Patents by Inventor Shigeru Ohyama

Shigeru Ohyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7488183
    Abstract: Embodiments in accordance with the present invention provide a connector for a data storage device having a sufficient strength, and relate to a data storage device using such a connector. In accordance with one embodiment, a data storage device is provided having a circuit board and a connector for making a connection with an external interface. The connector includes bosses disposed on both sides across a center of a direction orthogonal to a direction perpendicular to a main surface of the circuit board and a direction, in which the connector is connected to the interface. The boss is a protrusion that counteracts a force applied to the connector by being embedded in a hole disposed in the circuit board when the connector is disposed in the circuit board.
    Type: Grant
    Filed: November 20, 2006
    Date of Patent: February 10, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yoshiroh Amano, Kohji Takahashi, Naoyuki Yamazaki, Shigeru Ohyama, Sumio Obata
  • Publication number: 20070128894
    Abstract: Embodiments in accordance with the present invention provide a connector for a data storage device having a sufficient strength, and relate to a data storage device using such a connector. In accordance with one embodiment, a data storage device is provided having a circuit board and a connector for making a connection with an external interface. The connector includes bosses disposed on both sides across a center of a direction orthogonal to a direction perpendicular to a main surface of the circuit board and a direction, in which the connector is connected to the interface. The boss is a protrusion that counteracts a force applied to the connector by being embedded in a hole disposed in the circuit board when the connector is disposed in the circuit board.
    Type: Application
    Filed: November 20, 2006
    Publication date: June 7, 2007
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yoshiroh Amano, Kohji Takahashi, Naoyuki Yamazaki, Shigeru Ohyama, Sumio Obata
  • Patent number: 5718954
    Abstract: Materials containing fine natural organic material particles are disclosed. As the fine particles, superfine silk fibroin particles are produced by a process comprising a first step of comminuting silk fibroin into coarse particles with dry mechanical comminuting means, a second step of comminuting the coarse silk fibroin particles into fine particles with dry mechanical comminuting means, and a third step of comminuting the fine silk fibroin particles into superfine particles with an average particle diameter of 10 .mu.m or below with dry mechanical comminuting means, the silk fibroin particles being beta-treated during or after at least one of the first to third comminuting steps. Specific examples of the material are films, sheets, paints, fiber treating materials, etc.
    Type: Grant
    Filed: July 17, 1995
    Date of Patent: February 17, 1998
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Masahiro Sano, Satoshi Mikami, Nobutaka Sasaki, Nobuo Kusamoto, Fumioki Fukatsu, Atsuhiko Ubara, Takaharu Yasue, Shigeru Ohyama
  • Patent number: 5639548
    Abstract: A fiber treatment composition containing a synthetic resin such as a silicon resin emulsion, a polyurethane resin emulsion and the like and a pulverized hydrophilic organic natural material such as collagen. A fiber treated by using the treatment composition. A method of treating the fiber by stirring the fiber treatment composition in a ball mill or the like, soaking a fiber in the composition by the pad method, and drying the fiber under a temperature from 80 to 160 degrees.
    Type: Grant
    Filed: November 29, 1995
    Date of Patent: June 17, 1997
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Masahiro Sano, Shigeru Ohyama, Fumioki Fukatsu
  • Patent number: 5514737
    Abstract: A fiber treatment composition containing a synthetic resin such as a silicon resin emulsion, a polyurethane resin emulsion and the like and a pulverized hydrophilic organic group natural material such as collagen. A fiber treated by using the treatment composition. A method of treating the fiber by stirring the fiber treatment composition in a ball mill or the like, soaking a fiber in the composition by the pad method, and drying the fiber under a temperature from 80 to 160 degrees.
    Type: Grant
    Filed: November 28, 1994
    Date of Patent: May 7, 1996
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Masahiro Sano, Shigeru Ohyama, Fumioki Fukatsu