Patents by Inventor Shigeru Utsumi
Shigeru Utsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240087483Abstract: A video display device (100) includes a board (1) on which light emitters (10) to emit light are mounted and a support (2) including a support film (20) receiving the board (1). The board (1) is installable to extend in a gravitational direction. The support (2) has an opening (5). The support film (20) has an installation surface on which the board (1) is installed and a non-installation surface opposite to the installation surface. The opening (5) in the support (2) penetrates the support (2) from the installation surface to the non-installation surface of the support film (20). The board (1) has an upper end fixed to the installation surface of the support film (20) and a lower end extending through the opening (5) and placed on the non-installation surface of the support film (20).Type: ApplicationFiled: January 22, 2021Publication date: March 14, 2024Applicant: Mitsubishi Electric CorporationInventors: Yohei ITO, Shigeru UTSUMI, Sohei SAMEJIMA, Satoru KIRIDOSHI
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Publication number: 20240053139Abstract: A gauge carrier holds an optical fiber having a gauge portion provided in one axial part thereof. A center region has a predefined stiffness and holds the gauge portion. Length in the longitudinal direction of the gauge carrier is equal to or greater than length of the gauge portion. Two split regions each have a stiffness different from that of the center portion, total length of the split regions in the longitudinal direction of the gauge carrier is greater than the length of the center region in the longitudinal direction, one of the split regions is positioned in front of the center region and holds a part of the optical fiber that is in front of the gauge portion, and the other is positioned in back of the center region and holds a part of the optical fiber that is in the back of the gauge portion.Type: ApplicationFiled: January 25, 2021Publication date: February 15, 2024Applicant: Mitsubishi Electric CorporationInventors: Kazunori TAKAGAKI, Yohei ITO, Hiroki KOBAYASHI, Tatsuya KOYAMA, Shigeru UTSUMI
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Patent number: 11596975Abstract: Provided is a water repellent coating film, including: an undercoat layer formed on a surface of a base material and containing: at least one type of spherical particles having an average particle diameter of 2 ?m or more and 50 ?m or less and selected from the group consisting of spherical molten silica particles, spherical molten alumina particles, and spherical silicone resin particles; and an underlying resin; and a topcoat layer formed on the undercoat layer and containing: inorganic fine particles having an average particle diameter of 2 nm or more and 20 nm or less; and a water repellent resin. The underlying resin is preferably a polyurethane resin or a fluororesin. The water repellent resin is preferably a fluororesin or a silicone resin.Type: GrantFiled: February 14, 2017Date of Patent: March 7, 2023Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasuhiro Yoshida, Yoshinori Yamamoto, Tasuku Izutani, Natsumi Kubota, Shigeru Utsumi
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Publication number: 20230048107Abstract: A cam portion (22) is attached to a first position (111) on a measurement target (110). A moving portion (24) is attached to a second position (112) on the measurement target (110) and is movable with respect to the cam portion (22) in an expanding/contracting direction of the measurement target (110). A strain portion (25) is attached to the moving portion (24) so as to fit along the measurement target (110), and is pressed against the cam portion (22). A strain of the strain portion (25) changes when the measurement target (110) expands or contracts and the moving portion moves (24) accordingly. An optical fiber sensor (10) has a temperature measurement portion (16) for measuring a temperature, and a strain measurement portion (17) for measuring a strain, and is attached to the strain portion (25).Type: ApplicationFiled: March 25, 2020Publication date: February 16, 2023Applicant: Mitsubishi Electric CorporationInventors: Masahiro MIYASHITA, Shigeru UTSUMI
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Patent number: 10793748Abstract: Provided is a coating composition containing: water; a water-soluble organic solvent that has a flash pint of at least 80° C. and not more than 200° C. and dissolves a fluorine resin; a fluorine resin; hydrophilic silica particles; and hydrophobic silica particles. The hydrophilic silica particles are preferably contained in the coating composition in an amount of at least 0.001 mass % and not more than 1 mass %. The average particle diameter of the hydrophilic silica particles is preferably at least 5 nm and not more than 30 nm.Type: GrantFiled: February 10, 2016Date of Patent: October 6, 2020Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Yoshinori Yamamoto, Shigeru Utsumi
