Patents by Inventor Shigeru Sekiya

Shigeru Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive paste
    Patent number: 4410457
    Abstract: An electroconductive paste comprising(a) an electroconductive filler,(b) a reactive solvent, and(c) a hardener comprising(c-1) an epoxy resin,(c-2) a latent hardener, and(c-3) an epoxy compound-dialkylamine adduct,the percent by weight of (a), (b) and (c) being 95 to 50, 1 to 20 and 4 to 30, respectively, and the weight ratio of (c-1):(c-2):(c-3) being 100:0 to 30:0.1 to 40. The paste is useful for bonding electronic elements to metal lead frames and/or substrates.
    Type: Grant
    Filed: May 5, 1982
    Date of Patent: October 18, 1983
    Assignees: Sumitomo Chemical Co., Ltd., Sumitomo Metal Mining Company, Ltd.
    Inventors: Kenji Fujimura, Shigeru Sekiya, Kunimasa Kamio, Koichi Okuno, Satoru Haraguchi, Koiti Ohasi, Hiroyuki Yamaguchi