Patents by Inventor Shigeto Kon

Shigeto Kon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7271219
    Abstract: The present invention uses a curable resin which has: in the molecule thereof, at least two crosslinking functional groups of at least one kind selected from the group consisting of epoxy group, (meth)acryloyl group, alkenylamino group and alkenyloxy group; a glass transition temperature before curing of 50 to 150° C.; a weight-average molecular weight of 10,000 to 1,000,000; and a dielectric constant of not higher than 3.5 after curing. By use of the curable resin of the above constitution, the present invention can provide a curable resin that an insulator having an excellent thermal shock resistance and an excellent dielectric property is obtained.
    Type: Grant
    Filed: August 28, 2001
    Date of Patent: September 18, 2007
    Assignee: Sanyo Chemical Industries, Ltd.
    Inventors: Takao Saito, Shigeto Kon, Munekazu Satake, Masahito Inoue
  • Publication number: 20040102601
    Abstract: The present invention uses a curable resin which has: in the molecule thereof, at least two crosslinking functional groups of at least one kind selected from the group consisting of epoxy group, (meth)acryloyl group, alkenylamino group and alkenyloxy group; a glass transition temperature before curing of 50 to 150° C.; a weight-average molecular weight of 10,000 to 1,000,000; and a dielectric constant of not higher than 3.5 after curing. By use of the curable resin of the above constitution, the present invention can provide a curable resin that an insulator having an excellent thermal shock resistance and an excellent dielectric property is obtained.
    Type: Application
    Filed: July 25, 2003
    Publication date: May 27, 2004
    Inventors: Takao Saito, Shigeto Kon, Munekazu Satake, Masahito Inoue