Patents by Inventor Shigeyuki Kouchiyama

Shigeyuki Kouchiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rubber-modified phenolic resin composition and method of manufacturing the same
    Patent number: 5216077
    Abstract: A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.
    Type: Grant
    Filed: April 27, 1992
    Date of Patent: June 1, 1993
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Chemical Corporation
    Inventors: Akira Yoshizumi, Shinetsu Fujieda, Ken Uchida, Naoko Kihara, Kazuhiro Sawai, Tsutomu Nagata, Shinji Murakami, Shigeyuki Kouchiyama
  • Rubber-modified phenolic resin composition and method of manufacturing the same
    Patent number: 4916174
    Abstract: A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.
    Type: Grant
    Filed: September 13, 1988
    Date of Patent: April 10, 1990
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Chemical Corporation
    Inventors: Akira Yoshizumi, Shinetsu Fujieda, Ken Uchida, Naoko Kihara, Kazuhiro Sawai, Tsutomu Nagata, Shinji Murakami, Shigeyuki Kouchiyama