Patents by Inventor Shigetsugu Hayashi

Shigetsugu Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6838176
    Abstract: Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: January 4, 2005
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Kazuya Goto, Shigetsugu Hayashi, Tadayoshi Saito, Takashi Kaneko, Kazutami Mitani, Koki Wakabayashi, Yasuo Takagi
  • Publication number: 20030135011
    Abstract: Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.
    Type: Application
    Filed: October 21, 2002
    Publication date: July 17, 2003
    Inventors: Kazuya Goto, Shigetsugu Hayashi, Tadayoshi Saito, Takashi Kaneko, Kazutami Mitani, Koki Wakabayashi, Yasuo Takagi
  • Patent number: 6387479
    Abstract: The present invention relates to a repair and reinforcement method for preexisting structures such as buildings or the like, and in particular, relates to a repair and reinforcement method for concrete structures, and to an anisotropic textile employed in this method. The present invention provides a method which permits execution even in low temperature conditions, and which moreover exhibits superior repair and reinforcement effects in a short period of time; during the impregnation of a resin into a sheet material comprising reinforcement fibers and the curing of this resin to form a fiber-reinforced resin layer which is used in the repair and reinforcement of preexisting structures, a reactive mixture having a gelling period of 15 minutes or more at a temperature of 20° C. and which polymerizes even at 5° C.
    Type: Grant
    Filed: April 29, 1998
    Date of Patent: May 14, 2002
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Shigetsugu Hayashi, Masahiro Sugimori, Tomowo Sano, Tadashi Yokochi, Masayuki Fukumoto, Yasushi Suzumura, Hideo Konishi, Toshikazu Aoki, Mikio Takasu
  • Publication number: 20010004492
    Abstract: The present invention relates to a repair and reinforcement method for preexisting structures such as buildings or the like, and in particular, relates to a repair and reinforcement method for concrete structures, and to an anisotropic textile employed in this method. The present invention provides a method which permits execution even in low temperature conditions, and which moreover exhibits superior repair and reinforcement effects in a short period of time; during the impregnation of a resin into a sheet material comprising reinforcement fibers and the curing of this resin to form a fiber-reinforced resin layer which is used in the repair and reinforcement of preexisting structures, a reactive mixture having a gelling period of 15 minutes or more at a temperature of 25° C. and which polymerizes even at 5° C.
    Type: Application
    Filed: January 16, 2001
    Publication date: June 21, 2001
    Applicant: Mitsubushi Rayon Co., Ltd.
    Inventors: Shigetsugu Hayashi, Masahiro Sugimori, Tomowo Sano, Tadashi Yokochi, Masayuki Fukumoto, Yasushi Suzumura, Hideo Konishi, Toshikazu Aoki, Mikio Takasu
  • Patent number: 5279893
    Abstract: A prepreg for fiber-reinforced composite materials comprising (A) a reinforcing fiber having a modulus of elasticity of 200 GPa or more, (B) a fibrous thermoplastic resin having a modulus of elasticity of 100 GPa or less, and (C) a thermosetting matrix resin. The prepreg of the present invention does not only have excellent handling property equivalent to that of the prepreg with the conventional thermosetting resin as a matrix, but also gives excellent toughness to the resulting molded product without injuring the thermal and mechanical properties. Particularly, it has a high resistance to interlaminar fracture when exposed to impact, so that it is preferably used as a structural material for airplanes, etc.
    Type: Grant
    Filed: November 29, 1991
    Date of Patent: January 18, 1994
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Toshihiro Hattori, Takashi Murata, Kazuya Goto, Takeshi Kato, Shigetsugu Hayashi, Hisashi Tada, Masahiro Sugimori
  • Patent number: 5173545
    Abstract: A resin composition for composites which comprises as essential components(A) a three-bismaleimide mixture of N,N'-diphenylmethanebismaleimide, N,N'-tolylenebismaleimide, and N,N'-trimethylhexamethylenebismaleimide and(B) an allyl etherified substituted phenol novolak resin and/or allyl phenyl ether compound represented by the following general formula (I): ##STR1## wherein, X denotes a direct bond or the divalent radical --CH.sub.2 --, ##STR2## --O--, --S--, --SO.sub.2 --, ##STR3## or ##STR4## and R.sub.1 through R.sub.4 are the same or different in a molecule and denote each --CH.sub.3, --C.sub.2 H.sub.5, --CH(CH.sub.3).sub.2, --nC.sub.3 H.sub.7, --nC.sub.4 H.sub.9, --C(CH.sub.3).sub.3, ##STR5## --CH.sub.2 CH(CH.sub.3).sub.2, or --Br.
    Type: Grant
    Filed: July 18, 1989
    Date of Patent: December 22, 1992
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Shigetsugu Hayashi, Hisashi Tada, Takashi Murata
  • Patent number: 5166290
    Abstract: A resin composition for composites which comprises as essential components(A) a three-bismaleimide mixture of N,N'-diphenyl-methanebismaleimide, N,N'-tolylenebismaleimide, and N,N'-trimethylhexamethylenebismaleimide and(B) an allyl etherified substituted phenol novolak resin and/or allyl phenyl ether compound represented by the following general formula (I): ##STR1## wherein, X denotes a direct bond or the divalent radical ##STR2## and R.sub.1 through R.sub.4 are the same or different in a molecule and denote each --CH.sub.3, --C.sub.2 H.sub.5, --CH(CH.sub.3).sub.2, --nC.sub.3 H.sub.7, --nC.sub.4 H.sub.9, --C(CH.sub.3).sub.3, ##STR3## --CH.sub.2 CH(CH.sub.3).sub.2, or --Br.
    Type: Grant
    Filed: April 13, 1992
    Date of Patent: November 24, 1992
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Shigetsugu Hayashi, Hisashi Tada, Takashi Murata
  • Patent number: 4956411
    Abstract: An epoxy resin composition is disclosed that can be cured at a temperature of 150.degree. C. or below, and can be used to provide a high performance carbon fiber composite material having a 0.degree. direction bending strength of 220 kg/mm.sup.2 or over, and an interlayer shear strength of 10 kg/mm.sup.2 or over.The composition is made up of:(A) an epoxy compound containing 10 to 100% by weight of m- or o-methyl-p-N,N-diglycidyl-aminophenyl-ester or its oligomer,(B) diaminodiphenylsulfone and/or diaminodiphenylmethane,(C) dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipil dihydrazide, azelayl dihydrazide, or isophthalic acid dihydrazide, and(D) a urea compound.
    Type: Grant
    Filed: January 30, 1989
    Date of Patent: September 11, 1990
    Assignee: Mitsubishi Rayon Company, Ltd.
    Inventors: Hisashi Tada, Yoshinobu Shiraishi, Shigetsugu Hayashi