Abstract: This invention provides a wafer processing method comprising a process of irradiating a wafer to be processed placed on the upper surface of a sample table arranged in a processing chamber with light or electromagnetic waves to heat and remove a compound layer of a film layer that is preliminarily formed on the upper surface of the film layer of the upper surface of the wafer, wherein in the process, by receiving the light or electromagnetic waves reflected by the upper surface of the wafer, a signal indicating a temporal change in intensity using the wavelength of the light or electromagnetic waves as a parameter is corrected using information of the intensity of the light or electromagnetic waves detected by receiving the light or electromagnetic waves at a position on the circumferential side of the upper surface of the sample table.

Abstract: Provided are a pressure sensor device and method for making the same. A base member and a pressure sensor chip are joined so that a pressure receiving portion is aligned with a through hole. A pressure introduction unit and the base member are positioned and joined so that through holes thereof are continuous. The pressure introduction unit has a stepped portion in an end portion on an opened end side, and has a protruding portion protruding from the stepped portion to the base member side in an end portion.

Abstract: Provided are a pressure sensor device and method for making the same. A base member and a pressure sensor chip are joined so that a pressure receiving portion is aligned with a through hole. A pressure introduction unit and the base member are positioned and joined so that through holes thereof are continuous. The pressure introduction unit has a stepped portion in an end portion on an opened end side, and has a protruding portion protruding from the stepped portion to the base member side in an end portion.

Abstract: Aspects of a semiconductor pressure sensor device can include a semiconductor substrate having a depressed portion which forms a vacuum reference chamber, a diaphragm disposed on the front surface of the semiconductor substrate, and strain gauge resistors. The device can further include an aluminum wiring layer disposed on the semiconductor substrate, an antireflection film which is a TiN film disposed on the aluminum wiring layer, an adhesion securing and diffusion preventing layer which is a film stack of a Cr film and Pt film disposed on the TiN film, and an Au film stacked on the adhesion securing and diffusion preventing layer.

Abstract: Aspects of a semiconductor pressure sensor device can include a semiconductor substrate having a depressed portion which forms a vacuum reference chamber, a diaphragm disposed on the front surface of the semiconductor substrate, and strain gauge resistors. The device can further include an aluminium wiring layer disposed on the semiconductor substrate, an antireflection film which is a TiN film disposed on the aluminium wiring layer, an adhesion securing and diffusion preventing layer which is a film stack of a Cr film and Pt film disposed on the TiN film, and an Au film stacked on the adhesion securing and diffusion preventing layer.

Abstract: A lead frame which is disposed in an outer package is composed of three members. The lead frame is provided with contact electrodes, connector terminals, and conductive interconnections which are connected to the respective connector terminals. The arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively; that is, the arrangement direction of the contact electrodes is the same as that of the connector terminals. On the other hand, the arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively, that is, the arrangement direction of the contact electrodes is opposite to that of the connector terminals. Lead terminals of a resin cell package are connected to the contact electrodes.

Abstract: A pressure sensor device includes a pressure sensor chip containing a diaphragm, piezo-resistors, an amplifying circuit and various kinds of adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined so that their respective through holes communicate with each other. The metallic member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected to form a pressure sensor cell. With an O-ring attached to the metallic member and with the resin case pressed from above, the pressure sensor cell is secured to an enclosure, such as an oil enclosing block. Using a connector having a bending section and a threaded section, the pressure sensor cell can be secured to the connector by bending the bending section over the pressure sensor cell. The threaded section can be screwed into the enclosure.

Abstract: A pressure sensor device includes a pressure sensor cell that includes a sensor chip having a diaphragm with piezo-resistors, an amplifying circuit, and various adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined together with a joining member so that their respective through holes communicate with each other. A protective film or filler covers the joining member between the base member and the metallic pipe member. The metallic pipe member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected together by wire bonding, thus forming a pressure sensor cell. The metallic pipe member protrudes beyond an end face of the resin case to support load.

