Abstract: An electric drive device and an electric power steering device that reduce temperature increase of a magnetic sensor are provided. The electric drive device includes: an electric motor; an electronic control device including a magnet at an anti-load side end of a shaft to control drive of the electric motor, and a circuit board on the anti-load side of the shaft on an extended line in an axial direction of the shaft; first coil wiring connecting the first coil groups of the electric motor to the circuit board; and second coil wiring connecting the second coil groups of the electric motor to the circuit board. Each of the first and second coil wiring includes a first portion projecting in a direction intersecting the axial direction of the shaft to the outside of the housing, and a second portion projecting outside the housing from the first portion toward the circuit board.

Abstract: An electric drive device and an electric power steering device that reduce temperature increase of a magnetic sensor are provided. The electric drive device includes: an electric motor; an electronic control device including a magnet at an anti-load side end of a shaft to control drive of the electric motor, and a circuit board on the anti-load side of the shaft on an extended line in an axial direction of the shaft; first coil wiring connecting the first coil groups of the electric motor to the circuit board; and second coil wiring connecting the second coil groups of the electric motor to the circuit board. Each of the first and second coil wiring includes a first portion projecting in a direction intersecting the axial direction of the shaft to the outside of the housing, and a second portion projecting outside the housing from the first portion toward the circuit board.

Abstract: A motor control unit that is connected to a motor release switch which includes FETs and is disposed between an inverter and a motor, including: a control section to detect an assist state of the inverter, to turn-ON or turn-OFF a control of the inverter based on a detection result and to detect whether abnormality is existed or not; a motor rotational speed detecting section to detect a motor rotational speed; an energy calculating section to calculate an energy based on the motor rotational speed; a judging section to turn-OFF all of the FETs of the motor release switch when the energy is within an area of safety operation; and a state detecting section to detect whether abnormality is existed or not based on information from an abnormality detecting section that detects abnormality of the sensors and the inverter, wherein the control section turns-ON the control of the inverter when the state detecting section does not detect abnormality and turns-OFF the control of the inverter when the state detecting se

Abstract: Provided are a heat dissipation substrate capable of improving heat dissipation properties of an electronic component, and an electric power steering device. In the heat dissipation substrate, a plurality of thermal vias are disposed at least in an electronic component projection region in which a region of a bottom surface portion of the electronic component is projected to a mounting surface in a direction perpendicular to the mounting surface, and a surface density of the thermal vias which occupy the mounting surface per unit area is at least partially different. The plurality of thermal vias are disposed so that the surface density of the thermal vias becomes the greatest in a dense region on an inner side of an edge portion of the electronic component projection region.

Abstract: An electronic part mounting heat-dissipating substrate which includes lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.

Abstract: Provided are a heat dissipation substrate capable of improving heat dissipation properties of an electronic component, and an electric power steering device. In the heat dissipation substrate, a plurality of thermal vias are disposed at least in an electronic component projection region in which a region of a bottom surface portion of the electronic component is projected to a mounting surface in a direction perpendicular to the mounting surface, and a surface density of the thermal vias which occupy the mounting surface per unit area is at least partially different. The plurality of thermal vias are disposed so that the surface density of the thermal vias becomes the greatest in a dense region on an inner side of an edge portion of the electronic component projection region.

Abstract: An electric power steering apparatus that drive-controls a motor by an inverter, and a motor release-switch is connected between the inverter and the motor, comprising: a control section to detect an assist state on a driving control system and to ON/OFF-switch a control of the inverter based on a detection result; a motor rotational number detecting section to detect a rotational number of the motor; an energy calculating section to calculate an energy of a motor back-EMF and a regenerative current based on the rotational number; and a judging section to compare the energy with an area of safety operation of the motor release-switch and to OFF-switch the d motor release-switch when the energy becomes within the area of safety operation. As occasion demands, the area of safety operation is calculated with the temperature.

Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.