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Publication number: 20190351450Abstract: Provided is a water repellent coating film, including: an undercoat layer formed on a surface of a base material and containing: at least one type of spherical particles having an average particle diameter of 2 ?m or more and 50 ?m or less and selected from the group consisting of spherical molten silica particles, spherical molten alumina particles, and spherical silicone resin particles; and an underlying resin; and a topcoat layer formed on the undercoat layer and containing: inorganic fine particles having an average particle diameter of 2 nm or more and 20 nm or less; and a water repellent resin. The underlying resin is preferably a polyurethane resin or a fluororesin. The water repellent resin is preferably a fluororesin or a silicone resin.Type: ApplicationFiled: February 14, 2017Publication date: November 21, 2019Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasuhiro YOSHIDA, Yoshinori YAMAMOTO, Tasuku IZUTANI, Natsumi KUBOTA, Shigeru UTSUMI
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Publication number: 20180142129Abstract: Provided is a coating composition containing: water; a water-soluble organic solvent that has a flash pint of at least 80° C. and not more than 200° C. and dissolves a fluorine resin; a fluorine resin; hydrophilic silica particles; and hydrophobic silica particles. The hydrophilic silica particles are preferably contained in the coating composition in an amount of at least 0.001 mass % and not more than 1 mass %. The average particle diameter of the hydrophilic silica particles is preferably at least 5 nm and not more than 30 nm.Type: ApplicationFiled: February 10, 2016Publication date: May 24, 2018Applicant: Mitsubishi Electric CorporationInventors: Yoshinori YAMAMOTO, Shigeru UTSUMI
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Patent number: 8148647Abstract: An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being cured after each covering the surfaces of a metal plate (1) provided with first throughholes (1a) therein and the inner walls of the first throughholes (1a); prepregs (4a) and (4b) being cured after glass clothes (3a) and (3b) are sandwiched between the prepregs (2a) and (2b), and the prepregs (4a) and (4b), respectively; and second throughholes (8) that connect wiring layers (7a) and (7c), and (7b) and (7d) provided on both surfaces of prepregs (6a) and (6b), respectively. The prepregs (2a) and (2b) and the prepregs (4a) and (4b) are characterized in that they contain inorganic filler. Furthermore, the prepregs (2a) and (2b) and the prepregs (4a) and (4b) may contain elastomer.Type: GrantFiled: August 1, 2007Date of Patent: April 3, 2012Assignee: Mitsubishi Electric CorporationInventors: Souhei Samejima, Sadao Sato, Hiroyuki Osuga, Shigeru Utsumi, Teruhiko Kumada
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Patent number: 8043678Abstract: The present invention relates to a radome which has excellent transmission loss of radio waves and structural strength, which can be easily produced, and which has favorable workability, and a method of producing the same. The radome includes an olefin woven material and a glass cloth, in which the olefin woven material and the glass cloth are impregnated with a matrix resin to be integrated with each other, and the glass cloth is disposed closer to an inner side of the radome than the olefin woven material. As the olefin woven material, a woven material formed of an ultrahigh molecular weight polyethylene fiber can be used. As the matrix resin, an epoxy resin, a vinyl ester resin, an unsaturated polyester resin, or a silicone resin can be used.Type: GrantFiled: October 29, 2008Date of Patent: October 25, 2011Assignee: Mitsubishi Electric CorporationInventors: Shigeru Utsumi, Muneo Murakami, Kimihiro Kaneko, Teruhiko Kumada
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Publication number: 20110243975Abstract: A transformed soybean plant having a gene encoding a modified seed storage protein introduced therein, obtained by inserting a gene encoding an Alzheimer's disease vaccine to a variable region(s) of a gene encoding a wild-type seed storage protein, is produced, and said vaccine is produced and accumulated in the seeds thereof.Type: ApplicationFiled: November 26, 2009Publication date: October 6, 2011Inventors: Teruhiko Terakawa, Hisakazu Hasegawa, Masao Ishimoto, Shigeru Utsumi, Yasuko Utsumi, Mikio Shoji, Takeshi Kawarabayashi