Abstract: A lead frame which is disposed in an outer package is composed of three members. The lead frame is provided with contact electrodes, connector terminals, and conductive interconnections which are connected to the respective connector terminals. The arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively; that is, the arrangement direction of the contact electrodes is the same as that of the connector terminals. On the other hand, the arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively, that is, the arrangement direction of the contact electrodes is opposite to that of the connector terminals. Lead terminals of a resin cell package are connected to the contact electrodes.

Abstract: A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.

Abstract: A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.

Abstract: A pressure sensor device includes a pressure sensor cell that includes a sensor chip having a diaphragm with piezo-resistors, an amplifying circuit, and various adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined together with a joining member so that their respective through holes communicate with each other. A protective film or filler covers the joining member between the base member and the metallic pipe member. The metallic pipe member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected together by wire bonding, thus forming a pressure sensor cell. The metallic pipe member protrudes beyond an end face of the resin case to support load.

Abstract: A physical value detecting apparatus includes a housing having a concave portion; a physical value detecting device housed in the concave portion and having a substantially rectangular shape for converting a physical value into an electric signal and outputting the electric signal; a device for taking out a signal from the physical value detecting device; an adhesive member for adhering the physical value detecting device to the concave portion; and a positioning device provided on an inner wall of the concave portion for positioning the physical value detecting device. The concave portion supports the physical value detecting device at a bottom thereof via the adhesive member without contacting corner parts of the physical value detecting device.

Abstract: A pressure sensor device includes a pressure sensor chip containing a diaphragm, piezo-resistors, an amplifying circuit and various kinds of adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined so that their respective through holes communicate with each other. The metallic member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected to form a pressure sensor cell. With an O-ring attached to the metallic member and with the resin case pressed from above, the pressure sensor cell is secured to an enclosure, such as an oil enclosing block. Using a connector having a bending section and a threaded section, the pressure sensor cell can be secured to the connector by bending the bending section over the pressure sensor cell. The threaded section can be screwed into the enclosure.

Abstract: A physical value detecting apparatus includes a housing having a concave portion; a physical value detecting device housed in the concave portion and having a substantially rectangular shape for converting a physical value into an electric signal and outputting the electric signal; a device for taking out a signal from the physical value detecting device; an adhesive member for adhering the physical value detecting device to the concave portion; and a positioning device provided on an inner wall of the concave portion for positioning the physical value detecting device. The concave portion supports the physical value detecting device at a bottom thereof via the adhesive member without contacting corner parts of the physical value detecting device.

Abstract: Rubber compositions of a selected base rubber and a specified paraffin was containing 50% or more of a normal paraffin and having a carbon area ratio of less than 4.0 as determined by gas chromatography within a carbon number range of from 23 to 42. The ratio is derived by counting a first paraffin content which is defined by the paraffin of maximum content in the wax and a second paraffin content which is defined by the paraffin of minimum content in the wax and thereafter dividing the first paraffin content by the second paraffin content. The composition is highly stable in initial tack with less dependence on temperature before curing.

Abstract: A rubber composition for use in steel-belted automobile tires containing specified amounts of a partial condensate of hexaethylolmelamine pentamethylether, a cresol resin, sulfur and a cobalt resin of an organic acid, thereby exhibiting improved adhesion to metal in warm water after vulcanization and increased extension on break after aging.

Abstract: A rubber composition for the manufacture of automotive vehicle tires suitably as a bead filler therefor. The composition comprises specified proportions of carbonblack, a modified novolak phenolic resin, hexamethylenetetramine and a polymeric cardanol based on a starting rubber component such that the resulting rubber composition has a relatively low rigidity prior to vulcanization and a relatively high dynamic modulus after vulcanization.

Abstract: Rubber compositions for use in tire treads are disclosed. One or more selected styrene-butadiene rubbers of specified glass transition temperatures are blended with a selected type of carbon black of specified physical characteristics. The composition is highly stable in runnability on dry, wet and snowy roads.

Abstract: A rubber composition for steel-belted automobile tires containing selected amounts of partial condensates of hexamethylolmelamine pentamethylether, cresol resin, sulfur and cobalt salts of organic acid, to improve its warm water to steel cords in the tire and increased tensile strength.