Patents by Inventor Shigeru Sawada

Shigeru Sawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10249306
    Abstract: A speaker identification device includes: a primary speaker identification unit that computes, for each pre-stored registered speaker, a score that indicates the similarity between input speech and speech of the registered speakers; a similar speaker selection unit that selects a plurality of the registered speakers as similar speakers according to the height of the scores thereof; a learning unit that creates a classifier for each similar speaker by sorting the speech of a certain similar speaker among the similar speakers as a positive instance and the speech of the other similar speakers as negative instances; and a secondary speaker identification unit that computes, for each classifier, a score of the classifier with respect to the input speech, and outputs an identification result.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: April 2, 2019
    Assignee: NEC CORPORATION
    Inventors: Masahiro Tani, Takafumi Koshinaka, Yoshifumi Onishi, Shigeru Sawada
  • Patent number: 9966163
    Abstract: An electric contact material for a connector includes a base material made of a metal material; an alloy layer that is formed on the base material and made of an alloy containing at least three elements including Sn and Cu as well as at least one metal selected from Zn, Co, Ni, and Pd; and a conductive coating layer formed on the surface of the alloy layer. The alloy layer contains an intermetallic compound obtained by replacing some of the Cu atoms in Cu6Sn5 with at least one metal selected from Zn, Co, Ni, and Pd. It is preferable that the content of at least one metal selected from Zn, Co, Ni, and Pd in the alloy layer is in a range of 1 to 50 atom % when the total content of the metal and Cu is regarded as 100 atom %.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: May 8, 2018
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Shigeru Sawada
  • Patent number: 9954297
    Abstract: A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 ?m2.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: April 24, 2018
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hajime Watanabe, Yoshifumi Saka, Shigeru Sawada
  • Publication number: 20170302016
    Abstract: A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 ?m2.
    Type: Application
    Filed: October 16, 2015
    Publication date: October 19, 2017
    Inventors: Hajime WATANABE, Yoshifumi SAKA, Shigeru SAWADA
  • Publication number: 20160247592
    Abstract: An electric contact material for a connector includes a base material made of a metal material; an alloy layer that is formed on the base material and made of an alloy containing at least three elements including Sn and Cu as well as at least one metal selected from Zn, Co, Ni, and Pd; and a conductive coating layer formed on the surface of the alloy layer. The alloy layer contains an intermetallic compound obtained by replacing some of the Cu atoms in Cu6Sn5 with at least one metal selected from Zn, Co, Ni, and Pd. It is preferable that the content of at least one metal selected from Zn, Co, Ni, and Pd in the alloy layer is in a range of 1 to 50 atom % when the total content of the metal and Cu is regarded as 100 atom %.
    Type: Application
    Filed: September 10, 2014
    Publication date: August 25, 2016
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Shigeru SAWADA
  • Publication number: 20150356974
    Abstract: A speaker identification device includes: a primary speaker identification unit that computes, for each pre-stored registered speaker, a score that indicates the similarity between input speech and speech of the registered speakers; a similar speaker selection unit that selects a plurality of the registered speakers as similar speakers according to the height of the scores thereof; a learning unit that creates a classifier for each similar speaker by sorting the speech of a certain similar speaker among the similar speakers as a positive instance and the speech of the other similar speakers as negative instances; and a secondary speaker identification unit that computes, for each classifier, a score of the classifier with respect to the input speech, and outputs an identification result.
    Type: Application
    Filed: January 16, 2014
    Publication date: December 10, 2015
    Applicant: NEC Corporation
    Inventors: MASAHIRO TANI, TAKAFUMI KOSHINAKA, YOSHIFUMI ONISHI, SHIGERU SAWADA
  • Patent number: 7963792
    Abstract: Provided is a plug detachment prevention structure, such that when a plug equipped with a plug terminal and a plug retaining section that covers a part of the plug terminal is connected to a jack provided inside a housing, the plug detachment prevention structure retains the plug retaining section to prevent the plug from detaching from the jack, wherein the plug detachment prevention structure is equipped with a ring-shaped elastic section composed of an elastic material in which the plug retaining section is pressure-inserted, and a frame section that is circularly mounted at an outer circumferential side of the elastic section, composed of a material harder than that of the elastic section and detachably attached on an outside of the housing.
    Type: Grant
    Filed: May 21, 2010
    Date of Patent: June 21, 2011
    Assignee: Roland Corporation
    Inventors: Shigeru Sawada, Kazuhiko Matsuoka
  • Publication number: 20110053402
    Abstract: Provided is a plug detachment prevention structure, such that when a plug equipped with a plug terminal and a plug retaining section that covers a part of the plug terminal is connected to a jack provided inside a housing, the plug detachment prevention structure retains the plug retaining section to prevent the plug from detaching from the jack, wherein the plug detachment prevention structure is equipped with a ring-shaped elastic section composed of an elastic material in which the plug retaining section is pressure-inserted, and a frame section that is circularly mounted at an outer circumferential side of the elastic section, composed of a material harder than that of the elastic section and detachably attached on an outside of the housing.
    Type: Application
    Filed: May 21, 2010
    Publication date: March 3, 2011
    Applicant: ROLAND CORPORATION
    Inventors: Shigeru Sawada, Kazuhiko Matsuoka
  • Patent number: 7824236
    Abstract: A connecting terminal developed speedily while limiting a temperature rise when a current flows, comprising male and female terminals each having a wire crimp portion to which a wire is crimped, and a joint portion where the male and female terminals are joined to each other, wherein a contact resistance value of the whole connecting terminal is a sum of contact resistance values in the wire crimp portions and the joint portion, and a length of a contact portion is a sum of lengths of the wire crimp portions and the joint portion, wherein a normalized contact resistance value Rter is derived by dividing the contact resistance value by the length, and a relationship of a wire resistance value Rwire of the wire, a current value I and a permissive increase in temperature ?T to the normalized contact resistance value Rter is expressed by Rter<?T/(752×I2)?3.7×Rwire.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: November 2, 2010
    Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Shigeru Sawada, Hideo Hoshi
  • Publication number: 20090239425
    Abstract: A connecting terminal developed speedily while limiting a temperature rise when a current flows, comprising male and female terminals each having a wire crimp portion to which a wire is crimped, and a joint portion where the male and female terminals are joined to each other, wherein a contact resistance value of the whole connecting terminal is a sum of contact resistance values in the wire crimp portions and the joint portion, and a length of a contact portion is a sum of lengths of the wire crimp portions and the joint portion, wherein a normalized contact resistance value Rter is derived by dividing the contact resistance value by the length, and a relationship of a wire resistance value Rwire of the wire, a current value I and a permissive increase in temperature ?T to the normalized contact resistance value Rter is expressed by Rter<?T/(752×I2)?3.7×Rwire.
    Type: Application
    Filed: October 3, 2007
    Publication date: September 24, 2009
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shigeru Sawada, Hideo Hoshi
  • Patent number: 7466554
    Abstract: A pivotal mounting structure for an electronic device, an electronic device utilizing the pivotal mounting structure, and a method of mounting an electronic device on a rack. The pivotal mounting structure allows an electronic device to be mounted in a rack, and allows the electronic device to pivot up so that the front operating panel can be set at an angel with respect to the rack. The structure comprises a angle member, a side plate, a pivot shaft, a holding section, and a support device. The side plate is attached to the electronic device, and the angle member is attached to the rack. The pivotal shaft allows rotation between the angle member and the side plate. The holding section and the supporting device allows the angle between the angle plate and side plate to be maintained at specific angles.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: December 16, 2008
    Assignee: Roland Corporation
    Inventors: Sinichi Matsumoto, Shigeru Sawada
  • Patent number: 7307290
    Abstract: A compound semiconductor wafer providing an InGaAs light receiving layer having superior crystal characteristic suitable for a near-infrared sensor includes an InAsxP1-x graded buffer layer consisting of a plurality of layers positioned on an InP substrate and an InAsyP1-y buffer layer positioned on the graded buffer layer, sandwiched between said InP substrate and the InGaAs layer, wherein maximum value of PL light emission intensity at an interface of each of the layers of the graded buffer layer and the buffer layer is, at every interface, smaller than 3/10 of the maximum PL light emission intensity of the buffer layer.
    Type: Grant
    Filed: April 13, 2004
    Date of Patent: December 11, 2007
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Iwasaki, Shigeru Sawada, Hiroya Kimura, Kenji Ohki
  • Publication number: 20070019566
    Abstract: A receiver apparatus which receives streaming data transmitted from a distribution server via a network, includes: a comparison section configured to compare a time when a re-transmission process of the received streaming data is estimated to be completed with a time when an error correction process of the received streaming data is estimated to be started, when the error correction process can not be applied to the streaming data; and a re-transmission request section configured to send the distribution server a first re-transmission request for requesting that the streaming data be re-transmitted, when it is determined that the time when the re-transmission process is estimated to be completed is going to be earlier than the time when the error correction process is estimated to be started.
    Type: Application
    Filed: July 21, 2006
    Publication date: January 25, 2007
    Applicant: Sanyo Electric Co., Ltd.
    Inventors: Shigeru Sawada, Yoshikazu Kita, Norio Fujino, Masashi Fujita
  • Publication number: 20060133050
    Abstract: A pivotal mounting structure for an electronic device, an electronic device utilizing the pivotal mounting structure, and a method of mounting an electronic device on a rack. The pivotal mounting structure allows an electronic device to be mounted in a rack, and allows the electronic device to pivot up so that the front operating panel can be set at an angel with respect to the rack. The structure comprises a angle member, a side plate, a pivot shaft, a holding section, and a support device. The side plate is attached to the electronic device, and the angle member is attached to the rack. The pivotal shaft allows rotation between the angle member and the side plate. The holding section and the supporting device allows the angle between the angle plate and side plate to be maintained at specific angles.
    Type: Application
    Filed: September 27, 2005
    Publication date: June 22, 2006
    Inventors: Sinichi Matsumoto, Shigeru Sawada
  • Patent number: D719211
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: December 9, 2014
    Assignee: Roland Corporation
    Inventors: Shigeru Sawada, Fumihiko Miura
  • Patent number: D735146
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: July 28, 2015
    Assignee: ROLAND CORPORATION
    Inventor: Shigeru Sawada
  • Patent number: D837874
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: January 8, 2019
    Assignee: Roland Corporation
    Inventors: Shigeru Sawada, Hirotaka Koga
  • Patent number: D881984
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: April 21, 2020
    Assignee: Roland Corporation
    Inventors: Shigeru Sawada, Ryohei Kanayama, Kotaro Nomura
  • Patent number: D884782
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: May 19, 2020
    Assignee: Roland Corporation
    Inventors: Shigeru Sawada, Hirotaka Koga
  • Patent number: D902988
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: November 24, 2020
    Assignee: Roland Corporation
    Inventors: Shigeru Sawada, Kensuke Shiraki, Hirotaka Koga