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Publication number: 20090148681Abstract: The present invention relates to a radome which has excellent transmission loss of radio waves and structural strength, which can be easily produced, and which has favorable workability, and a method of producing the same. The radome includes an olefin woven material and a glass cloth, in which the olefin woven material and the glass cloth are impregnated with a matrix resin to be integrated with each other, and the glass cloth is disposed closer to an inner side of the radome than the olefin woven material. As the olefin woven material, a woven material formed of an ultrahigh molecular weight polyethylene fiber can be used. As the matrix resin, an epoxy resin, a vinyl ester resin, an unsaturated polyester resin, or a silicone resin can be used.Type: ApplicationFiled: October 29, 2008Publication date: June 11, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigeru UTSUMI, Muneo Murakami, Kimihiro Kaneko, Teruhiko Kumada
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Publication number: 20080047742Abstract: An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being cured after each covering the surfaces of a metal plate (1) provided with first throughholes (1a) therein and the inner walls of the first throughholes (1a); prepregs (4a) and (4b) being cured after glass clothes (3a) and (3b) are sandwiched between the prepregs (2a) and (2b), and the prepregs (4a) and (4b), respectively; and second throughholes (8) that connect wiring layers (7a) and (7c), and (7b) and (7d) provided on both surfaces of prepregs (6a) and (6b), respectively. The prepregs (2a) and (2b) and the prepregs (4a) and (4b) are characterized in that they contain inorganic filler. Furthermore, the prepregs (2a) and (2b) and the prepregs (4a) and (4b) may contain elastomer.Type: ApplicationFiled: August 1, 2007Publication date: February 28, 2008Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Souhei SAMEJIMA, Sadao Sato, Hiroyuki Osuga, Shigeru Utsumi, Teruhiko Kumada
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Patent number: 7038143Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not melted during thermo-compression bonding, and an adherent insulator melted during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode is made uniform by interposing the dielectric film between the first and second electrodes. A wiring board ensured as to lifetime and improved in reliability, and a simple method of fabricating such a wiring board are achieved.Type: GrantFiled: April 25, 2003Date of Patent: May 2, 2006Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigeru Utsumi, Hirofumi Fujioka, Seiji Oka, Hideki Tsuruse, Taichi Kase, Takeshi Muraki
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Publication number: 20030213615Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not rendered molten during thermo-compression bonding, and an adherent insulator rendered molten during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator rendered molten in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode can be set constant by interposing the dielectric film between the first and second electrodes. Accordingly, a wiring board ensured in lifetime and improved in reliability, and a fabrication method of such a wiring board can be obtained.Type: ApplicationFiled: April 25, 2003Publication date: November 20, 2003Applicant: Mitsubishi Denki Kabushiki KaishaInventors: Shigeru Utsumi, Hirofumi Fujioka, Seiji Oka, Hideki Tsuruse, Taichi Kase, Takeshi Muraki
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Patent number: 6576820Abstract: A region containing the glutelin gene promoter, which expresses a gene specifically in the endosperm of rice plant seed, was isolated; a vector was constructed to have the natural or modified soybean glycinin gene ligated downstream of the promoter; the vector construct was introduced into a cultured cell of rice plant; and thus a transgenic rice plant was obtained. The inventors studied the tissue specificity and form of soybean glycinin expressed in the created transgenic rice plant, and then found that the expressed soybean glycinin was accumulated in rice plant seeds in the transgenic rice plant and that the accumulated soybean glycinin was present as the matured protein formed by protein processing.Type: GrantFiled: August 13, 2001Date of Patent: June 10, 2003Assignees: National Institute of Agrobiological Sciences, Bio-Oriented Technology Research Advancement InstitutionInventors: Fumio Takaiwa, Shigeru Utsumi, Tomoyuki Katsube-Tanaka