Abstract: A high-reliability electronic component without reduction in insulation resistance under high-temperature and high-humidity conditions has satisfactory solderability of external electrodes. The electronic component includes a main body and external electrodes disposed on surfaces of the main body, the external electrodes include underlying electrode layers each containing a metal, alloy layers each disposed on the corresponding underlying electrode layer, Ni plating layers each disposed on the corresponding alloy layer, Ni oxide layers each disposed on the corresponding Ni plating layers, and upper plating layers each disposed on the corresponding Ni oxide layer, each Ni oxide layer having a thickness of about 150 nm or less, and each Ni plating layer having an average particle size of Ni particles of about 2 ?m or more. To form the Ni plating layers having reduced grain boundaries, heat treatment is performed at about 500° C. to about 900° C.

Abstract: The monolithic ceramic electronic component includes a first external electrode 5, a second external electrode 6, and a ceramic sintered compact 4 including internal electrodes 2 and 3, the first and second external electrodes 5 and 6 being disposed on both end faces 4a and 4b of the ceramic sintered compact 4. The first and second external electrodes 5 and 6 have a multilayer structure in which sintered electrode layers 5a and 6a, intermediate electroplated layers 5b and 6b, and plated layers 5c and 6c are arranged in that order. Exposed surface regions 7a of insulating oxides 7 are exposed from the outer faces of the sintered electrode layers 5a and 6a, the oxides 7 being derived from a glass frit contained in the sintered electrode layers. Metals 8 are deposited on the exposed surface regions 7a and the intermediate electroplated layers 5b and 6b are then formed by electroplating.

Abstract: A high-reliability electronic component without reduction in insulation resistance under high-temperature and high-humidity conditions has satisfactory solderability of external electrodes. The electronic component includes a main body and external electrodes disposed on surfaces of the main body, the external electrodes include underlying electrode layers each containing a metal, alloy layers each disposed on the corresponding underlying electrode layer, Ni plating layers each disposed on the corresponding alloy layer, Ni oxide layers each disposed on the corresponding Ni plating layers, and upper plating layers each disposed on the corresponding Ni oxide layer, each Ni oxide layer having a thickness of about 150 nm or less, and each Ni plating layer having an average particle size of Ni particles of about 2 ?m or more. To form the Ni plating layers having reduced grain boundaries, heat treatment is performed at about 500° C. to about 900° C.

Abstract: The monolithic ceramic electronic component includes a first external electrode 5, a second external electrode 6, and a ceramic sintered compact 4 including internal electrodes 2 and 3, the first and second external electrodes 5 and 6 being disposed on both end faces 4a and 4b of the ceramic sintered compact 4. The first and second external electrodes 5 and 6 have a multilayer structure in which sintered electrode layers 5a and 6a, intermediate electroplated layers 5b and 6b, and plated layers 5c and 6c are arranged in that order. Exposed surface regions 7a of insulating oxides 7 are exposed from the outer faces of the sintered electrode layers 5a and 6a, the oxides 7 being derived from a glass frit contained in the sintered electrode layers. Metals 8 are deposited on the exposed surface regions 7a and the intermediate electroplated layers 5b and 6b are then formed by electroplating.

Abstract: A technique for manufacturing electronic parts uses barrel plating to plate films on external electrodes of the electronic parts with small thickness variation of the plated films. The technique comprises disposing a plurality of non-spherical conductive elements in a plating barrel, disposing a plurality of electronic parts in the plating barrel, and rotating the plating barrel to form the plated films on the external electrodes of the electronic parts.

Abstract: A chip type electronic part has an outer electrode structure appropriate mainly for reflow soldering.An outermost layer of the outer electrode, provided at both end portions of the chip type electronic part, is to be soldered and made of a metal having a solidus temperature lower than 183.degree. C. and a difference not smaller than 10.degree. C., or more preferably not smaller than 30.degree. C., between its liquidus temperature and its solidus temperature, and is formed of a plating coat. The above-mentioned arrangement allows reflow soldering for the mounting of the chip type electronic part onto a substrate to be achieved at a low temperature while preventing the harmful influences of high-temperature soldering, and prevents the tombstone phenomenon in the soldering process.