Patents by Inventor Shigeyuki Hoshikawa
Shigeyuki Hoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10103419Abstract: The present disclosure enhances flexibility, enables the transmission of power, and improves reliability using a simple, low-cost, easy-to-manufacture configuration by disposing a pair of power supplying lines on the outside in the longitudinal direction of the rectangular cross-section of a dielectric. Here, a waveguide is provided with a solid dielectric, a pair of power supplying lines and an external conductor surrounding the dielectric. The solid dielectric has a rectangular cross-section. The pair of power supplying lines are disposed on the outside in the longitudinal direction of the cross-section of the dielectric. The outer surface of the dielectric is slidably in close contact with the inner surface of the external conductor.Type: GrantFiled: May 26, 2015Date of Patent: October 16, 2018Assignee: Molex, LLCInventors: Takeshi Tsukahara, Shigeyuki Hoshikawa, Mio Tanaka
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Patent number: 9985332Abstract: The waveguide is composed of a solid dielectric, and an outer conductor covering the periphery of the dielectric, the transverse section of the dielectric being rectangular and having a shape bulging outward on the pair of long sides, and the inner surface of the outer conductor adhering closely to the outer surface of the dielectric.Type: GrantFiled: February 2, 2015Date of Patent: May 29, 2018Assignee: Molex, LLCInventors: Takeshi Tsukahara, Shigeyuki Hoshikawa, Mikiji Tanaka, Mio Tanaka
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Publication number: 20170201000Abstract: The present disclosure enhances flexibility, enables the transmission of power, and improves reliability using a simple, low-cost, easy-to-manufacture configuration by disposing a pair of power supplying lines on the outside in the longitudinal direction of the rectangular cross-section of a dielectric. Here, a waveguide is provided with a solid dielectric, a pair of power supplying lines and an external conductor surrounding the dielectric. The solid dielectric has a rectangular cross-section. The pair of power supplying lines are disposed on the outside in the longitudinal direction of the cross-section of the dielectric. The outer surface of the dielectric is slidably in close contact with the inner surface of the external conductor.Type: ApplicationFiled: May 26, 2015Publication date: July 13, 2017Applicant: Molex, LLCInventors: Takeshi TSUKAHARA, Shigeyuki HOSHIKAWA, Mio TANAKA
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Publication number: 20160351986Abstract: The waveguide is composed of a solid dielectric, and an outer conductor covering the periphery of the dielectric, the transverse section of the dielectric being rectangular and having a shape bulging outward on the pair of long sides, and the inner surface of the outer conductor adhering closely to the outer surface of the dielectric.Type: ApplicationFiled: February 2, 2015Publication date: December 1, 2016Applicant: Molex, LLCInventors: Takeshi TSUKAHARA, Shigeyuki HOSHIKAWA, Mikiji TANAKA, Mio TANAKA
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Patent number: 9444194Abstract: A connector with a sheet has a housing mated with another connector, a terminal secured to the housing and contacting another terminal on the other connector, and a sheet affixed to the housing. The sheet has a laminate structure which includes a soft magnetic layer having real parts of complex relative permeability at 100 MHz of from 20 to 45, and a conductive/dielectric layer having an electrical resistance of from 0.5 to 20 ?·cm.Type: GrantFiled: March 28, 2013Date of Patent: September 13, 2016Assignees: MOLEX, LLC, TODA KOGYO CORP.Inventors: Mikiji Tanaka, Hideki Hozono, Mari Niita, Shigeyuki Hoshikawa, Kazumi Yamamoto
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Patent number: 7833043Abstract: A socket connector configured such that elongated guide holes are formed in the housing so as to receive guide members of a device to be connected, and a slide member is attached to the housing to be slidable in the longitudinal direction of the elongated guide holes so as to restrict the guide members to their initial positions. The socket enables direct placement of the device on the housing, can shorten the projection length of projection terminals of the device, can facilitate positioning of the device to thereby enhance the easiness of attachment operation, can prevent bending of the projection terminals, can cope with an increase in density of the projection terminals, and has a simple structure.Type: GrantFiled: August 2, 2006Date of Patent: November 16, 2010Assignee: Molex IncorporatedInventors: Shigeyuki Hoshikawa, Atsuhito Noda
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Patent number: 7802992Abstract: Rotary electrical connector comprising a ring-shaped outside terminal having a circular inner circumference portion, a ring-shaped inside terminal having a circular outer circumference portion, which is concentric with the inner circumference portion of the ring-shaped outside terminal; and a rotatable ring-shaped connection terminal electrically connecting the outside terminal with the inside terminal; wherein the connection terminal elastically deforms along a radial direction thereof, an outer circumference portion of the connection terminal abutting the inner circumference portion of the outside terminal and the outer circumference portion of the inside terminal.Type: GrantFiled: November 15, 2006Date of Patent: September 28, 2010Assignee: Molex IncorporatedInventors: Toshihiro Niitsu, Shigeyuki Hoshikawa, Kimiyasu Makino
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Publication number: 20090246976Abstract: Rotary electrical connector comprising a ring-shaped outside terminal having a circular inner circumference portion, a ring-shaped inside terminal having a circular outer circumference portion, which is concentric with the inner circumference portion of the ring-shaped outside terminal; and a rotatable ring-shaped connection terminal electrically connecting the outside terminal with the inside terminal; wherein the connection terminal elastically deforms along a radial direction thereof, an outer circumference portion of the connection terminal abuting the inner circumference portion of the outside terminal and the outer circumference portion of the inside terminal.Type: ApplicationFiled: November 15, 2006Publication date: October 1, 2009Applicant: Molex IncorporatedInventors: Toshihiro Niitsu, Shigeyuki Hoshikawa, Kimiyasu Makino
