Patents by Inventor Shigetomi KIDO

Shigetomi KIDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation
    Patent number: 8938878
    Abstract: A method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: January 27, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Eiji Toyoda, Shigetomi Kido
  • METHOD FOR MANUFACTURING ELECTRONIC PARTS DEVICE AND RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION
    Publication number: 20120055015
    Abstract: The present invention relates to a method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein.
    Type: Application
    Filed: September 6, 2011
    Publication date: March 8, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Eiji TOYODA, Shigetomi KIDO