Abstract: A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each other, and a first abutting part is provided between the frame and the first plate, and positioned closer to the interior space than the first bonding part. A second bonding part is provided between the frame and the second plate to bond the frame and the second plate to each other, and a second abutting part is provided between the frame and the second plate and positioned closer to the interior space than the second bonding part. The second bonding part is positioned closer to the interior space than the first bonding part.

Abstract: A manufacturing method of a hermetically sealed container, comprises steps of placing, on a first member, a first bonding material and a second bonding material having a larger compressibility in relation to a pressing force than a compressibility of the first bonding material, such that the first and second bonding materials are arranged side-to-side relationship, and the first bonding material has a height lower than a height of the second bonding material; pressing a second member to the second bonding material; heating and melting sequentially part by part the first bonding material; and cooling the first bonding material to bond together the first and second members.

Abstract: A manufacturing method of an image display apparatus, having a vacuum container with getters therein, includes the steps of exhausting an inner gas through an exhaust hole provided in the vacuum container; and activating the getters during the exhausting. In the activating step, the getters are sequentially activated first from a getter positioned in an area having a larger exhaust conductance with respect to the exhaust hole.

Abstract: There is provided a manufacturing method of an image display apparatus for activating getters so as to exhibit higher exhaust performance after sealing of a vacuum container. In an exhaust process for exhausting inner gas from an exhaust hole, activation is performed by local heating sequentially from the getters positioned in a region where an exhaust conductance is larger with respect to the exhaust hole.

Abstract: A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each other, and a first abutting part is provided between the frame and the first plate, and positioned closer to the interior space than the first bonding part. A second bonding part is provided between the frame and the second plate to bond the frame and the second plate to each other, and a second abutting part is provided between the frame and the second plate and positioned closer to the interior space than the second bonding part. The second bonding part is positioned closer to the interior space than the first bonding part.

Abstract: A manufacturing method of a hermetically sealed container, comprises steps of placing, on a first member, a first bonding material and a second bonding material having a larger compressibility in relation to a pressing force than a compressibility of the first bonding material, such that the first and second bonding materials are arranged side-to-side relationship, and the first bonding material has a height lower than a height of the second bonding material; pressing a second member to the second bonding material; heating and melting sequentially part by part the first bonding material; and cooling the first bonding material to bond together the first and second members.

Abstract: An electron source producing apparatus for forming an electron-emission part on a conductive member disposed on a substrate in an atmosphere containing a desired gas. The apparatus includes a container for forming a hermetic atmosphere between the container and a surface of the substrate on which the conductive member is formed. The container has a gas inlet and a gas outlet. A diffusing member is for diffusing an introduced gas, and is disposed between the gas inlet and the surface of the substrate. A resisting member provides exhaust resistance, and is disposed between the gas outlet and the surface of the substrate and is separated from the gas outlet. The resisting member is disposed closer to the surface of the substrate than is the diffusing member.

Abstract: A heating/cooling method, a manufacturing method of an image displaying apparatus, a heating/cooling apparatus, and a heating/cooling processing apparatus, in which the heating and cooling of a substrate can be executed at a high speed are provided.

Abstract: In an electron source manufacturing apparatus, the quantity of heat generated from an electron source substrate is measured. A temperature of a support member for the electron source substrate is controlled based on the measured quantity of heat generated. A variation in performances of electron source substrates is suppressed, which increase their life.

Abstract: A method of effecting high temperature vacuum heating and cooling suitable for conducting heat treatment to be performed on components used in a display apparatus. The heating/cooling method includes the steps of: heating a plate-like member placed in a reduced pressure atmosphere in a chamber by heating means opposed to the plate-like member; and cooling the plate-like member by a cooling plate which is opposed to the plate-like member, with the heating means therebetween, the cooling plate having a heat reflecting function. The cooling plate has an emissivity of not less than 0.50 but not more than 0.80 so as to minimize a sum of a requisite time for the heating step and a requisite time for the cooling step.

Abstract: In an apparatus for performing heating treatment of a structure composed of a substrate and a structure arranged on the front surface of the substrate, the latter structure having thermal capacity smaller than that of the substrate, heaters are arranged to be opposed to the front surface and the back surface of the substrate. A cooling body is arranged at a position opposed to the back surface of the substrate to sandwich the heater of the back surface between the cooling body and the substrate.

