Patents by Inventor Shigeyoshi FUKUZONO

Shigeyoshi FUKUZONO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component mounting substrate, electronic device, and electronic module
    Patent number: 11004781
    Abstract: An electronic component mounting substrate including: an insulating substrate for mounting an electronic component; a via conductor disposed in the insulating substrate in an thickness direction of the insulating substrate; and a via pad conductor disposed in the insulating substrate, connected to the via conductor, having a thickness gradually increasing from an outer edge portion toward an inside portion, and including a protruding portion protruding from the via conductor in a width direction of the via conductor.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: May 11, 2021
    Assignee: Kyocera Corporation
    Inventors: Shigeyoshi Fukuzono, Yuuki Baba
  • ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    Publication number: 20210066180
    Abstract: An electronic component mounting substrate including: an insulating substrate for mounting an electronic component; a via conductor disposed in the insulating substrate in an thickness direction of the insulating substrate; and a via pad conductor disposed in the insulating substrate, connected to the via conductor, having a thickness gradually increasing from an outer edge portion toward an inside portion, and including a protruding portion protruding from the via conductor in a width direction of the via conductor.
    Type: Application
    Filed: August 24, 2018
    Publication date: March 4, 2021
    Applicant: KYOCERA Corporation
    Inventors: Shigeyoshi FUKUZONO, Yuuki BABA