Patents by Inventor Shigeya Kurimura

Shigeya Kurimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate dividing method
    Patent number: 9431299
    Abstract: A package substrate is divided into a plurality of device packages. An adhesive tape is attached to a back side of the substrate by cutting the substrate along a plurality of division lines formed on a front side of the substrate. The substrate includes a device portion partitioned into a plurality of device package regions by the division lines, and a marginal portion surrounding the device portion. A first ultraviolet light is applied to reduce the adhesive force of the adhesive tape in the marginal portion. The adhesive tape is partially peeled from the substrate in the marginal portion, and the substrate is cut along each division line by using a cutting blade to thereby divide the substrate into the device packages. In the dividing step, the marginal portion separated from the substrate is scattered by rotation of the cutting blade and thereby removed from the adhesive tape.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: August 30, 2016
    Assignee: Disco Corporation
    Inventors: Hayato Kiuchi, Shigeya Kurimura
  • PACKAGE SUBSTRATE DIVIDING METHOD
    Publication number: 20160148843
    Abstract: A package substrate is divided into a plurality of device packages. An adhesive tape is attached to a back side of the substrate by cutting the substrate along a plurality of division lines formed on a front side of the substrate. The substrate includes a device portion partitioned into a plurality of device package regions by the division lines, and a marginal portion surrounding the device portion. A first ultraviolet light is applied to reduce the adhesive force of the adhesive tape in the marginal portion. The adhesive tape is partially peeled from the substrate in the marginal portion, and the substrate is cut along each division line by using a cutting blade to thereby divide the substrate into the device packages. In the dividing step, the marginal portion separated from the substrate is scattered by rotation of the cutting blade and thereby removed from the adhesive tape.
    Type: Application
    Filed: November 11, 2015
    Publication date: May 26, 2016
    Inventors: Hayato Kiuchi, Shigeya Kurimura