Patents by Inventor Shigetoshi INUYAMA

Shigetoshi INUYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180358502
    Abstract: A sensor substrate includes a substrate comprising an upper surface including a first mounting area on which a light-emitting element is mounted, and a lower surface including a second mounting area on which a light-receiving element is mounted. The substrate is further provided with a through hole therethrough extending from a portion of the upper surface which portion is adjacent to the first mounting area, to the second mounting area of the lower surface. An inner surface of the through hole is provided with at least one protrusion (a first protrusion and a second protrusion) extending inwardly within the through hole.
    Type: Application
    Filed: December 2, 2016
    Publication date: December 13, 2018
    Applicant: KYOCERA Corporation
    Inventors: Shigetoshi INUYAMA, Yoshimasa SUGIMOTO
  • Patent number: 9947836
    Abstract: An electronic device mounting substrate includes: a first wiring substrate shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole; a second wiring substrate shaped in a rectangular frame or plate, the second wiring substrate being disposed so as to overlie a lower surface of the first wiring substrate and be electrically connected to the first wiring substrate; a metallic plate disposed so as to overlie a lower surface of the second wiring substrate so that the second wiring substrate is sandwiched between the metallic plate and the first wiring substrate; and a lens holder secured to an outer periphery of the metallic plate. A frame interior of the first wiring substrate, or a frame interior of each of the first wiring substrate and the second wiring substrate, constitutes an electronic device mounting space.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 17, 2018
    Assignee: KYOCERA CORPORATION
    Inventors: Mitsuharu Sakai, Shou Yamasaki, Shigetoshi Inuyama, Noritaka Niino
  • Publication number: 20170213940
    Abstract: An electronic device mounting substrate includes: a first wiring substrate shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole; a second wiring substrate shaped in a rectangular frame or plate, the second wiring substrate being disposed so as to overlie a lower surface of the first wiring substrate and be electrically connected to the first wiring substrate; a metallic plate disposed so as to overlie a lower surface of the second wiring substrate so that the second wiring substrate is sandwiched between the metallic plate and the first wiring substrate; and a lens holder secured to an outer periphery of the metallic plate. A frame interior of the first wiring substrate, or a frame interior of each of the first wiring substrate and the second wiring substrate, constitutes an electronic device mounting space.
    Type: Application
    Filed: March 26, 2015
    Publication date: July 27, 2017
    Applicant: KYOCERA Corporation
    Inventors: Mitsuharu SAKAI, Shou YAMASAKI, Shigetoshi INUYAMA, Noritaka NIINO