patent: March 12, 1996
    Assignee: Speedfam Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi, Spencer Preston
  • Patent number: 5329732
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: June 15, 1992
    Date of Patent: July 19, 1994
    Assignee: Speedfam Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi
  • Patent number: RE37622
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: April 2, 2002
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi