Patents by Inventor Shigeru Sawada
Shigeru Sawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10249306Abstract: A speaker identification device includes: a primary speaker identification unit that computes, for each pre-stored registered speaker, a score that indicates the similarity between input speech and speech of the registered speakers; a similar speaker selection unit that selects a plurality of the registered speakers as similar speakers according to the height of the scores thereof; a learning unit that creates a classifier for each similar speaker by sorting the speech of a certain similar speaker among the similar speakers as a positive instance and the speech of the other similar speakers as negative instances; and a secondary speaker identification unit that computes, for each classifier, a score of the classifier with respect to the input speech, and outputs an identification result.Type: GrantFiled: January 16, 2014Date of Patent: April 2, 2019Assignee: NEC CORPORATIONInventors: Masahiro Tani, Takafumi Koshinaka, Yoshifumi Onishi, Shigeru Sawada
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Patent number: 9966163Abstract: An electric contact material for a connector includes a base material made of a metal material; an alloy layer that is formed on the base material and made of an alloy containing at least three elements including Sn and Cu as well as at least one metal selected from Zn, Co, Ni, and Pd; and a conductive coating layer formed on the surface of the alloy layer. The alloy layer contains an intermetallic compound obtained by replacing some of the Cu atoms in Cu6Sn5 with at least one metal selected from Zn, Co, Ni, and Pd. It is preferable that the content of at least one metal selected from Zn, Co, Ni, and Pd in the alloy layer is in a range of 1 to 50 atom % when the total content of the metal and Cu is regarded as 100 atom %.Type: GrantFiled: September 10, 2014Date of Patent: May 8, 2018Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Shigeru Sawada
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Patent number: 9954297Abstract: A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 ?m2.Type: GrantFiled: October 16, 2015Date of Patent: April 24, 2018Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hajime Watanabe, Yoshifumi Saka, Shigeru Sawada
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Publication number: 20170302016Abstract: A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 ?m2.Type: ApplicationFiled: October 16, 2015Publication date: October 19, 2017Inventors: Hajime WATANABE, Yoshifumi SAKA, Shigeru SAWADA
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Publication number: 20160247592Abstract: An electric contact material for a connector includes a base material made of a metal material; an alloy layer that is formed on the base material and made of an alloy containing at least three elements including Sn and Cu as well as at least one metal selected from Zn, Co, Ni, and Pd; and a conductive coating layer formed on the surface of the alloy layer. The alloy layer contains an intermetallic compound obtained by replacing some of the Cu atoms in Cu6Sn5 with at least one metal selected from Zn, Co, Ni, and Pd. It is preferable that the content of at least one metal selected from Zn, Co, Ni, and Pd in the alloy layer is in a range of 1 to 50 atom % when the total content of the metal and Cu is regarded as 100 atom %.Type: ApplicationFiled: September 10, 2014Publication date: August 25, 2016Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Shigeru SAWADA
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Publication number: 20150356974Abstract: A speaker identification device includes: a primary speaker identification unit that computes, for each pre-stored registered speaker, a score that indicates the similarity between input speech and speech of the registered speakers; a similar speaker selection unit that selects a plurality of the registered speakers as similar speakers according to the height of the scores thereof; a learning unit that creates a classifier for each similar speaker by sorting the speech of a certain similar speaker among the similar speakers as a positive instance and the speech of the other similar speakers as negative instances; and a secondary speaker identification unit that computes, for each classifier, a score of the classifier with respect to the input speech, and outputs an identification result.Type: ApplicationFiled: January 16, 2014Publication date: December 10, 2015Applicant: NEC CorporationInventors: MASAHIRO TANI, TAKAFUMI KOSHINAKA, YOSHIFUMI ONISHI, SHIGERU SAWADA
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Patent number: 7963792Abstract: Provided is a plug detachment prevention structure, such that when a plug equipped with a plug terminal and a plug retaining section that covers a part of the plug terminal is connected to a jack provided inside a housing, the plug detachment prevention structure retains the plug retaining section to prevent the plug from detaching from the jack, wherein the plug detachment prevention structure is equipped with a ring-shaped elastic section composed of an elastic material in which the plug retaining section is pressure-inserted, and a frame section that is circularly mounted at an outer circumferential side of the elastic section, composed of a material harder than that of the elastic section and detachably attached on an outside of the housing.Type: GrantFiled: May 21, 2010Date of Patent: June 21, 2011Assignee: Roland CorporationInventors: Shigeru Sawada, Kazuhiko Matsuoka
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Publication number: 20110053402Abstract: Provided is a plug detachment prevention structure, such that when a plug equipped with a plug terminal and a plug retaining section that covers a part of the plug terminal is connected to a jack provided inside a housing, the plug detachment prevention structure retains the plug retaining section to prevent the plug from detaching from the jack, wherein the plug detachment prevention structure is equipped with a ring-shaped elastic section composed of an elastic material in which the plug retaining section is pressure-inserted, and a frame section that is circularly mounted at an outer circumferential side of the elastic section, composed of a material harder than that of the elastic section and detachably attached on an outside of the housing.Type: ApplicationFiled: May 21, 2010Publication date: March 3, 2011Applicant: ROLAND CORPORATIONInventors: Shigeru Sawada, Kazuhiko Matsuoka
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Patent number: 7824236Abstract: A connecting terminal developed speedily while limiting a temperature rise when a current flows, comprising male and female terminals each having a wire crimp portion to which a wire is crimped, and a joint portion where the male and female terminals are joined to each other, wherein a contact resistance value of the whole connecting terminal is a sum of contact resistance values in the wire crimp portions and the joint portion, and a length of a contact portion is a sum of lengths of the wire crimp portions and the joint portion, wherein a normalized contact resistance value Rter is derived by dividing the contact resistance value by the length, and a relationship of a wire resistance value Rwire of the wire, a current value I and a permissive increase in temperature ?T to the normalized contact resistance value Rter is expressed by Rter<?T/(752×I2)?3.7×Rwire.Type: GrantFiled: October 3, 2007Date of Patent: November 2, 2010Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Shigeru Sawada, Hideo Hoshi
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Publication number: 20090239425Abstract: A connecting terminal developed speedily while limiting a temperature rise when a current flows, comprising male and female terminals each having a wire crimp portion to which a wire is crimped, and a joint portion where the male and female terminals are joined to each other, wherein a contact resistance value of the whole connecting terminal is a sum of contact resistance values in the wire crimp portions and the joint portion, and a length of a contact portion is a sum of lengths of the wire crimp portions and the joint portion, wherein a normalized contact resistance value Rter is derived by dividing the contact resistance value by the length, and a relationship of a wire resistance value Rwire of the wire, a current value I and a permissive increase in temperature ?T to the normalized contact resistance value Rter is expressed by Rter<?T/(752×I2)?3.7×Rwire.Type: ApplicationFiled: October 3, 2007Publication date: September 24, 2009Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Shigeru Sawada, Hideo Hoshi
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Patent number: 7466554Abstract: A pivotal mounting structure for an electronic device, an electronic device utilizing the pivotal mounting structure, and a method of mounting an electronic device on a rack. The pivotal mounting structure allows an electronic device to be mounted in a rack, and allows the electronic device to pivot up so that the front operating panel can be set at an angel with respect to the rack. The structure comprises a angle member, a side plate, a pivot shaft, a holding section, and a support device. The side plate is attached to the electronic device, and the angle member is attached to the rack. The pivotal shaft allows rotation between the angle member and the side plate. The holding section and the supporting device allows the angle between the angle plate and side plate to be maintained at specific angles.Type: GrantFiled: September 27, 2005Date of Patent: December 16, 2008Assignee: Roland CorporationInventors: Sinichi Matsumoto, Shigeru Sawada
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Patent number: 7307290Abstract: A compound semiconductor wafer providing an InGaAs light receiving layer having superior crystal characteristic suitable for a near-infrared sensor includes an InAsxP1-x graded buffer layer consisting of a plurality of layers positioned on an InP substrate and an InAsyP1-y buffer layer positioned on the graded buffer layer, sandwiched between said InP substrate and the InGaAs layer, wherein maximum value of PL light emission intensity at an interface of each of the layers of the graded buffer layer and the buffer layer is, at every interface, smaller than 3/10 of the maximum PL light emission intensity of the buffer layer.Type: GrantFiled: April 13, 2004Date of Patent: December 11, 2007Assignee: Sumitomo Electric Industries, Ltd.Inventors: Takashi Iwasaki, Shigeru Sawada, Hiroya Kimura, Kenji Ohki
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Publication number: 20070019566Abstract: A receiver apparatus which receives streaming data transmitted from a distribution server via a network, includes: a comparison section configured to compare a time when a re-transmission process of the received streaming data is estimated to be completed with a time when an error correction process of the received streaming data is estimated to be started, when the error correction process can not be applied to the streaming data; and a re-transmission request section configured to send the distribution server a first re-transmission request for requesting that the streaming data be re-transmitted, when it is determined that the time when the re-transmission process is estimated to be completed is going to be earlier than the time when the error correction process is estimated to be started.Type: ApplicationFiled: July 21, 2006Publication date: January 25, 2007Applicant: Sanyo Electric Co., Ltd.Inventors: Shigeru Sawada, Yoshikazu Kita, Norio Fujino, Masashi Fujita
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Publication number: 20060133050Abstract: A pivotal mounting structure for an electronic device, an electronic device utilizing the pivotal mounting structure, and a method of mounting an electronic device on a rack. The pivotal mounting structure allows an electronic device to be mounted in a rack, and allows the electronic device to pivot up so that the front operating panel can be set at an angel with respect to the rack. The structure comprises a angle member, a side plate, a pivot shaft, a holding section, and a support device. The side plate is attached to the electronic device, and the angle member is attached to the rack. The pivotal shaft allows rotation between the angle member and the side plate. The holding section and the supporting device allows the angle between the angle plate and side plate to be maintained at specific angles.Type: ApplicationFiled: September 27, 2005Publication date: June 22, 2006Inventors: Sinichi Matsumoto, Shigeru Sawada
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Patent number: D719211Type: GrantFiled: October 24, 2013Date of Patent: December 9, 2014Assignee: Roland CorporationInventors: Shigeru Sawada, Fumihiko Miura
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Patent number: D735146Type: GrantFiled: February 20, 2014Date of Patent: July 28, 2015Assignee: ROLAND CORPORATIONInventor: Shigeru Sawada
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Patent number: D837874Type: GrantFiled: November 1, 2017Date of Patent: January 8, 2019Assignee: Roland CorporationInventors: Shigeru Sawada, Hirotaka Koga
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Patent number: D881984Type: GrantFiled: June 14, 2018Date of Patent: April 21, 2020Assignee: Roland CorporationInventors: Shigeru Sawada, Ryohei Kanayama, Kotaro Nomura
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Patent number: D884782Type: GrantFiled: September 20, 2018Date of Patent: May 19, 2020Assignee: Roland CorporationInventors: Shigeru Sawada, Hirotaka Koga
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Patent number: D902988Type: GrantFiled: June 14, 2018Date of Patent: November 24, 2020Assignee: Roland CorporationInventors: Shigeru Sawada, Kensuke Shiraki, Hirotaka Koga