Patents by Inventor Shigetoshi Kinouchi
Shigetoshi Kinouchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240038436Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: October 11, 2023Publication date: February 1, 2024Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO, Yuto SHIGA
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Patent number: 11817252Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: January 11, 2022Date of Patent: November 14, 2023Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
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Publication number: 20220130594Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: January 11, 2022Publication date: April 28, 2022Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO
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Patent number: 11270833Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: February 13, 2020Date of Patent: March 8, 2022Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
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Patent number: 11239020Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: February 13, 2020Date of Patent: February 1, 2022Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
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Publication number: 20200185144Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: February 13, 2020Publication date: June 11, 2020Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO
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Patent number: 10643781Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: May 18, 2017Date of Patent: May 5, 2020Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito, Yuto Shiga
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Publication number: 20170345553Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: May 18, 2017Publication date: November 30, 2017Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO, Yuto SHIGA
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Patent number: 6372817Abstract: A friction material composition comprising (a) a fibrous material, (b) a binder containing a liquid rubber and (c) a friction regulator containing cashew dust is produced by coating the cashew dust with the liquid rubber, adding the fibrous material, remaining binder other than the liquid rubber and remaining friction regulator other than the cashew dust to the cashew dust coated with the liquid rubber, and then mixing.Type: GrantFiled: February 29, 2000Date of Patent: April 16, 2002Assignee: Hitachi Chemical Company, Ltd.Inventors: Shigetoshi Kinouchi, Yasuhiro Hara, Junya Yamaguchi