Abstract: An encapsulation resin composition is used to hermetically seal a gap between a base member and a semiconductor chip bonded onto the base member. The encapsulation resin composition has a reaction start temperature of 160° C. or less. A melt viscosity of the encapsulation resin composition is 200 Pa·s or less at the reaction start temperature, 400 Pa·s or less at any temperature which is equal to or higher than a temperature lower by 40° C. than the reaction start temperature and which is equal to or lower than the reaction start temperature, and 1,000 Pa·s or less at a temperature lower by 50° C. than the reaction start temperature.

Abstract: A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.

Abstract: A flux resin composition contains: 60-80% by weight of an epoxy resin; 0.01-2% by weight of an imidazole compound; 1-5% by weight of a thixo agent; 4-20% by weight of an activator; and 7-30% by weight of a phenolic compound. The epoxy resin contains at least one resin selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenol methane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins. Content of the at least one resin falls within a range from 15% by weight to 40% by weight with respect to a total weight of the flux resin composition. The phenolic resin is liquid and contains a phenol novolac.

Abstract: An encapsulation material is used to fill a gap between a base member and a semiconductor chip to be bonded onto the base member. The encapsulation material has a reaction start temperature of 160° C. or less. A total content of components volatilized from the encapsulation material when the encapsulation material is heated to at least one temperature falling within a range from 100° C. to 170° C. is 0.5% by mass or less of the entire encapsulation material.

Abstract: A reinforcing resin composition includes an epoxy resin (A), a phenolic resin (B), and a benzoxazine compound (C).

Abstract: A thermosetting composition for use as an underfill material contains: a mono- or bifunctional acrylic compound; a thermo-radical polymerization initiator; silica; and an elastomer including a 1,2-vinyl group. The thermosetting composition is liquid and has a property of turning, when cured thermally, into a cured product having a relative dielectric constant of 3.2 or less at 25° C. and a dielectric loss tangent of 0.013 or less at 25° C.

Abstract: The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator.

Abstract: An encapsulation resin composition is used to hermetically seal a gap between a base member and a semiconductor chip bonded onto the base member. The encapsulation resin composition has a reaction start temperature of 160° C. or less. A melt viscosity of the encapsulation resin composition is 200 Pa·s or less at the reaction start temperature, 400 Pa·s or less at any temperature which is equal to or higher than a temperature lower by 40° C. than the reaction start temperature and which is equal to or lower than the reaction start temperature, and 1,000 Pa·s or less at a temperature lower by 50° C. than the reaction start temperature.

Abstract: A thermosetting composition for use as an underfill material contains: a mono- or bifunctional acrylic compound; a thermo-radical polymerization initiator; silica; and an elastomer including a 1,2-vinyl group. The thermosetting composition is liquid and has a property of turning, when cured thermally, into a cured product having a relative dielectric constant of 3.2 or less at 25° C. and a dielectric loss tangent of 0.013 or less at 25° C.

Abstract: A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.

Abstract: Provided herein is a solder paste that can be used for solder connection requiring a high melting point, while, at the same time, ensuring excellent applicability, high adhesion, and excellent solder joint reliability. A mount structure mounting an electronic component with such a solder paste is also provided. The solder paste is a solder paste that includes a solder powder and a flux. The flux contains an epoxy resin, a phenolic resin, a benzooxazine compound, and an activating agent. The phenolic resin contains at least one type of phenolic resin having a phenolic hydroxyl group and an allyl group within the molecule.

Abstract: The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin.

Abstract: The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator.

Abstract: The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin.

Abstract: A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.

Abstract: In an information recording medium according to the present invention, a recording layer, a first layer, and a second layer are formed so that a thermal conductivity of the first layer that contacts one surface of the recording layer and a thermal conductivity of the second layer that contacts another surface of the recording layer are both lower than a thermal conductivity of the recording layer and a track pitch is in a range of 0.1 ?m to 0.5 ?m, inclusive.

Abstract: Disclosed is a disc-shaped recording medium manufacturing method capable of making it difficult to leave the cutting wastage produced upon forming a notch for exfoliating a stamper on a disc-shaped substrate in the case of adopting a stamper-based transfer method, and surely forming the notch to improve a manufacturing yield. This disc-shaped recording medium manufacturing method is that a spacer layer having recording faces on both surfaces thereof is formed between the disc-shaped substrate and the stamper, a notch is formed in the vicinity of an outer peripheral edge of the stamper by a rotary blade of a circle cutter, and the stamper is exfoliated through the notch while the spacer layer stays on the disc-shaped substrate.

Abstract: In an information recording medium according to the present invention, a recording layer is formed so as to be sandwiched by a first resin layer and a second resin layer, and a track pitch is in a range of 0.1 ?m to 0.5 ?m, inclusive, wherein at least one resin layer out of the first and second resin layers has a permeability according to JIS Z0208 in a range of 1 g/m2·24 h to 250 g/m2·24 h, inclusive.

Abstract: In an information recording medium according to the present invention, a recording layer, a first layer, and a second layer are formed so that a thermal conductivity of the first layer that contacts one surface of the recording layer and a thermal conductivity of the second layer that contacts another surface of the recording layer are both lower than a thermal conductivity of the recording layer and a track pitch is in a range of 0.1 ?m to 0.5 ?m, inclusive.

Abstract: An optical recoding medium including a plurality of information layers laminated on a substrate 11 through an intermediate layer 12, at least one of the information layers other than the most distant information layer from a light incidence plane of a laser beam having a fourth dielectric film 31, a reflection film 32, a third dielectric film 33, a recording film 34, a second dielectric film 35, a first dielectric film 36 and a radiation film 37, and the fourth dielectric film 31 and the third dielectric film 33 containing zirconium oxide as a main component