Abstract: On the occasion of producing an image display apparatus, in order to suppress the bend and breakage of a substrate by uniformly heating the substrate which constructs a chamber which contains the image display apparatus, a plurality of heaters are located in opposition to both sides of the substrate in a vacuum chamber, which are further surrounded by a heat reflecting member, a partitioning member is located between end faces of the substrate and the heat reflecting member, and the substrate is heated.

Abstract: A voltage applying apparatus including a holder, a probe and the like as voltage applying means enabling the application of a voltage to electrode wiring connected with electric conductors formed on a substrate on which the electrode wiring is formed. The apparatus is equipped with aligning means making the position of the probe follow to the changes of the position of the electrode wiring to coincide with them. The aligning means makes the position of the probe follow the position of the electrode wiring so that the probe aligns the electrode wiring by the thermal expansion of the holder.

Abstract: A probe for applying a voltage to lines provided on a substrate comprises (a) a conductive sheet, the conductive sheet including a mesh sheet in which linear members are woven into a mesh and a conductive material which coats the mesh sheet, (b) an elastic member for pressing the conductive sheet against the lines, and (c) a holding member for holding the conductive sheet and the elastic member together. The probe has improved electrical connectivity and durability, and achieves a reduction in size and facilitation of operations of an apparatus for manufacturing an electron source.

Abstract: An electron source producing apparatus for forming an electron-emission part on a conductive member disposed on a substrate in an atmosphere containing a desired gas. The apparatus includes a container for forming a hermetic atmosphere between the container and a surface of the substrate on which the conductive member is formed. The container has a gas inlet and a gas outlet. A diffusing member is for diffusing an introduced gas, and is disposed between the gas inlet and the surface of the substrate. A resisting member provides exhaust resistance, and is disposed between the gas outlet and the surface of the substrate and is separated from the gas outlet. The resisting member is disposed closer to the surface of the substrate than is the diffusing member.

Abstract: In an apparatus for performing heating treatment of a structure composed of a substrate and a structure arranged on the front surface of the substrate, the latter structure having thermal capacity smaller than that of the substrate, heaters are arranged to be opposed to the front surface and the back surface of the substrate, respectively, and a cooling body is arranged at a position opposed to the back surface of the substrate to sandwich the heater of the back surface between the cooling body and the substrate. Thereby, the heating and the cooling of the substrate are performed rapidly to shorten the time of a heating process, and the deformation and the damage of the substrate at the time of heating are prevented.

Abstract: In an electron source manufacturing apparatus, the quantity of heat generated from an electron source substrate is measured. A temperature of a support member for the electron source substrate is controlled based on the measured quantity of heat generated. A variation in performances of electron source substrates is suppressed, which increase their life.

Abstract: On the occasion of producing an image display apparatus, in order to suppress the bend and breakage of a substrate by uniformly heating the substrate which constructs a chamber which contains the image display apparatus, a plurality of heaters are located in opposition to both sides of the substrate in a vacuum chamber, which are further surrounded by a heat reflecting member, a partitioning member is located between end faces of the substrate and the heat reflecting member, and the substrate is heated.

Abstract: A heating/cooling method, a manufacturing method of an image displaying apparatus, a heating/cooling apparatus, and a heating/cooling processing apparatus, in which the heating and cooling of a substrate can be executed at a high speed are provided.

Abstract: The present invention provides a method of effecting high temperature vacuum heating and cooling suitable for conducting heat treatment to be performed on components used in a display apparatus. The present invention's heating/cooling method comprises the steps of: heating a plate-like member placed in a reduced pressure atmosphere in a chamber by heating means opposed to the plate-like member; and cooling the plate-like member by a cooling plate which is opposed to the plate-like member, with the heating means therebetween, the cooling plate having a heat reflecting function. In one aspect of the present invention, the cooling plate is designed to have a emissivity of not less than 0.50 but not more than 0.80 so as to minimizes a sum of a requisite time for the heating step and a requisite time for the cooling step.