Abstract: A burn-in input signal input to a burn-in circuit is delivered to an internal circuit through a selector. In response to a control signal from the burn-in circuit, the selector selects either the burn-in input signal or an input signal for operating the internal circuit. In the burn-in test process, a portion of an output signal is monitored to determine the degree of degradation of the internal circuit.

Abstract: A burn-in input signal input to a burn-in circuit is delivered to an internal circuit through a selector. In response to a control signal from the burn-in circuit, the selector selects either the burn-in input signal or an input signal for operating the internal circuit. In the burn-in test process, a portion of an output signal is monitored to determine the degree of degradation of the internal circuit.

Abstract: A burn-in input signal input to a burn-in circuit is delivered to an internal circuit through a selector. In response to a control signal from the burn-in circuit, the selector selects either the burn-in input signal or an input signal for operating the internal circuit. In the burn-in test process, a portion of an output signal is monitored to determine the degree of degradation of the internal circuit.

Abstract: Providing a probe for an electronic clinical thermometer, which can measure a surface temperature and a deep body temperature of a human body securely in short time, the probe includes a cylindrical housing, a bottomed metal pipe fitted into a top end of the cylindrical housing, and a substrate having two thin-film heat-sensitive elements arranged perpendicularly on an inner wall of the bottomed metal pipe so as to fix one side edge of the substrate tightly on the inner wall. By measuring heat flux between the two thin-film heat-sensitive elements, the surface and the deep body temperatures of the human body can be predicted by applying the measured values into a heat conduction equation without waiting the sensor to reach in heat balance.

Abstract: A burn-in input signal input to a burn-in circuit is delivered to an internal circuit through a selector. In response to a control signal from the burn-in circuit, the selector selects either the burn-in input signal or an input signal for operating the internal circuit. In the burn-in test process, a portion of an output signal is monitored to determine the degree of degradation of the internal circuit.

Abstract: Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.

Abstract: Providing a probe for an electronic clinical thermometer, which can measure a surface temperature and a deep body temperature of a human body securely in short time, the probe includes a cylindrical housing, a bottomed metal pipe fitted into a top end of the cylindrical housing, and a substrate having two thin-film heat-sensitive elements arranged perpendicularly on an inner wall of the bottomed metal pipe so as to fix one side edge of the substrate tightly on the inner wall. By measuring heat flux between the two thin-film heat-sensitive elements, the surface and the deep body temperatures of the human body can be predicted by applying the measured values into a heat conduction equation without waiting the sensor to reach in heat balance.

Abstract: Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.

Abstract: Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.

Abstract: A system and method suitable for inspecting a semiconductor device whose terminals are formed from solder balls and protrude from a package is provided, thus enabling high-speed inspection of a semiconductor device having a plurality of pins. Metal protuberances corresponding to respective terminals projecting from the bottom of a package of a semiconductor device are provided on an interface substrate. Contact sections corresponding to the respective metal protuberances are provided within each of a plurality of slide sections. The semiconductor device is set on the slide section such that the terminals are disposed opposite the respective metal protuberances. The slide sections are slid over the interface substrate, thereby bringing the side surfaces of the terminals of the semiconductor device into contact with the contact sections. Each of the contact sections is formed from a conductive contact plate, an elastic film, and a slide guide having rigidity.

Abstract: There are described contact terminals which enable stable measurement of electrical characteristics of semiconductor devices. A heat-resistant insulating film having a plurality of apertures formed therein is sandwiched between an upper metal mold and a lower metal mold. The upper and lower metal molds are positioned, and conductive resin is poured into the cavity defined between the upper and lower metal molds, thereby producing a plurality of contact terminals. After removal of the upper and lower metal molds, there is produced a heat-resistant film having a plurality of contact terminals formed thereon.

Abstract: On each of the contact terminals of a test socket, one or more contact projections having a radius of curvature within a specified range, such as 0.03 to 0.3 mm, are formed in the portion of the contact terminals which contacts the corresponding external connection terminal of an electronic device. Further, a plurality of protuberances and recesses are formed on the surface of the contact projection, and each of the protuberances is formed to assume a substantially spherical surface having a radius of curvature of 2 to 15 microns. The test socket is for use in testing an electrical characteristics of an electronic device or a semiconductor package, and stable electrical contact is ensured between contact terminals of the test socket and external connection terminals of an electronic device or a semiconductor package.

Abstract: There are described contact terminals which enable stable measurement of electrical characteristics of semiconductor devices. A heat-resistant insulating film having a plurality of apertures formed therein is sandwiched between an upper metal mold and a lower metal mold. The upper and lower metal molds are positioned, and conductive resin is poured into the cavity defined between the upper and lower metal molds, thereby producing a plurality of contact terminals. After removal of the upper and lower metal molds, there is produced a heat-resistant film having a plurality of contact terminals formed thereon.

Abstract: The present invention provides a system and method suitable for inspecting a semiconductor device whose terminals are formed from solder balls and protrude from a package, thus enabling high-speed inspection of a semiconductor device having a plurality of pins. Metal protuberances corresponding to respective terminals projecting from the bottom of a package of a semiconductor device are provided on an interface substrate. Contact sections corresponding to the respective metal protuberances are provided within each of a plurality of slide sections. The semiconductor device is set on the slide section such that the terminals are disposed opposite the respective metal protuberances. The slide sections are slid over the interface substrate, thereby bringing the side surfaces of the terminals of the semiconductor device into contact with the contact sections. Each of the contact sections is formed from a conductive contact plate, a elastic film, and a slide guide having rigidity.

Abstract: A motor casing is formed in such a way that an outer peripheral surface of an edge portion of an opening of a yoke to which a permanent magnet is fixed is attached on an inner peripheral surface in a tubular peripheral edge portion of an intermediate bracket on which a brush holder is provided. The motor casing obviates the necessity for making the motor casing exceptionally large even when a radially long brush or an axially long permanent magnet is used.

Abstract: A ventilation structure in a vertically mounted motor is able to avoid clogging from accumulated brush abrasion dust. A ventilation path adapted to provide ventilation between the interior and the exterior of the motor casing is formed from a communication hole defined in a bottom portion of the motor casing, extending between the exterior of the motor casing and a circular hole defined in the bottom portion of the motor casing; a communication groove defined in an annular rib, extending upwardly from the bottom portion of the motor casing to form a bearing seat and encircling the circular hole to bypass the bearing in the bearing seat; and a gap C defined between the annular rib and a cap member covering the bearing and annular rib.