Abstract: A bonding method and apparatus for performing same in which a first member (e.g., a silicon chip) is bonded to a second member (e.g., a glass substrate such as a PCB) using a thermosetting resin adhesive. Near infrared rays are directed onto the second member, some of these passing through the second member to also heat the adhesive. A heater is pressed onto the first member and also heats the first member. Selective cooling is also utilized to assure an acceptable temperature gradient between both members and thereby prevent distortion of same which could harm the resulting structure.

Abstract: A lighting inspection apparatus is provided which uses a small backlight comprised of a dimmer plate and a xenon lamp or a fluorescent lamp that miniaturizes the inspection apparatus for a display panel. An inspection method is described for a display panel, which uses a dimmer plate autonomously adjusting light. The apparatus for inspecting a display panel includes: a support structure disposing thereon a display panel to be inspected; a light source; and a dimmer plate with a characteristic modulating a light transmission characteristic in accordance with an intensity of light incident thereonto, the dimmer plate being disposed between the support structure and the light source, wherein light emitted from the light source is made to transmit through the dimmer plate, then made incident onto the display panel disposed on the support structure.

Abstract: An apparatus 10 for pressing a prober according to the present invention, which can press a prober 6 on an electrode-forming portion 4 of an inspection substrate 3 at a sufficient pressure by pivoting four split pressure heads 13 separately by a cylinder 16, and ensure an intimate contact between the prober 6 and the elestrode-forming portion 4 of the inspection substrate 3.

Abstract: A bonding method and apparatus for performing same in which a first member (e.g., a silicon chip) is bonded to a second member (e.g., a glass substrate such as a PCB) using a thermosetting resin adhesive. Near infrared rays are directed onto the second member, some of these passing through the second member to also heat the adhesive. A heater is pressed onto the first member and also heats the first member. Selective cooling is also utilized to assure an acceptable temperature gradient between both members and thereby prevent distortion of same which could harm the resulting structure.

Abstract: A lighting inspection apparatus is provided which uses a small backlight comprised of a dimmer plate and a xenon lamp or a fluorescent lamp that miniaturizes the inspection apparatus for a display panel. An inspection method is described for a display panel, which uses a dimmer plate autonomously adjusting light. The apparatus for inspecting a display panel includes: a support structure disposing thereon a display panel to be inspected; a light source; and a dimmer plate with a characteristic modulating a light transmission characteristic in accordance with an intensity of light incident thereonto, the dimmer plate being disposed between the support structure and the light source, wherein light emitted from the light source is made to transmit through the dimmer plate, then made incident onto the display panel disposed on the support structure.

Abstract: A dam is formed between drawing wires adjacent to each other. This dam is formed in the same step of forming a polymer layer having a displaying electrode thereon in the polymer film on an array(PFA)-type liquid crystal display device.

Abstract: A structure for supporting a connecting member having a base material for electrically and temporarily connecting a first substrate having a terminal and a second substrate having a connection pad with each other. A supporting point of a point for contacting between the second substrate and the connecting member and a supporting point of the first substrate are separated thermally.

Abstract: A prober device is disclosed herein for making and maintaining a plurality of discrete electrical connections with an object having a plurality of conductive pads. The prober device includes an insulating substrate having a linear expansion coefficient that is less than or equal to about five times a linear expansion coefficient of the test object and a plurality of conductive probes attached thereto and having a pitch l that is substantially the same as or slightly smaller than a pitch l′ of the conductive pads. When mating the prober device to the object, the prober device is heated to compensate for a difference in the pitches of the conductive pads and of the probes. Correct positioning is permitted as a result of the difference between the linear expansion coefficients of the prober device and the test object.

Abstract: Equipment using consumables that require replacement after a predetermined number of uses includes counter arrangements for keeping track of the number of uses of each consumable. Even though some of the consumables may replace the same item, the usage count is maintained for each individual consumable. For the consumables, automatic identification of replaced items is provided whereby the counter arrangement is enabled to accumulate usage counts on the correct consumables.