Abstract: A motor control unit that is connected to a motor release switch which includes FETs and is disposed between an inverter and a motor, including: a control section to detect an assist state of the inverter, to turn-ON or turn-OFF a control of the inverter based on a detection result and to detect whether abnormality is existed or not; a motor rotational speed detecting section to detect a motor rotational speed; an energy calculating section to calculate an energy based on the motor rotational speed; a judging section to turn-OFF all of the FETs of the motor release switch when the energy is within an area of safety operation; and a state detecting section to detect whether abnormality is existed or not based on information from an abnormality detecting section that detects abnormality of the sensors and the inverter, wherein the control section turns-ON the control of the inverter when the state detecting section does not detect abnormality and turns-OFF the control of the inverter when the state detecting se

Abstract: Provided are a heat dissipation substrate capable of improving heat dissipation properties of an electronic component, and an electric power steering device. In the heat dissipation substrate, a plurality of thermal vias are disposed at least in an electronic component projection region in which a region of a bottom surface portion of the electronic component is projected to a mounting surface in a direction perpendicular to the mounting surface, and a surface density of the thermal vias which occupy the mounting surface per unit area is at least partially different. The plurality of thermal vias are disposed so that the surface density of the thermal vias becomes the greatest in a dense region on an inner side of an edge portion of the electronic component projection region.

Abstract: A power semiconductor module that comprises plural arrangements of power semiconductor elements comprising a power semiconductor bare chip which one electrode portion thereof is connected to a metal plate which at least one external connecting terminal is formed and other external connecting terminals which are electrically connected to other electrode portions of the power semiconductor bare chip, and that are contained in a same package, comprises wherein the power semiconductor elements are basically same outline, electrodes of the bare chip of the power semiconductor elements are mutually connected between the power semiconductor elements with a metal connector or a wiring, and the package is a resin mold package that seals the power semiconductor elements with an electrical insulating resin.

Abstract: [Problem] An object of the present invention is to provide a motor control apparatus that, with a high reliability, protects the motor release-switch comprising the semiconductor switching elements in small size and an electric power steering apparatus provided the same.

Abstract: [Problem] An object of the present invention is to miniaturize and integrate plural power semiconductors in an electronic circuit in a low cost without occurrence of a problem of a heat dissipation or the like.

Abstract: [Problem] An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.

Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.

Abstract: According to one embodiment, a display device includes an image projection unit, an optical unit and a mounting unit. The image projection unit emits an image light. The optical unit includes a first optical layer having first and second major surfaces, a second optical layer having third and fourth major surfaces and an intermediate layer provided between the second and third major surfaces. At least a portion of the image light travelling from the first major surface toward the second major surface is reflected by the intermediate layer. At least a portion of a background light travelling from the fourth major surface toward the third major surface is transmitted by the intermediate layer. The first major surface or the fourth major surface is a curved surface. The mounting unit is linked to the image projection unit and the optical unit.

Abstract: According to one embodiment, an image display device includes first and second display devices and an optical plate. The first display device includes a first display region and a frame region provided around the first display region. The second display device includes a second display region and a frame region provided around the second display region. The optical plate covers the first and second display regions and includes a light incident surface and a light exit surface. The light incident surface opposes the first and second display regions. The optical plate is configured to emit at least a portion of light emitted from any first point of the first display region and incident on an opposing point of the first point of the light incident surface in a direction from the first display region side toward the second display region side.

Abstract: According to one embodiment, an optical element includes a first optical sheet having a first major surface. The first optical sheet includes a first Fresnel lens provided in the first major surface. An optical axis of the first Fresnel lens at the first major surface is disposed at a position different from a position of a center of an outline of the first major surface.

Abstract: According to one embodiment, an image display device includes first and second display devices and an optical plate. The first display device includes a first display region and a frame region provided around the first display region. The second display device includes a second display region and a frame region provided around the second display region. The optical plate covers the first and second display regions and includes a light incident surface and a light exit surface. The light incident surface opposes the first and second display regions. The optical plate is configured to emit at least a portion of light emitted from any first point of the first display region and incident on an opposing point of the first point of the light incident surface in a direction from the first display region side toward the second display region side.

Abstract: According to one embodiment, a display device includes an image projection unit, an optical unit and a mounting unit. The image projection unit emits an image light. The optical unit includes a first optical layer having first and second major surfaces, a second optical layer having third and fourth major surfaces and an intermediate layer provided between the second and third major surfaces. At least a portion of the image light travelling from the first major surface toward the second major surface is reflected by the intermediate layer. At least a portion of a background light travelling from the fourth major surface toward the third major surface is transmitted by the intermediate layer. The first major surface or the fourth major surface is a curved surface. The mounting unit is linked to the image projection unit and the optical unit.