Patents by Inventor Shigeyuki Honma

Shigeyuki Honma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer polishing device
    Patent number: 6485358
    Abstract: In the wafer polishing device, a retainer ring can be attached and detached with ease. Under a retainer ring attaching part disposed on a head body, a retainer ring is attached with a snap ring. The snap ring is divided into two. An upper projection part and a lower projection part are formed on the inner periphery of the snap ring. The upper projection part is fitted to an upper groove formed on the outer periphery of the retainer ring attaching part, and the lower projection part is fitted to a lower groove formed on the outer periphery of the retainer ring. In attachment, the retainer ring is connected to the lower part of the retainer ring attaching part, and the snap ring is placed on the outer periphery of the joint.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: November 26, 2002
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Minoru Numoto, Shigeyuki Honma
  • Wafer polishing device
    Publication number: 20020049030
    Abstract: In the wafer polishing device, a retainer ring can be attached and detached with ease. Under a retainer ring attaching part disposed on a head body, a retainer ring is attached with a snap ring. The snap ring is divided into two. An upper projection part and a lower projection part are formed on the inner periphery of the snap ring. The upper projection part is fitted to an upper groove formed on the outer periphery of the retainer ring attaching part, and the lower projection part is fitted to a lower groove formed on the outer periphery of the retainer ring. In attachment, the retainer ring is connected to the lower part of the retainer ring attaching part, and the snap ring is placed on the outer periphery of the joint.
    Type: Application
    Filed: October 16, 2001
    Publication date: April 25, 2002
    Inventors: Minoru Numoto, Shigeyuki Honma