Patents by Inventor Shigeru Utsumi

Shigeru Utsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087483
    Abstract: A video display device (100) includes a board (1) on which light emitters (10) to emit light are mounted and a support (2) including a support film (20) receiving the board (1). The board (1) is installable to extend in a gravitational direction. The support (2) has an opening (5). The support film (20) has an installation surface on which the board (1) is installed and a non-installation surface opposite to the installation surface. The opening (5) in the support (2) penetrates the support (2) from the installation surface to the non-installation surface of the support film (20). The board (1) has an upper end fixed to the installation surface of the support film (20) and a lower end extending through the opening (5) and placed on the non-installation surface of the support film (20).
    Type: Application
    Filed: January 22, 2021
    Publication date: March 14, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yohei ITO, Shigeru UTSUMI, Sohei SAMEJIMA, Satoru KIRIDOSHI
  • Publication number: 20240053139
    Abstract: A gauge carrier holds an optical fiber having a gauge portion provided in one axial part thereof. A center region has a predefined stiffness and holds the gauge portion. Length in the longitudinal direction of the gauge carrier is equal to or greater than length of the gauge portion. Two split regions each have a stiffness different from that of the center portion, total length of the split regions in the longitudinal direction of the gauge carrier is greater than the length of the center region in the longitudinal direction, one of the split regions is positioned in front of the center region and holds a part of the optical fiber that is in front of the gauge portion, and the other is positioned in back of the center region and holds a part of the optical fiber that is in the back of the gauge portion.
    Type: Application
    Filed: January 25, 2021
    Publication date: February 15, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazunori TAKAGAKI, Yohei ITO, Hiroki KOBAYASHI, Tatsuya KOYAMA, Shigeru UTSUMI
  • Patent number: 11596975
    Abstract: Provided is a water repellent coating film, including: an undercoat layer formed on a surface of a base material and containing: at least one type of spherical particles having an average particle diameter of 2 ?m or more and 50 ?m or less and selected from the group consisting of spherical molten silica particles, spherical molten alumina particles, and spherical silicone resin particles; and an underlying resin; and a topcoat layer formed on the undercoat layer and containing: inorganic fine particles having an average particle diameter of 2 nm or more and 20 nm or less; and a water repellent resin. The underlying resin is preferably a polyurethane resin or a fluororesin. The water repellent resin is preferably a fluororesin or a silicone resin.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 7, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasuhiro Yoshida, Yoshinori Yamamoto, Tasuku Izutani, Natsumi Kubota, Shigeru Utsumi
  • Publication number: 20230048107
    Abstract: A cam portion (22) is attached to a first position (111) on a measurement target (110). A moving portion (24) is attached to a second position (112) on the measurement target (110) and is movable with respect to the cam portion (22) in an expanding/contracting direction of the measurement target (110). A strain portion (25) is attached to the moving portion (24) so as to fit along the measurement target (110), and is pressed against the cam portion (22). A strain of the strain portion (25) changes when the measurement target (110) expands or contracts and the moving portion moves (24) accordingly. An optical fiber sensor (10) has a temperature measurement portion (16) for measuring a temperature, and a strain measurement portion (17) for measuring a strain, and is attached to the strain portion (25).
    Type: Application
    Filed: March 25, 2020
    Publication date: February 16, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Masahiro MIYASHITA, Shigeru UTSUMI
  • Patent number: 10793748
    Abstract: Provided is a coating composition containing: water; a water-soluble organic solvent that has a flash pint of at least 80° C. and not more than 200° C. and dissolves a fluorine resin; a fluorine resin; hydrophilic silica particles; and hydrophobic silica particles. The hydrophilic silica particles are preferably contained in the coating composition in an amount of at least 0.001 mass % and not more than 1 mass %. The average particle diameter of the hydrophilic silica particles is preferably at least 5 nm and not more than 30 nm.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: October 6, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoshinori Yamamoto, Shigeru Utsumi
  • Publication number: 20190351450
    Abstract: Provided is a water repellent coating film, including: an undercoat layer formed on a surface of a base material and containing: at least one type of spherical particles having an average particle diameter of 2 ?m or more and 50 ?m or less and selected from the group consisting of spherical molten silica particles, spherical molten alumina particles, and spherical silicone resin particles; and an underlying resin; and a topcoat layer formed on the undercoat layer and containing: inorganic fine particles having an average particle diameter of 2 nm or more and 20 nm or less; and a water repellent resin. The underlying resin is preferably a polyurethane resin or a fluororesin. The water repellent resin is preferably a fluororesin or a silicone resin.
    Type: Application
    Filed: February 14, 2017
    Publication date: November 21, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasuhiro YOSHIDA, Yoshinori YAMAMOTO, Tasuku IZUTANI, Natsumi KUBOTA, Shigeru UTSUMI
  • Publication number: 20180142129
    Abstract: Provided is a coating composition containing: water; a water-soluble organic solvent that has a flash pint of at least 80° C. and not more than 200° C. and dissolves a fluorine resin; a fluorine resin; hydrophilic silica particles; and hydrophobic silica particles. The hydrophilic silica particles are preferably contained in the coating composition in an amount of at least 0.001 mass % and not more than 1 mass %. The average particle diameter of the hydrophilic silica particles is preferably at least 5 nm and not more than 30 nm.
