Patents by Inventor Shigeyuki Hoshikawa

Shigeyuki Hoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10103419
    Abstract: The present disclosure enhances flexibility, enables the transmission of power, and improves reliability using a simple, low-cost, easy-to-manufacture configuration by disposing a pair of power supplying lines on the outside in the longitudinal direction of the rectangular cross-section of a dielectric. Here, a waveguide is provided with a solid dielectric, a pair of power supplying lines and an external conductor surrounding the dielectric. The solid dielectric has a rectangular cross-section. The pair of power supplying lines are disposed on the outside in the longitudinal direction of the cross-section of the dielectric. The outer surface of the dielectric is slidably in close contact with the inner surface of the external conductor.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: October 16, 2018
    Assignee: Molex, LLC
    Inventors: Takeshi Tsukahara, Shigeyuki Hoshikawa, Mio Tanaka
  • Patent number: 9985332
    Abstract: The waveguide is composed of a solid dielectric, and an outer conductor covering the periphery of the dielectric, the transverse section of the dielectric being rectangular and having a shape bulging outward on the pair of long sides, and the inner surface of the outer conductor adhering closely to the outer surface of the dielectric.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: May 29, 2018
    Assignee: Molex, LLC
    Inventors: Takeshi Tsukahara, Shigeyuki Hoshikawa, Mikiji Tanaka, Mio Tanaka
  • Publication number: 20170201000
    Abstract: The present disclosure enhances flexibility, enables the transmission of power, and improves reliability using a simple, low-cost, easy-to-manufacture configuration by disposing a pair of power supplying lines on the outside in the longitudinal direction of the rectangular cross-section of a dielectric. Here, a waveguide is provided with a solid dielectric, a pair of power supplying lines and an external conductor surrounding the dielectric. The solid dielectric has a rectangular cross-section. The pair of power supplying lines are disposed on the outside in the longitudinal direction of the cross-section of the dielectric. The outer surface of the dielectric is slidably in close contact with the inner surface of the external conductor.
    Type: Application
    Filed: May 26, 2015
    Publication date: July 13, 2017
    Applicant: Molex, LLC
    Inventors: Takeshi TSUKAHARA, Shigeyuki HOSHIKAWA, Mio TANAKA
  • Publication number: 20160351986
    Abstract: The waveguide is composed of a solid dielectric, and an outer conductor covering the periphery of the dielectric, the transverse section of the dielectric being rectangular and having a shape bulging outward on the pair of long sides, and the inner surface of the outer conductor adhering closely to the outer surface of the dielectric.
    Type: Application
    Filed: February 2, 2015
    Publication date: December 1, 2016
    Applicant: Molex, LLC
    Inventors: Takeshi TSUKAHARA, Shigeyuki HOSHIKAWA, Mikiji TANAKA, Mio TANAKA
  • Patent number: 9444194
    Abstract: A connector with a sheet has a housing mated with another connector, a terminal secured to the housing and contacting another terminal on the other connector, and a sheet affixed to the housing. The sheet has a laminate structure which includes a soft magnetic layer having real parts of complex relative permeability at 100 MHz of from 20 to 45, and a conductive/dielectric layer having an electrical resistance of from 0.5 to 20 ?·cm.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: September 13, 2016
    Assignees: MOLEX, LLC, TODA KOGYO CORP.
    Inventors: Mikiji Tanaka, Hideki Hozono, Mari Niita, Shigeyuki Hoshikawa, Kazumi Yamamoto
  • Patent number: 7833043
    Abstract: A socket connector configured such that elongated guide holes are formed in the housing so as to receive guide members of a device to be connected, and a slide member is attached to the housing to be slidable in the longitudinal direction of the elongated guide holes so as to restrict the guide members to their initial positions. The socket enables direct placement of the device on the housing, can shorten the projection length of projection terminals of the device, can facilitate positioning of the device to thereby enhance the easiness of attachment operation, can prevent bending of the projection terminals, can cope with an increase in density of the projection terminals, and has a simple structure.
    Type: Grant
    Filed: August 2, 2006
    Date of Patent: November 16, 2010
    Assignee: Molex Incorporated
    Inventors: Shigeyuki Hoshikawa, Atsuhito Noda
  • Patent number: 7802992
    Abstract: Rotary electrical connector comprising a ring-shaped outside terminal having a circular inner circumference portion, a ring-shaped inside terminal having a circular outer circumference portion, which is concentric with the inner circumference portion of the ring-shaped outside terminal; and a rotatable ring-shaped connection terminal electrically connecting the outside terminal with the inside terminal; wherein the connection terminal elastically deforms along a radial direction thereof, an outer circumference portion of the connection terminal abutting the inner circumference portion of the outside terminal and the outer circumference portion of the inside terminal.
