Abstract: There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.

Abstract: There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.

Abstract: The hybrid substrate of the present invention comprises a ceramic substrate assembly composed of a plurality of ceramic substrates, insulating resin layers disposed respectively on both surfaces of the ceramic substrate assembly such that they are opposed to each other, each of the insulating resin layers being made at least of a reinforcing material and a resin, and a metal layer disposed on each of the insulating resin layers. In particular, the hybrid substrate of the present invention comprises the plurality of ceramic substrates which are in the form of a tile arrangement along the same plane positioned between the opposed insulating resin layers.

Abstract: A circuit module includes an electronic component, a ceramic multilayer substrate and a resin wiring substrate. The ceramic multilayer substrate is provided with a wiring layer disposed on top thereof and a cavity in which the electronic component is mounted, wherein a space between the electronic component and the cavity is filled with a thermosetting resin and a surface of the filled cavity is planarized. The resin wiring substrate has an insulating adhesive layer disposed at one side thereof and provided with at least one opening filled with a conductive resin. The ceramic multilayer substrate and the resin wiring substrate are bonded by the insulating adhesive layer, and the wiring layer on the ceramic multilayer substrate is electrically connected with the conductive resin.

Abstract: A circuit module includes an electronic component, a ceramic multilayer substrate and a resin wiring substrate. The ceramic multilayer substrate is provided with a wiring layer disposed on top thereof and a cavity in which the electronic component is mounted, wherein a space between the electronic component and the cavity is filled with a thermosetting resin and a surface of the filled cavity is planarized. The resin wiring substrate has an insulating adhesive layer disposed at one side thereof and provided with at least one opening filled with a conductive resin. The ceramic multilayer substrate and the resin wiring substrate are bonded by the insulating adhesive layer, and the wiring layer on the ceramic multilayer substrate is electrically connected with the conductive resin.

Abstract: The present invention provides a method of manufacturing a circuit board module for connecting a circuit conductor (2) of a first circuit board (1) to a circuit conductor (4) of a second circuit board (5) using at least one selected from the group consisting of an anisotropic conductive film (6), an anisotropic conductive paste and an adhesive resin, wherein a difference in a pattern width between the circuit conductor of the first circuit board and that of the second circuit board is in a range of 5 ?m to 50 ?m. In such a method of manufacturing a circuit board module, connection of a connecting conductor with a narrow pitch can be realized, and poor connection can be reduced, thus providing a method of manufacturing a circuit board module having higher reliability.

Abstract: A circuit board including a plurality of substrates fixed on a main substrate with solder, wherein the plurality of substrates include a substrate having a smaller thermal expansion coefficient than the main substrate, and wherein the plurality of substrates are made by bonding together a ceramic substrate and a substrate having a higher strength than the ceramic substrate, with the higher-strength substrate bonded to the main substrate side of the ceramic substrate. Since a substrate having a higher strength than a ceramic substrate is bonded to the main substrate side of the ceramic substrate, it is possible to reduce the thermal stress applied to the ceramic substrate side of the circuit board so as to prevent cracking in the ceramic substrate, thus improving the reliability of the circuit board against a thermal stress.

Abstract: A circuit module includes an electronic component, a ceramic multilayer substrate and a resin wiring substrate. The ceramic multilayer substrate is provided with a wiring layer disposed on top thereof and a cavity in which the electronic component is mounted, wherein a space between the electronic component and the cavity is filled with a thermosetting resin and a surface of the filled cavity is planarized. The resin wiring substrate has an insulating adhesive layer disposed at one side thereof and provided with at least one opening filled with a conductive resin. The ceramic multilayer substrate and the resin wiring substrate are bonded by the insulating adhesive layer, and the wiring layer on the ceramic multilayer substrate is electrically connected with the conductive resin.

Abstract: A method for manufacturing a multi-layered ceramic substrate which enables to remove a shrinkage suppression sheet without damaging the multi-layered substrate. The shrinkage suppression sheets are formed on both faces of unfired laminated green sheets, and then the laminated green sheets are fired. For removing the shrinkage suppression sheets on both faces of the multi-layered ceramic substrate 2 after sintering, water, ceramic powder, or water and ceramic powder mixture is sprayed together with compressed air.

Abstract: Move, deformation, or damages of a green sheet can be securely prevented by improvement of the material and shape of a green sheet retainer 40 affixed to a punching tool 30 provided with a cutter section 32 for punching a via hole on a ceramic green sheet 20. The sheet retainer 40 of the present invention is composed of an elastic material with hardness between 50 to 60 degrees, and comprises: a support portion 46 disposed on one end in the axial direction with a relatively large outer diameter, thick-walled in the radial direction, and engageable in the punching tool 30; a contact portion 42 disposed on the other end in the axial direction with a relatively small outer diameter, thin-walled in the radial direction, and comes in contact with the green sheet 20; and a housing hole 48 axially extending from the contact portion 42 for housing the cutter section 32.

Abstract: A manufacturing method of a circuit board comprises the steps of: (a) feeding a printing stage having a porous member comprising a porous plate and a porous sheet, the porous sheet is composed of 90 wt % to 98 wt % of cellulose; (b) placing a plate for the circuit board having a pierced hole above the porous member; and (c) filling a conductive material in the pierced hole from an upper side of the plate for circuit board by sucking the porous member at a prescribed vacuum pressure from a back of the porous member.

Abstract: The present invention provides a method of manufacturing a circuit board module for connecting a circuit conductor (2) of a first circuit board (1) to a circuit conductor (4) of a second circuit board (5) using at least one selected from the group consisting of an anisotropic conductive film (6), an anisotropic conductive paste and an adhesive resin, wherein a difference in a pattern width between the circuit conductor of the first circuit board and that of the second circuit board is in a range of 5 &mgr;m to 50 &mgr;m. In such a method of manufacturing a circuit board module, connection of a connecting conductor with a narrow pitch can be realized, and poor connection can be reduced, thus providing a method of manufacturing a circuit board module having higher reliability.

Abstract: A method of manufacturing a multi-layered ceramic substrate which does not require dies for making cavities, or aligning the green sheets. The method includes the steps of providing a plurality of green sheets having pre-fabricated via holes and wiring patterns therein; forming a layer for preventing sintering of adjacent green sheets at an area to become the bottom of the cavity; laminating and sintering the green sheets to create a multi-layered sintered body; and making a cut along the inner wall of the cavity all the way to the bottom of the cavity and removing the inside sintered portion leaving the formed cavity. This method eliminates the need for expensive dies, thus providing a simple, stable, and inexpensive manufacturing method for a multi-layered ceramic substrate.