Abstract: The work support device stores information indicating a work order for each process, and information indicating a work area of a worker for each work in the process. A processor executes a specifying processing in which a target work to be performed by the worker is specified based on the information indicating the work order, a selection processing in which a target area where the target work specified by the specifying processing to be performed by the worker is selected based on the information indicating the work area, an identification processing in which a work performed by the worker is identified based on image data from a camera that captures an image of the area selected by the selection processing, a determination processing in which whether the worker has deviated from the work order is determined based on an identification result by the identification processing.

Abstract: The work support device stores information indicating a work order for each process, and information indicating a work area of a worker for each work in the process. A processor executes a specifying processing in which a target work to be performed by the worker is specified based on the information indicating the work order, a selection processing in which a target area where the target work specified by the specifying processing to be performed by the worker is selected based on the information indicating the work area, an identification processing in which a work performed by the worker is identified based on image data from a camera that captures an image of the area selected by the selection processing, a determination processing in which whether the worker has deviated from the work order is determined based on an identification result by the identification processing.

Abstract: Provided are: a cooling device that makes it possible to achieve sufficient cooling performance even within a thin electronic device; and an electronic device that is provided with the cooling device. The cooling device is provided with: a heat reception unit that vaporizes a refrigerant; a condensation unit that condenses the vaporized refrigerant and that comprises a vapor tube through which the vaporized refrigerant moves, an inclined section that has inclines in at least two directions, and at least two members that are connected to the inclines; and a liquid tube through which the condensed liquid refrigerant moves.

Abstract: To provide a phase change module as a cooling system capable of saving energy and miniaturizing of the cooling system utilizing a thermo siphon, and an electronic device suitable to mounting such a phase change module. The phase change module 300 includes a jacket case 312 attached with an evaporator surface 311 with the evaporator surface 311 being arranged on a heat generating body, a radiator case 321 attached with cooling fins (radiator) 322 arranged at a position departing from the heat generating body, and a connecting plate 330 that connects the jacket case 312 and the radiator case 321, in which holes are bored in the connecting plate 330 at a position where the jacket case 312 and the radiator case 321 overlap.

Abstract: A cooling structure for electronic equipment includes a plurality of cooling structural members on a same substrate. In the cooling structural members, a plurality of heating components having a same shape are connected to one thermal diffusion part through a first thermal conductive member. Each of thermal diffusion parts of the plurality of cooling structural members is connected to one heat dissipator through a second thermal conductive member.

Abstract: Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.

Abstract: A fan module and server equipment are provided that can achieve a balance between increased airflow and noise reduction when an axial flow fan is mounted in the server equipment. The fan module for taking in and discharging air includes a stator located on an upstream side with respect to airflow and an axial flow fan located on the downstream side. When the fan module is viewed from the rotational-axial direction of the axial flow fan, if a leading edge of a rotor vane constituting part of the axial flow fan passes a trailing edge of a stator vane constituting part of the rotor, a skew is formed in which the leading edge of the rotor vane constantly intersects the leading edge of the rotor vane at a single point.

Abstract: An electronic apparatus rack which can prevent the degradation of cooling performance due to local heat concentration on the exhaust side of the server. The electronic apparatus rack having electronic apparatuses mounted thereon, consists of a radiator incorporated in the rear door of the electronic apparatus rack; plural fans installed on the exhaust side of the radiator; and plural heat pipes installed on the intake side of the radiator.

Abstract: An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

Abstract: A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink.

Abstract: The invention is directed to dual purposes of increasing air volume and reducing noises of an inline axial flow fan. In the inline axial flow fan including a first axial flow fan unit 100-1, a first honeycomb 200-2, a second axial flow fan unit 100-2 and a second honeycomb 200-2 which are arranged in the order starting from an upstream side in an air flow direction, the first honeycomb includes a stator vane configured to be warped in a “U” shape against a rotation direction of the first axial flow fan unit, while the second honeycomb includes a stator vane configured to direct a trailing edge thereof in parallel to the air flow direction.

Abstract: In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.

Abstract: A cooling structure for electronic equipment includes a plurality of cooling structural members on a same substrate. In the cooling structural members, a plurality of heating components having a same shape are connected to one thermal diffusion part through a first thermal conductive member. Each of thermal diffusion parts of the plurality of cooling structural members is connected to one heat dissipator through a second thermal conductive member.

Abstract: Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.

Abstract: A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

Abstract: An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conductin

Abstract: It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

Abstract: In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.

Abstract: A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink.

Abstract: In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.