    Type: Grant
    Filed: November 15, 2006
    Date of Patent: September 28, 2010
    Assignee: Molex Incorporated
    Inventors: Toshihiro Niitsu, Shigeyuki Hoshikawa, Kimiyasu Makino
  • Publication number: 20090246976
    Abstract: Rotary electrical connector comprising a ring-shaped outside terminal having a circular inner circumference portion, a ring-shaped inside terminal having a circular outer circumference portion, which is concentric with the inner circumference portion of the ring-shaped outside terminal; and a rotatable ring-shaped connection terminal electrically connecting the outside terminal with the inside terminal; wherein the connection terminal elastically deforms along a radial direction thereof, an outer circumference portion of the connection terminal abuting the inner circumference portion of the outside terminal and the outer circumference portion of the inside terminal.
    Type: Application
    Filed: November 15, 2006
    Publication date: October 1, 2009
    Applicant: Molex Incorporated
    Inventors: Toshihiro Niitsu, Shigeyuki Hoshikawa, Kimiyasu Makino
  • Patent number: 7284991
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is formed to have at least one protuberance on the a ring's exterior surface. The protuberance has an apex or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: October 23, 2007
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Shigeyuki Hoshikawa, Hiroshi Ikeda
  • Patent number: 7273380
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: September 25, 2007
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Patent number: 7229291
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: June 12, 2007
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Publication number: 20070123067
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Application
    Filed: January 25, 2007
    Publication date: May 31, 2007
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Patent number: 7189079
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: March 13, 2007
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Publication number: 20060030169
    Abstract: A sheet type connector has an insulation sheet and a plurality of conductive contacts provided on the sheet in an array of “M” rows and “N” columns. A plurality of conductive contacts are successively stamped and formed in a metal sheet and are disposed on a belt-like insulation sheet in an array of “m” rows and “n” columns to produce an intermediate sheet, where “m” is an integer greater than “M” and “n” is an integer greater than “N”. Thereafter, said intermediate sheet is cut into such size that the conductive contacts in “M” rows by “N” columns are included.
    Type: Application
    Filed: April 8, 2005
    Publication date: February 9, 2006
    Inventors: Atsuhito Noda, Shigeyuki Hoshikawa
  • Publication number: 20050277309
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is formed to have at least one protuberance on the a ring's exterior surface. The protuberance has an apex or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 15, 2005
    Inventors: Atsuhito Noda, Shigeyuki Hoshikawa, Hiroshi Ikeda
  • Publication number: 20050266703
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 1, 2005
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Publication number: 20050266702
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 1, 2005
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Patent number: 6722928
    Abstract: An improved press-fit pin having an elastically deformable area 6 to be press-fitted in a selected through hole in a printed circuit board, the elastically deformable area 6 comprising two parallel, opposite beams 8 connected by an connecting deformable bridge 9, thereby permitting the outer corners 8a of each beam 8 to engage the inner wall of the plated through hole while permitting the connecting deformable bridge 9 to be deformed. The connecting deformable bridge 9 comprises, in cross-section, an connecting flat section 10 extending perpendicular to the opposite beams 8, and two oblique sections 11 extending outward from the opposite ends of the upper flat 10a of the connecting flat section 10 to be contiguous to the opposite beams 8. The press-fit pin has a connecting flat section in its pressure-deformable area in place of the “V”-shaped area of a conventional press-fit pin, thus eliminating the necessity of forming acute angles in the die-and-punch.
    Type: Grant
    Filed: August 27, 1997
    Date of Patent: April 20, 2004
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Shigeyuki Hoshikawa
  • Patent number: 6559377
    Abstract: A flexible printed circuitry member includes an elongated flexible insulating substrate with a plurality of signal conductors extending longitudinally along one side of the substrate. A grounding grid having a substantially random geometric pattern is disposed on the opposite side of the substrate.
    Type: Grant
    Filed: September 17, 1997
    Date of Patent: May 6, 2003
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Shigeyuki Hoshikawa, Shigeru Ando
  • Patent number: 6007381
    Abstract: A shielded circuit board connector has an interior insulative connector housing with conductive terminals supported thereon. An exterior metal shell is fitted over the connector housing and partially encloses the connector housing and its associated terminals as well as partially defines a mating end of the connector for accommodating an opposing connector. The exterior shell includes a formed metal piece that has a top wall, two opposing sidewalls and two engaging bottom wall portions. A rear wall is formed with the top wall and is bent therefrom to cover the rear part of the connector housing, The rear wall of the exterior shell further includes two side wings that overlie the sidewalls of the shell when the shell is applied to a connector housing. Two pairs of mounting legs are formed on the shell for securely mounting the connector to a circuit board.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: December 28, 1999
    Assignee: Molex Incorporated
    Inventors: Shigeru Ando, Atsuhito Noda, Shigeyuki Hoshikawa