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Patent number: 7284991Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is formed to have at least one protuberance on the a ring's exterior surface. The protuberance has an apex or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.Type: GrantFiled: May 27, 2005Date of Patent: October 23, 2007Assignee: Molex IncorporatedInventors: Atsuhito Noda, Shigeyuki Hoshikawa, Hiroshi Ikeda
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Patent number: 7273380Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.Type: GrantFiled: January 25, 2007Date of Patent: September 25, 2007Assignee: Molex IncorporatedInventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
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Patent number: 7229291Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.Type: GrantFiled: May 27, 2005Date of Patent: June 12, 2007Assignee: Molex IncorporatedInventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
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Publication number: 20070123067Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.Type: ApplicationFiled: January 25, 2007Publication date: May 31, 2007Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
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Patent number: 7189079Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.Type: GrantFiled: May 27, 2005Date of Patent: March 13, 2007Assignee: Molex IncorporatedInventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
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Publication number: 20060030169Abstract: A sheet type connector has an insulation sheet and a plurality of conductive contacts provided on the sheet in an array of “M” rows and “N” columns. A plurality of conductive contacts are successively stamped and formed in a metal sheet and are disposed on a belt-like insulation sheet in an array of “m” rows and “n” columns to produce an intermediate sheet, where “m” is an integer greater than “M” and “n” is an integer greater than “N”. Thereafter, said intermediate sheet is cut into such size that the conductive contacts in “M” rows by “N” columns are included.Type: ApplicationFiled: April 8, 2005Publication date: February 9, 2006Inventors: Atsuhito Noda, Shigeyuki Hoshikawa
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Publication number: 20050277309Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is formed to have at least one protuberance on the a ring's exterior surface. The protuberance has an apex or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.Type: ApplicationFiled: May 27, 2005Publication date: December 15, 2005Inventors: Atsuhito Noda, Shigeyuki Hoshikawa, Hiroshi Ikeda
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Publication number: 20050266703Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.Type: ApplicationFiled: May 27, 2005Publication date: December 1, 2005Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
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Publication number: 20050266702Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.Type: ApplicationFiled: May 27, 2005Publication date: December 1, 2005Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
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Patent number: 6722928Abstract: An improved press-fit pin having an elastically deformable area 6 to be press-fitted in a selected through hole in a printed circuit board, the elastically deformable area 6 comprising two parallel, opposite beams 8 connected by an connecting deformable bridge 9, thereby permitting the outer corners 8a of each beam 8 to engage the inner wall of the plated through hole while permitting the connecting deformable bridge 9 to be deformed. The connecting deformable bridge 9 comprises, in cross-section, an connecting flat section 10 extending perpendicular to the opposite beams 8, and two oblique sections 11 extending outward from the opposite ends of the upper flat 10a of the connecting flat section 10 to be contiguous to the opposite beams 8. The press-fit pin has a connecting flat section in its pressure-deformable area in place of the “V”-shaped area of a conventional press-fit pin, thus eliminating the necessity of forming acute angles in the die-and-punch.Type: GrantFiled: August 27, 1997Date of Patent: April 20, 2004Assignee: Molex IncorporatedInventors: Atsuhito Noda, Shigeyuki Hoshikawa
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Patent number: 6559377Abstract: A flexible printed circuitry member includes an elongated flexible insulating substrate with a plurality of signal conductors extending longitudinally along one side of the substrate. A grounding grid having a substantially random geometric pattern is disposed on the opposite side of the substrate.Type: GrantFiled: September 17, 1997Date of Patent: May 6, 2003Assignee: Molex IncorporatedInventors: Atsuhito Noda, Shigeyuki Hoshikawa, Shigeru Ando
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Patent number: 6007381Abstract: A shielded circuit board connector has an interior insulative connector housing with conductive terminals supported thereon. An exterior metal shell is fitted over the connector housing and partially encloses the connector housing and its associated terminals as well as partially defines a mating end of the connector for accommodating an opposing connector. The exterior shell includes a formed metal piece that has a top wall, two opposing sidewalls and two engaging bottom wall portions. A rear wall is formed with the top wall and is bent therefrom to cover the rear part of the connector housing, The rear wall of the exterior shell further includes two side wings that overlie the sidewalls of the shell when the shell is applied to a connector housing. Two pairs of mounting legs are formed on the shell for securely mounting the connector to a circuit board.Type: GrantFiled: April 22, 1998Date of Patent: December 28, 1999Assignee: Molex IncorporatedInventors: Shigeru Ando, Atsuhito Noda, Shigeyuki Hoshikawa