Patents by Inventor Shigeru SAGAWA

Shigeru SAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120024959
    Abstract: An RFID inlet by including: a base film; an antenna pattern formed on the base film; an insulation film layer formed on the antenna pattern and having a hole; an IC chip coupled to the antenna pattern inside the hole of the insulation film layer; and an underfill filled between the IC chip, the antenna, and the base film. The height of the IC chip top surface is at a higher level than the top surface of the insulation film layer, the underfill is formed between the IC chip and a wall surface of the hole of the insulation film layer.
    Type: Application
    Filed: March 31, 2011
    Publication date: February 2, 2012
    Inventors: Madoka MINAGAWA, Naoya KANDA, Isao SAKAMA, Shigeru SAGAWA, Daisuke SHIBATA