    Type: Application
    Filed: February 10, 2016
    Publication date: May 24, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yoshinori YAMAMOTO, Shigeru UTSUMI
  • Patent number: 8148647
    Abstract: An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being cured after each covering the surfaces of a metal plate (1) provided with first throughholes (1a) therein and the inner walls of the first throughholes (1a); prepregs (4a) and (4b) being cured after glass clothes (3a) and (3b) are sandwiched between the prepregs (2a) and (2b), and the prepregs (4a) and (4b), respectively; and second throughholes (8) that connect wiring layers (7a) and (7c), and (7b) and (7d) provided on both surfaces of prepregs (6a) and (6b), respectively. The prepregs (2a) and (2b) and the prepregs (4a) and (4b) are characterized in that they contain inorganic filler. Furthermore, the prepregs (2a) and (2b) and the prepregs (4a) and (4b) may contain elastomer.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: April 3, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventors: Souhei Samejima, Sadao Sato, Hiroyuki Osuga, Shigeru Utsumi, Teruhiko Kumada
  • Patent number: 8043678
    Abstract: The present invention relates to a radome which has excellent transmission loss of radio waves and structural strength, which can be easily produced, and which has favorable workability, and a method of producing the same. The radome includes an olefin woven material and a glass cloth, in which the olefin woven material and the glass cloth are impregnated with a matrix resin to be integrated with each other, and the glass cloth is disposed closer to an inner side of the radome than the olefin woven material. As the olefin woven material, a woven material formed of an ultrahigh molecular weight polyethylene fiber can be used. As the matrix resin, an epoxy resin, a vinyl ester resin, an unsaturated polyester resin, or a silicone resin can be used.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: October 25, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shigeru Utsumi, Muneo Murakami, Kimihiro Kaneko, Teruhiko Kumada
  • Publication number: 20110243975
    Abstract: A transformed soybean plant having a gene encoding a modified seed storage protein introduced therein, obtained by inserting a gene encoding an Alzheimer's disease vaccine to a variable region(s) of a gene encoding a wild-type seed storage protein, is produced, and said vaccine is produced and accumulated in the seeds thereof.
    Type: Application
    Filed: November 26, 2009
    Publication date: October 6, 2011
    Inventors: Teruhiko Terakawa, Hisakazu Hasegawa, Masao Ishimoto, Shigeru Utsumi, Yasuko Utsumi, Mikio Shoji, Takeshi Kawarabayashi
  • Publication number: 20090148681
    Abstract: The present invention relates to a radome which has excellent transmission loss of radio waves and structural strength, which can be easily produced, and which has favorable workability, and a method of producing the same. The radome includes an olefin woven material and a glass cloth, in which the olefin woven material and the glass cloth are impregnated with a matrix resin to be integrated with each other, and the glass cloth is disposed closer to an inner side of the radome than the olefin woven material. As the olefin woven material, a woven material formed of an ultrahigh molecular weight polyethylene fiber can be used. As the matrix resin, an epoxy resin, a vinyl ester resin, an unsaturated polyester resin, or a silicone resin can be used.
    Type: Application
    Filed: October 29, 2008
    Publication date: June 11, 2009
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shigeru UTSUMI, Muneo Murakami, Kimihiro Kaneko, Teruhiko Kumada
  • Publication number: 20080047742
    Abstract: An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being cured after each covering the surfaces of a metal plate (1) provided with first throughholes (1a) therein and the inner walls of the first throughholes (1a); prepregs (4a) and (4b) being cured after glass clothes (3a) and (3b) are sandwiched between the prepregs (2a) and (2b), and the prepregs (4a) and (4b), respectively; and second throughholes (8) that connect wiring layers (7a) and (7c), and (7b) and (7d) provided on both surfaces of prepregs (6a) and (6b), respectively. The prepregs (2a) and (2b) and the prepregs (4a) and (4b) are characterized in that they contain inorganic filler. Furthermore, the prepregs (2a) and (2b) and the prepregs (4a) and (4b) may contain elastomer.
    Type: Application
    Filed: August 1, 2007
    Publication date: February 28, 2008
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Souhei SAMEJIMA, Sadao Sato, Hiroyuki Osuga, Shigeru Utsumi, Teruhiko Kumada
  • Patent number: 7038143
    Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not melted during thermo-compression bonding, and an adherent insulator melted during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode is made uniform by interposing the dielectric film between the first and second electrodes. A wiring board ensured as to lifetime and improved in reliability, and a simple method of fabricating such a wiring board are achieved.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: May 2, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeru Utsumi, Hirofumi Fujioka, Seiji Oka, Hideki Tsuruse, Taichi Kase, Takeshi Muraki
  • Publication number: 20030213615
    Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not rendered molten during thermo-compression bonding, and an adherent insulator rendered molten during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator rendered molten in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode can be set constant by interposing the dielectric film between the first and second electrodes. Accordingly, a wiring board ensured in lifetime and improved in reliability, and a fabrication method of such a wiring board can be obtained.
    Type: Application
    Filed: April 25, 2003
    Publication date: November 20, 2003
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeru Utsumi, Hirofumi Fujioka, Seiji Oka, Hideki Tsuruse, Taichi Kase, Takeshi Muraki
  • Patent number: 6576820
    Abstract: A region containing the glutelin gene promoter, which expresses a gene specifically in the endosperm of rice plant seed, was isolated; a vector was constructed to have the natural or modified soybean glycinin gene ligated downstream of the promoter; the vector construct was introduced into a cultured cell of rice plant; and thus a transgenic rice plant was obtained. The inventors studied the tissue specificity and form of soybean glycinin expressed in the created transgenic rice plant, and then found that the expressed soybean glycinin was accumulated in rice plant seeds in the transgenic rice plant and that the accumulated soybean glycinin was present as the matured protein formed by protein processing.
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: June 10, 2003
    Assignees: National Institute of Agrobiological Sciences, Bio-Oriented Technology Research Advancement Institution
    Inventors: Fumio Takaiwa, Shigeru Utsumi, Tomoyuki Katsube-Tanaka